Isixazululo Esihlanganisiwe Sokumboza Imbewu ye-SiC–Bonding–Sintering

Incazelo emfushane:

Guqula ukubopha imbewu ye-SiC kusuka emsebenzini oxhomeke kumqhubi kube inqubo ephindaphindwayo, eqhutshwa yipharamitha: ukujiya kwengqimba yokunamathela okulawulwayo, ukulungiswa okuphakathi nokucindezela isikhwama somoya, ukususa i-vacuum, kanye nokuhlanganiswa kwe-carbonization okulungiswayo ngokushisa/ingcindezi. Yakhelwe izimo zokukhiqiza ezingamasentimitha angu-6/8/12.

Sithumelele i-imeyili

Izici

Umdwebo Oningiliziwe

I-SiC 晶体生长炉 I-SiC Crystal Growth Furnace I-SiC Seed Coating–Bonding-Sintering Integrated Solution

Umshini Wokumboza we-SiC Isixazululo Esihlanganisiwe Sokumboza Imbewu ye-SiC–Bonding–Sintering

Isimbozo Sokufafaza Okunembile • Ukubopha Ukuqondanisa Okuphakathi • Ukususa Ukungcola Kwe-Vacuum • Ukuhlanganiswa Kwe-Carbonization/Sintering

Ukubuka Konke Komkhiqizo

Kuyini

Lesi sixazululo esihlanganisiwe senzelwe isinyathelo esikhuphukayo sokukhula kwekristalu ye-SiC lapho imbewu/i-wafer ihlanganiswa ne-graphite paper/graphite plate (kanye ne-interfaces ezihlobene). Sivala i-process loop enqamula:

Ukumboza (ukunamathela ngesifutho) → Ukubopha (ukuqondanisa + ukucindezela + ukususa amagwebu nge-vacuum) → Ukuhlanza/Ukufaka i-carbonization (ukuhlanganisa nokulungisa)

Ngokulawula ukwakheka kwe-glue, ukususwa kwamabhamuza, kanye nokuhlanganiswa kokugcina njengeketanga elilodwa, ikhambi lithuthukisa ukuhambisana, ukukhiqizwa, kanye nokukhula.

Isixazululo Esihlanganisiwe Sokumboza Imbewu ye-SiC–Bonding–Sintering 1

Izinketho Zokucushwa

A. Umugqa ozenzakalelayo kancane
Umshini Wokumboza we-SiC Spray → Umshini Wokubopha we-SiC → Isithando Somlilo Sokuthungela se-SiC

B. Umugqa ozenzakalelayo ngokugcwele
Umshini Wokumboza Nokubopha Okuzenzakalelayo → Isithando Sokushisa Se-SiC
Ukuhlanganiswa okungakhethwa: ukuphathwa kwerobhothi, ukulinganisa/ukuqondanisa, ukufundwa kwe-ID, ukutholwa kwamabhamuza

Isixazululo Esihlanganisiwe Sokumboza Imbewu ye-SiC–Bonding–Sintering 2

Izinzuzo Eziyinhloko

• Ubukhulu kanye nokumbozwa kwesendlalelo esinamathelayo okulawulwayo ukuze kube ngcono ukuphindaphindeka
• Ukuqondanisa phakathi nendawo kanye nokucindezela isikhwama somoya ukuze kuhlangane njalo futhi kusatshalaliswe ingcindezi
• Ukususa amagwebu nge-vacuum ukuze kuncishiswe amagwebu/ama-voids ngaphakathi kwengqimba yokunamathela
• Ukuhlanganiswa kwe-carbonization yokushisa/ingcindezi okulungisekayo ukuze kuqiniswe isibopho sokugcina
• Izinketho zokwenza ngokuzenzakalelayo zesikhathi somjikelezo esizinzile, ukulandelelwa, kanye nokulawulwa kwekhwalithi okusemgqeni

Isimiso

Kungani izindlela zendabuko zinzima
Ukusebenza kokubopha imbewu ngokuvamile kunqunyelwe yiziguquguquko ezintathu ezixhunyiwe:

Ukungaguquguquki kwesendlalelo esinamathelayo (ukujiya kanye nokufana)
Ukulawula amabhamuza/ize (umoya uvaleleke kungqimba lokunamathela)
Ukuqina kwesibopho ngemuva kokuqina/ukwakheka kwe-carbonization

Ukwembozwa ngesandla kuvame ukuholela ekungahambelani kobukhulu, ukuxazulula inkinga enzima, ingozi ephezulu yokungabi nalutho kwangaphakathi, ukuklwebheka okungenzeka kwezindawo ze-graphite, kanye nokungakhuli kahle ukuze kukhiqizwe ngobuningi.

