I-Subrate ye-Sapphire Wafer Carrier engu-8 intshi engu-200mm 1SP 2SP 0.5mm 0.75mm

I-Subrate ye-Sapphire Wafer Carrier engu-8 intshi engu-200mm engu-1SP 2SP 0.5mm 0.75mm Isithombe Esivelele

Incazelo emfushane:

I-wafer ye-sapphire substrate engamasentimitha angu-8 iyinto yekristalu esezingeni eliphezulu nehlala isikhathi eside esetshenziswa ezinhlotsheni ezahlukene zokusebenza. Yaziwa ngokuqina kwayo kokushisa kanye namakhemikhali, kanye nokubonakala kwayo okuphezulu kokukhanya.

Sithumelele i-imeyili

Izici

Indlela Yokukhiqiza

Inqubo yokukhiqiza i-substrate ye-sapphire engamasentimitha angu-8 ihilela izinyathelo eziningana. Okokuqala, i-alumina powder ehlanzekile kakhulu iyancibilikiswa ekushiseni okuphezulu ukuze yakhe isimo esincibilikisiwe. Ngemuva kwalokho, i-seed crystal ifakwa ekuncibilikeni, okuvumela i-sapphire ukuba ikhule njengoba imbewu ihoxa kancane kancane. Ngemva kokukhula ngokwanele, i-sapphire crystal isikwa ngokucophelela ibe ama-wafer amancane, abese epholishwa ukuze kufezwe ubuso obubushelelezi nobungenasici.

Ukusetshenziswa kwe-substrate ye-sapphire engamasentimitha angu-8: I-substrate ye-sapphire engamasentimitha angu-8 isetshenziswa kabanzi embonini ye-semiconductor, ikakhulukazi ekukhiqizweni kwamadivayisi kagesi kanye nezingxenye ze-optoelectronic. Isebenza njengesisekelo esibalulekile sokukhula kwe-epitaxial kwama-semiconductor, okuvumela ukwakheka kwamasekethe ahlanganisiwe asebenza kahle kakhulu, ama-diode akhipha ukukhanya (ama-LED), kanye nama-diode e-laser. I-substrate ye-sapphire ithola nezinhlelo zokusebenza ekukhiqizweni kwamafasitela abonakalayo, ubuso bewashi, kanye nezembozo zokuvikela zama-smartphone namathebulethi.

Imininingwane yomkhiqizo we-substrate ye-sapphire engu-8-intshi

- Usayizi: I-substrate yesafire engamasentimitha angu-8 inobubanzi obungu-200mm, enikeza indawo enkulu yokubeka ama-epitaxial layers.

- Ikhwalithi Yomphezulu: Umphezulu we-substrate upholishwe ngokucophelela ukuze kufezwe ikhwalithi ephezulu yokukhanya, enobulukhuni bomphezulu obungaphansi kuka-0.5 nm RMS.

- Ubukhulu: Ubukhulu obujwayelekile be-substrate bungu-0.5 mm. Kodwa-ke, izinketho zobukhulu ezenziwe ngokwezifiso ziyatholakala uma ucela.

- Ukupakishwa: Izingcezu zesafire zipakishwa ngazinye ukuqinisekisa ukuvikeleka ngesikhathi sokuthuthwa nokugcinwa. Ngokuvamile zifakwa emathileyi noma emabhokisini akhethekile, ngezinto ezifanele zokubopha ukuze kuvinjelwe noma yimuphi umonakalo.

- Ukuqondiswa Komphetho: I-substrate iza nokuqondiswa komphetho okucacisiwe, okubalulekile ekuhleleni okunembile ngesikhathi sezinqubo zokukhiqiza ze-semiconductor.

Ekuphetheni, i-substrate ye-sapphire engamasentimitha angu-8 iyinto eguquguqukayo futhi ethembekile, esetshenziswa kabanzi embonini ye-semiconductor ngenxa yezakhiwo zayo ezishisayo, zamakhemikhali, nezokukhanya ezihlukile. Ngekhwalithi yayo ephezulu kanye nemininingwane eqondile, isebenza njengengxenye ebalulekile ekukhiqizweni kwamadivayisi kagesi kanye ne-optoelectronic asebenza kahle kakhulu.