Imishini ye-semiconductor
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Umshini Wokuzungeza we-CNC Ingot (weSapphire, i-SiC, njll.)
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Umshini Wokumaka Umshini Wokumaka Uthingo Lwe-Laser Osheshayo We-Ultrafast
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Umshini Wokusika Ingilazi we-Laser wokucubungula ingilazi eyisicaba
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Uhlelo lwe-Precision Microjet Laser lwezinto eziqinile nezithambile
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Umshini Wokubhola We-Laser Oqondile Kakhulu Wokubhola I-Laser
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Umshini Wokubhoboza I-Glass Laser
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Imishini Yokusika Eqondile Ngokuphelele Eyi-12intshi Uhlelo Lokusika Oluzinikele Lwe-Si/SiC kanye ne-HBM (Al)
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Imishini Yokusika Indandatho Ye-Wafer Ezenzakalelayo Ngokugcwele Usayizi Wokusebenza 8inch/12inch Wafer Ring Cutting
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Imishini Yokumaka I-Laser Anti-counterermboiting Ukumaka I-Sapphire Wafer
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Uhlelo Lokumaka Olulwa Nokukhohlisa Nge-Laser Lwezingxenyana Ze-Sapphire, Amawashi, Ubucwebe Obukhazikhazi
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Isithando sokukhulisa ikristalu se-SiC Ingot growing 4inch 6inch 8inch PTV Lely TSSG LPE growth method
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Umshini wokubhoboza i-laser yetafula elincane 1000W-6000W ubuncane bokuvula okungu-0.1MM ungasetshenziswa ezintweni ze-ceramic zengilazi yensimbi