Ukwembozwa kwe-spin kungadala ukujiya okungazinzile ngenxa yokuziphatha kokugeleza kwe-glue, ukucindezeleka kobuso, kanye namandla e-centrifugal. Kungase futhi kubhekane nokungcola ohlangothini kanye nemingcele yokubopha ephepheni/amapuleti e-graphite, futhi kungaba nzima ngama-glue anokuqukethwe okuqinile ukumboza ngokulinganayo.

Isixazululo Esihlanganisiwe Sokumboza Imbewu ye-SiC–Bonding–Sintering 3

Indlela ehlanganisiwe esebenza ngayo

Ukwemboza: Ukwemboza okufuthwayo kwakha ukujiya kwengqimba yokunamathela elawuleka kalula kanye nokumboza ezindaweni eziqondiwe (imbewu/i-wafer, iphepha le-graphite/ipuleti).

Ukubopha: Ukuqondanisa phakathi nendawo + ukucindezela isikhwama somoya kusekela ukuxhumana okuqhubekayo; ukususa i-vacuum cleaner kunciphisa umoya ovalelekile, amabhamuza, kanye nezimbobo engqimbeni yokunamathela.

Ukushisa/Ukwenza I-Carbonization: Ukuhlanganiswa kwezinga lokushisa eliphezulu kanye nokushisa okulungisekayo kanye nokucindezela kuzinzisa isikhombikubona sokugcina esihlanganisiwe, kuhlose imiphumela yokucindezela engenamabhamuza kanye neyokucindezela efanayo.

Isitatimende sokusebenza esibhekiselayo
Isivuno sokubopha se-carbonization singafinyelela ku-90%+ (ireferensi yenqubo). Izinkomba ezijwayelekile zokubopha zibhalwe esigabeni se-Classic Cases.

Inqubo

A. Ukuhamba Komsebenzi Okuzenzakalelayo Kancane

Isinyathelo 1 — Ukufaka Isifutho (Ukufaka Isifutho)
Faka inhlaka nge-spray coating ezindaweni eziqondiwe ukuze ufinyelele ukujiya okuzinzile kanye nokumbozwa okufanayo.

Isinyathelo 2 — Ukuqondanisa Nokuhlanganisa (Ukuhlanganisa)
Yenza ukuqondisa okuphakathi, sebenzisa ukucindezela kwe-airbag, bese usebenzisa i-vacuum debubbling ukuze ususe umoya ovalelekile kungqimba lokunamathela.

Isinyathelo 3 — Ukuhlanganiswa Kwe-Carbonization (Ukusikwa Kwe-Sintering/Ukusikwa Kwe-Carbon)
Dlulisa izingxenye eziboshiwe esithandweni esishisayo bese usebenzisa ukuhlanganiswa kwe-carbonization yokushisa okuphezulu ngokushisa okulungisekayo kanye nengcindezi ukuze uzinzise isibopho sokugcina.

B. Ukuhamba Komsebenzi Okuzenzakalelayo Ngokugcwele

Umshini wokufutha ozenzakalelayo kanye nomshini wokubopha uhlanganisa izenzo zokubopha kanye nokubopha futhi ungafaka ukuphathwa kwerobhothi kanye nokulinganisa. Izinketho eziku-inthanethi zingafaka ukufundwa kwe-ID kanye nokutholwa kwamabhamuza ukuze kulandeleke futhi kulawulwe ikhwalithi. Izingxenye bese ziqhubekela esithandweni sokushisa ukuze kuhlanganiswe i-carbonization.

Ukuguquguquka komzila wenqubo
Kuye ngezinto ezisetshenziswayo kanye nomkhuba okhethwayo, uhlelo lungasekela ukulandelana okuhlukene kokumboza kanye nemizila yokufafaza ohlangothini olulodwa noma oluphindwe kabili ngenkathi lugcina umgomo ofanayo: ungqimba olunamathelayo oluzinzile → ukulungisa amaphutha ngempumelelo → ukuhlanganiswa okufanayo.

Isixazululo Esihlanganisiwe Sokumboza Imbewu ye-SiC–Bonding–Sintering 4

Izicelo

Uhlelo lokusebenza oluyinhloko
Ukuhlanganiswa kwembewu okukhuphukayo kwe-SiC crystal: ukuhlanganiswa kwembewu/i-wafer ephepheni le-graphite/ipuleti le-graphite kanye nezixhumi ezihlobene, kulandelwe ukuhlanganiswa kwe-carbonization.

Izimo zosayizi
Isekela izinhlelo zokusebenza zokubopha ezingama-intshi angu-6/8/12 ngokukhetha ukucushwa kanye nokuqondisa inqubo okuqinisekisiwe.

