Imishini Yokusika Eqondile Ngokuphelele Eyi-12intshi Uhlelo Lokusika Oluzinikele Lwe-Si/SiC kanye ne-HBM (Al)

Incazelo emfushane:

Imishini yokusika ngokunemba okuzenzakalelayo ngokuphelele iyisistimu yokusika enembile kakhulu eyenzelwe ngqo imboni yezingxenye ze-semiconductor neze-elekthronikhi. Ihlanganisa ubuchwepheshe obuthuthukisiwe bokulawula ukunyakaza kanye nokubeka okubonakalayo okuhlakaniphile ukuze kufezwe ukunemba kokucubungula kwezinga le-micron. Le mishini ifanelekela ukusika ngokunemba kwezinto ezahlukahlukene eziqinile neziphuka kalula, okuhlanganisa:
1. Izinto ze-Semiconductor: I-Silicon (Si), i-silicon carbide (SiC), i-gallium arsenide (GaAs), i-lithium tantalate/lithium niobate (LT/LN) substrates, njll.
2. Izinto Zokupakisha: Izisekelo ze-ceramic, ozimele be-QFN/DFN, izisekelo zokupakisha ze-BGA.
3. Amadivayisi Asebenzayo: Izihlungi ze-surface acoustic wave (SAW), amamojula okupholisa e-thermoelectric, ama-wafer e-WLCSP.

I-XKH inikeza izinsizakalo zokuhlola ukuhambisana kwezinto ezibonakalayo kanye nokwenza ngokwezifiso izinqubo ukuqinisekisa ukuthi imishini ifanelana kahle nezidingo zokukhiqiza zamakhasimende, inikeza izixazululo ezifanele kakhulu kokubili amasampula e-R&D kanye nokucutshungulwa kweqoqo.

Sithumelele i-imeyili

Izici

Amapharamitha obuchwepheshe

Ipharamitha	Imininingwane
Usayizi Wokusebenza	Φ8", Φ12"
I-Spindle	I-axis ekabili 1.2/1.8/2.4/3.0, Ubuningi obungu-60000 rpm
Usayizi we-blade	2" ~ 3"
I-axis Y1 / Y2	Ukwenyuka kwesinyathelo esisodwa: 0.0001 mm
	Ukunemba kokubeka: < 0.002 mm
	Ububanzi bokusika: 310 mm
I-X Axis	Ibanga lesivinini sokudla: 0.1–600 mm/s
I-axis ye-Z1 / Z2	Ukwenyuka kwesinyathelo esisodwa: 0.0001 mm
I-axis ye-Z1 / Z2	Ukunemba kokubeka: ≤ 0.001 mm
I-axis ye-θ	Ukunemba kokubeka: ± 15"
Isiteshi Sokuhlanza	Isivinini sokuzungezisa: 100–3000 rpm
Isiteshi Sokuhlanza	Indlela yokuhlanza: Hlanza ngokuzenzakalelayo bese womisa nge-spin
I-Voltage Yokusebenza	Isigaba esi-3 esingu-380V 50Hz
Ubukhulu (W×D×H)	1550×1255×1880 mm
Isisindo	2100 kg

Isimiso Sokusebenza

Imishini ifinyelela ukusika okunembe kakhulu ngokusebenzisa ubuchwepheshe obulandelayo:
1. Uhlelo Lokusonta Oluqinile Kakhulu: Isivinini sokujikeleza esifinyelela ku-60,000 RPM, sihlonyiswe ngama-blade edayimane noma amakhanda okusika nge-laser ukuze sivumelane nezakhiwo zezinto ezahlukene.

2. Ukulawula Ukunyakaza Okune-Multi-Axis: Ukunemba kokubeka i-X/Y/Z-axis okungu-±1μm, kuhlanganiswe nezikali zokugaya ezinembayo ephezulu ukuqinisekisa izindlela zokusika ezingenasiphambeko.

3. Ukuqondanisa Okubonakalayo Okuhlakaniphile: I-CCD enesinqumo esiphezulu (ama-megapixel angu-5) ibona ngokuzenzakalelayo imigwaqo ehlukanisiwe futhi ikhokhela ukugoba noma ukungalungi kwezinto.

4. Ukususwa Kokupholisa Nothuli: Uhlelo lokupholisa amanzi ahlanzekile oluhlanganisiwe kanye nokususwa kothuli lokumunca i-vacuum ukuze kuncishiswe umthelela wokushisa kanye nokungcola kwezinhlayiya.

Izindlela Zokusika

1. Ukusika i-Blade: Kufanelekela izinto ze-semiconductor zendabuko njenge-Si ne-GaAs, ezinobubanzi be-kerf obungu-50–100μm.

2. I-Stealth Laser Dicing: Isetshenziselwa ama-wafer amancane kakhulu (<100μm) noma izinto ezibuthakathaka (isb., i-LT/LN), okuvumela ukuhlukaniswa okungenakucindezeleka.

