I-12inch Sapphire Wafer C-Plane SSP/DSP

12inch Sapphire Wafer C-Plane SSP/DSP Isithombe Esifakiwe

Incazelo emfushane:

Impela ama-wafer angu-12-intshi wesafire awuhlobo lwe-substrate esetshenziswa embonini ye-semiconductor.Lawa mawafa enziwe ngesafire yekristalu eyodwa, okuwuhlobo lwecrystalline lwe-aluminum oxide (Al2O3) eyaziwa ngemishini yayo emihle kakhulu, eshisayo, neyokubona.

Thumela i-imeyili kithi

Imininingwane Yomkhiqizo

Omaka bomkhiqizo

Ukwethulwa kwebhokisi le-wafer

Ukukhiqizwa kwama-wafers angama-intshi angu-12 kuyinqubo eyinkimbinkimbi futhi ekhethekile.Nazi ezinye izinyathelo ezibalulekile ezihilelekile ekukhiqizweni kwamawafa esafire angama-intshi angu-12:

Ukulungiselela Ikristalu Yembewu: Isinyathelo sokuqala ukulungisa ikristalu yembewu, esebenza njengesifanekiso sokutshala isafire yekristalu eyodwa.Ikristalu yembewu ibunjwe ngokucophelela futhi iphucuziwe ukuze kuqinisekiswe ukuhleleka okufanele nokushelela kwendawo.

Ukuncibilika kwe-Aluminium Oxide: I-aluminium oxide ephezulu ehlanzekile (i-Al2O3) incibilika ku-crucible.I-crucible ngokuvamile yenziwe nge-platinum noma ezinye izinto ze-inert ezingamelana namazinga okushisa aphezulu.

Ukukhula Kwekristalu: I-aluminium oxide encibilikisiwe ibe isihlwanyelwa ngekristalu lembewu elungisiwe bese ipholiswa kancane ngenkathi igcina umoya olawulwayo.Le nqubo ivumela ikristalu yesafire ukuthi ikhule isendlalelo ngongqimba, yakhe ingot yekristalu eyodwa.

I-Ingot Shaping: Uma i-crystal isikhule yafika kusayizi oyifunayo, iyasuswa ku-crucible futhi ibunjwe ibe yi-cylindrical boule.I-boule ibe isisikwa ngokucophelela ibe ama-wafer amancane.

Ukucutshungulwa kwe-Wafer: Ama-wafers asikiwe angaphansi kwezinqubo ezihlukahlukene ukuze afinyelele ukushuba okufunayo, ukuqedwa kwendawo, kanye nekhwalithi.Lokhu kufaka phakathi i-lapping, polishing, kanye ne-chemical-mechanical planarization (CMP) ukuze kususwe ukonakala kwendawo futhi kuzuzwe ukucaba nokushelela okudingekayo.

Ukuhlanza Nokuhlola: Ama-wafer acutshunguliwe ahlanzwa kahle ukuze asuse noma yikuphi ukungcola.Abe esehlolwa ukuthi azikho yini iziphambeko ezinjengokuqhekeka, ukuklwebheka nokungcola.

Ukupakishwa Nokuthunyelwa: Ekugcineni, amawafa ahloliwe ayapakishwa futhi alungiselelwa ukuthunyelwa kumakhasimende, ngokuvamile ezithwali zamawafer ezinikeza ukuvikeleka ngesikhathi sokuthutha.

Kubalulekile ukuqaphela ukuthi ukukhiqizwa kwamawafa angama-12-intshi wesafire kungase kudinge okokusebenza okukhethekile kanye nezinsiza njengoba kuqhathaniswa nosayizi abancanyana.Inqubo ingase futhi ibandakanye amasu athuthukisiwe afana nokungafakwa emaphethelweni kanye nokulawula ingcindezi ukuze kuqinisekiswe ubuqotho nekhwalithi yamawafa amakhulu.

Uma unesidingo sama-sapphire substrates, sicela ukhululeke ukuxhumana:

imeyili:eric@xkh-semitech.com+86 158 0194 2596 /doris@xkh-semitech.com+86 187 0175 6522

Sizobuyela kuwe ngokushesha!