Izinkomba ezijwayelekile zokulingana
• Ukugqoka ngesandla kubangela ukuguquguquka kobukhulu, amabhamuza/ama-voids, imihuzuko, kanye nokuguquguquka okungalingani
• Ubukhulu be-spin coating abuzinzile noma bunzima ephepheni/emapuletini e-graphite; kukhona imikhawulo yokungcola/yokufaka eceleni
• Udinga ukukhiqizwa okukhuliswayo okunokuphindaphinda okuqinile kanye nokuthembela okuphansi komqhubi
• Ufuna ukuzenzekela, ukulandeleka, kanye nezinketho ze-QC eziku-inthanethi (ukutholwa kwe-ID + ibhamuza)

Amacala Ajwayelekile (Imiphumela Ejwayelekile)

Qaphela: Lokhu okulandelayo kuyizinkomba zedatha/izinqubo ezijwayelekile. Ukusebenza kwangempela kuncike ohlelweni lokunamathela, izimo zezinto ezingenayo, iwindi lenqubo eliqinisekisiwe, kanye nezindinganiso zokuhlola.

Ikesi 1 — Ukubopha Imbewu okungu-6/8-intshi (Inkomba Yokugeleza Nokukhushulwa)
Akukho plate ye-graphite: 6 ama-pcs/iyunithi/ngosuku
Ngepuleti le-graphite: 2.5 pcs/iyunithi/ngosuku
Isivuno sokubopha: ≥95%

Ikesi 2 — Ukubopha Imbewu Okuyi-intshi eziyi-12 (Inkomba Yokugeleza Nokukhushulwa)
Akukho plate ye-graphite: 5 ama-pcs/iyunithi/ngosuku
Ngepuleti le-graphite: 2 ama-pcs/iyunithi/ngosuku
Isivuno sokubopha: ≥95%

Icala 3 — Inkomba Yesivuno Sokuhlanganiswa Kwekhabhoni
Isivuno sokubopha i-carbonization: 90%+ (ireferensi yenqubo)
Umphumela oqondiwe: imiphumela yokucindezela engenamabhamuza kanye neyokucindezela okufanayo (kuncike ezimisweni zokuqinisekisa nezokuhlola)

Isixazululo Esihlanganisiwe Sokumboza Imbewu ye-SiC–Bonding–Sintering 5

Imibuzo Evame Ukubuzwa

Umbuzo 1: Iyini inkinga eyinhloko exazululwa yilesi sixazululo?
A: Kuqinisa ukubopha kwembewu ngokulawula ukujiya/ukumbozwa kwe-glue, ukusebenza kokulungisa ama-blebb, kanye nokuhlanganiswa kwe-post-bond—ukuguqula isinyathelo esincike emakhono sibe inqubo yokukhiqiza ephindaphindwayo.

Umbuzo 2: Kungani ukumbozwa ngesandla kuvame ukuholela kumabhamuza/ama-voids?
A: Izindlela ezenziwe ngesandla ziyahluleka ukugcina ukujiya okuhambisanayo, okwenza ukulungisa ama-blend kube nzima futhi kwandise ingozi yomoya ovalelekile. Zingase futhi ziklwebhe izindawo ze-graphite futhi kunzima ukuzilinganisa ngevolumu.

Q3: Kungani i-spin coating ingazinzi kulolu hlelo lokusebenza?
A: Ubukhulu buzwa ekuziphatheni kokunamathela, ukucindezeleka kobuso, kanye namandla e-centrifugal. Ukwembozwa kwephepha/ipuleti le-graphite kungavinjelwa yi-fixturing kanye nengozi yokungcola eceleni, kanti izinamathiseli ezinokuqukethwe okuqinile kungaba nzima ukuzisonta ngokulinganayo.

Mayelana NATHI

I-XKH igxile ekuthuthukisweni kobuchwepheshe obuphezulu, ekukhiqizweni, nasekuthengisweni kwengilazi ekhethekile ye-optical kanye nezinto ezintsha zekristalu. Imikhiqizo yethu ihlinzeka nge-optical electronics, i-consumer electronics, kanye nezempi. Sinikeza izingxenye ze-optical ze-Sapphire, izembozo zelensi yeselula, i-Ceramics, i-LT, i-Silicon Carbide SIC, i-Quartz, kanye nama-semiconductor crystal wafers. Ngobuchwepheshe obunekhono kanye nemishini esezingeni eliphezulu, sihamba phambili ekucutshungulweni komkhiqizo okungewona ojwayelekile, sihlose ukuba yibhizinisi elihamba phambili lezinto ze-optoelectronic tech.