Izicelo Ezijwayelekile

Izinto Ezihambisanayo	Insimu Yesicelo	Izidingo Zokucubungula
I-Silicon (Si)	Ama-IC, izinzwa ze-MEMS	Ukusika okunembe kakhulu, ukuqhekeza <10μm
I-Silicon Carbide (i-SiC)	Amadivayisi kagesi (i-MOSFET/diode)	Ukusika okunomonakalo ophansi, nokwenza ngcono ukuphathwa kokushisa
I-Gallium Arsenide (GaAs)	Amadivayisi e-RF, ama-chip e-optoelectronic	Ukuvimbela ukuqhekeka okuncane, ukulawula ukuhlanzeka
Izingxenyana ze-LT/LN	Izihlungi ze-SAW, ama-modulators optical	Ukusika okungenangcindezi, okulondoloza izakhiwo ze-piezoelectric
Izisekelo zeCeramic	Amamojula kagesi, ukupakishwa kwe-LED	Ukucubungula izinto zokuqina okuphezulu, ukuthamba komphetho
Amafreyimu e-QFN/DFN	Ukupakisha okuthuthukisiwe	Ukusika ama-chip amaningi ngasikhathi sinye, nokwenza kahle
Ama-WLCSP Wafers	Ukupakishwa kwezinga le-wafer	Ukusika ama-wafer amancane kakhulu (50μm) okungenamonakalo

Izinzuzo

1. Ukuskena uhlaka lwekhasethi olusheshayo olunezixwayiso zokuvimbela ukushayisana, ukubeka ukudluliselwa okusheshayo, kanye nekhono eliqinile lokulungisa amaphutha.

2. Imodi yokusika enezinti ezimbili elungiselelwe kahle, ithuthukisa ukusebenza kahle cishe ngo-80% uma kuqhathaniswa nezinhlelo ze-single-spindle.

3. Izikulufo zebhola ezingeniswe ngokunembile, iziqondiso eziqondile, kanye nokulawula i-Y-axis grating scale closed-loop control, okuqinisekisa ukuzinza kwesikhathi eside komshini wokulungisa ngokunemba okuphezulu.

4. Ukulayisha/ukukhulula ngokuzenzakalelayo, ukubeka ukudluliselwa, ukusika ukuvumelanisa, kanye nokuhlolwa kwe-kerf, okunciphisa kakhulu umthwalo womsebenzi we-opharetha (OP).

5. Isakhiwo sokufaka i-spindle sesitayela se-gantry, esinesikhala esincane sama-blade amabili esingu-24mm, okwenza kube lula ukuzivumelanisa nezimo ezibanzi zezinqubo zokusika i-spindle ezimbili.

Izici

1. Ukulinganisa ukuphakama okungathintani nokuxhumana okunembile kakhulu.

2. Ukusika okunezinti eziningi ze-wafer ezimbili kuthreyi eyodwa.

3. Ukulinganisa okuzenzakalelayo, ukuhlolwa kwe-kerf, kanye nezinhlelo zokuthola ukuphuka kwe-blade.

4. Isekela izinqubo ezahlukahlukene ngama-algorithms okuqondanisa okuzenzakalelayo akhethekayo.

5. Ukusebenza kokuzilungisa iphutha kanye nokuqapha izikhundla eziningi ngesikhathi sangempela.

6. Amandla okuhlola okuqala ngemuva kokusika kokuqala.

7. Amamojula e-automation asefektri angenziwa ngezifiso kanye neminye imisebenzi ongayikhetha.

Izinto ezihambisanayo

Izinsizakalo Zemishini

Sinikeza ukwesekwa okuphelele kusukela ekukhetheni imishini kuya ekunakekelweni kwesikhathi eside:

(1) Ukuthuthukiswa Okungokwezifiso
· Ncoma izixazululo zokusika i-blade/laser ngokusekelwe ezicini zezinto ezibonakalayo (isb., ubulukhuni be-SiC, ukuphuka kwe-GaAs).

· Nikeza ukuhlolwa kwamasampula kwamahhala ukuqinisekisa ikhwalithi yokusika (kufaka phakathi ukuqhekeka, ububanzi be-kerf, ukujiya kwendawo, njll.).

(2) Ukuqeqeshwa Kobuchwepheshe
· Ukuqeqeshwa Okuyisisekelo: Ukusebenza kwemishini, ukulungiswa kwamapharamitha, ukulungiswa okuvamile.
· Izifundo Ezithuthukisiwe: Ukulungiswa kwenqubo yezinto eziyinkimbinkimbi (isb., ukusika ama-substrate e-LT ngaphandle kokucindezeleka).

(3) Usekelo Lwangemva Kokuthengisa
· Impendulo engu-24/7: Ukuxilongwa okukude noma usizo olutholakala endaweni.
· Ukuhlinzekwa Kwezingxenye Ezisele: Ama-spindle agcwele, ama-blade, kanye nezingxenye ezibonakalayo ukuze kufakwe ngokushesha.
· Ukulungiswa Kokuvimbela: Ukulinganisa okuvamile ukuze kulondolozwe ukunemba nokwandisa isikhathi senkonzo.

Izinzuzo Zethu

✔ Ulwazi Lwemboni: Ukukhonza abakhiqizi be-semiconductor kanye ne-electronics abangaphezu kuka-300 emhlabeni jikelele.
✔ Ubuchwepheshe Obusezingeni Eliphezulu: Iziqondiso eziqondile eziqondile kanye nezinhlelo ze-servo ziqinisekisa ukuzinza okuhamba phambili embonini.
✔ Inethiwekhi Yezinsizakalo Zomhlaba Wonke: Ukumbozwa e-Asia, eYurophu naseNyakatho Melika kokusekelwa kwendawo.
Ukuze uthole ukuhlolwa noma imibuzo, xhumana nathi!