Imishini Yokusika Indandatho Ye-Wafer Ezenzakalelayo Ngokugcwele Usayizi Wokusebenza 8inch/12inch Wafer Ring Cutting

Imishini Yokusika Indandatho Ye-Wafer Ezenzakalelayo Ngokugcwele Usayizi Wokusebenza 8inch/12inch Ukusika Indandatho Ye-Wafer Isithombe Esivelele

Incazelo emfushane:

I-XKH ithuthukise ngokuzimela uhlelo lokusika umphetho we-wafer oluzenzakalelayo ngokuphelele, olumele ikhambi elithuthukisiwe elenzelwe izinqubo zokukhiqiza i-semiconductor engaphambili. Lo mshini uhlanganisa ubuchwepheshe bokulawula obusha obuhambisanayo be-multi-axis futhi unesistimu ye-spindle enokuqina okuphezulu (isivinini esiphezulu sokujikeleza: 60,000 RPM), enikeza ukusika umphetho ngokunemba ngokunemba kokusika kufika ku-±5μm. Uhlelo lubonisa ukuhambisana okuhle kakhulu nezingxenye ezahlukene ze-semiconductor, okuhlanganisa kodwa kungagcini lapho:
1. Ama-wafer e-Silicon (Si): Afanele ukucutshungulwa komphetho wama-wafer angu-8-12 intshi ；
2. Ama-semiconductor ahlanganisiwe: Izinto ze-semiconductor zesizukulwane sesithathu njenge-GaAs ne-SiC；
3. Izingxenye ezikhethekile: Ama-wafer ezinto ze-piezoelectric afaka phakathi i-LT/LN；

Idizayini ye-modular isekela ukushintshwa okusheshayo kwezinto eziningi ezisetshenziswayo okuhlanganisa ama-blade edayimane namakhanda okusika nge-laser, okuhambisanayo kudlula amazinga embonini. Ngezidingo zenqubo ezikhethekile, sinikeza izixazululo eziphelele ezihlanganisa:
· Ukunikezwa kwezinto ezisetshenziswayo zokusika ezinikezelwe
· Izinsizakalo zokucubungula ngokwezifiso
· Izixazululo zokwenza ngcono ipharamitha yenqubo

Sithumelele i-imeyili

Izici

Amapharamitha obuchwepheshe

Ipharamitha	Iyunithi	Imininingwane
Usayizi Omkhulu Womsebenzi	mm	ø12"
I-Spindle	Ukucushwa	I-Spindle Eyodwa
	Isivinini	3,000–60,000 ngomzuzu
	Amandla Okukhipha	1.8 kW (2.4 uma uthanda) ku-30,000 min⁻¹
	I-Max Blade Dia.	Ø58 mm
I-X-Axis	Ububanzi Bokusika	310 mm
I-Y-Axis	Ububanzi Bokusika	310 mm
	Ukwanda kwesinyathelo	0.0001 mm
	Ukunemba Kokubeka	≤0.003 mm/310 mm, ≤0.002 mm/5 mm (iphutha elilodwa)
I-Z-Axis	Isixazululo Sokunyakaza	0.00005 mm
I-Z-Axis	Ukuphindaphinda	0.001 mm
I-θ-Axis	Ukujikeleza Okuphezulu	380 degrees
Uhlobo lwe-Spindle		I-spindle eyodwa, ifakwe i-blade eqinile yokusika indandatho
Ukunemba Kokusika Indandatho	μm	±50
Ukunemba Kokubeka I-Wafer	μm	±50
Ukusebenza Kahle Kwe-Single-Wafer	iminithi/i-wafer	8
Ukusebenza Kahle Kwama-Wafer Amaningi		Kufika kuma-wafer angu-4 acutshungulwa ngasikhathi sinye
Isisindo Semishini	kg	≈3,200
Ubukhulu Bemishini (W×D×H)	mm	2,730 × 1,550 × 2,070

Isimiso Sokusebenza

Uhlelo lufeza ukusebenza okuhle kakhulu kokunciphisa ngokusebenzisa lobu buchwepheshe obuyinhloko:

1. Uhlelo Lokulawula Ukunyakaza Oluhlakaniphile:
· I-drive yemoto eqondile eqondile (ukunemba kokubeka okuphindaphindiwe: ± 0.5μm)
· Ukulawula okuvumelanayo okune-axis eziyisithupha okusekela ukuhlela okuyinkimbinkimbi kwendlela
· Ama-algorithms okucindezela ukudlidliza ngesikhathi sangempela aqinisekisa ukusika ukuzinza

2. Uhlelo Lokuthola Okuthuthukisiwe:
· Inzwa yokuphakama ye-laser ye-3D ehlanganisiwe (ukunemba: 0.1μm)
· Ukuma okubonakalayo kwe-CCD okunesinqumo esiphezulu (ama-megapixel angu-5)
· Imodyuli yokuhlola ikhwalithi eku-inthanethi

3. Inqubo Ezenzakalelayo Ngokugcwele:
· Ukulayisha/ukukhulula okuzenzakalelayo (i-interface ejwayelekile ye-FOUP iyahambisana)
· Uhlelo lokuhlunga oluhlakaniphile
· Iyunithi yokuhlanza evaliwe (ukuhlanzeka: Ibanga 10)

Izicelo Ezijwayelekile

Lo mshini unikeza inani elibalulekile kuzo zonke izinhlelo zokusebenza zokukhiqiza ze-semiconductor:

Insimu Yesicelo	Izinto Zokucubungula	Izinzuzo Zobuchwepheshe
Ukukhiqizwa kwe-IC	Ama-Silicon Wafer angu-8/12"	Kuthuthukisa ukuqondanisa kwe-lithography
Amadivayisi Amandla	Ama-Wafer e-SiC/GaN	Kuvimbela ukukhubazeka komphetho
Izinzwa ze-MEMS	Ama-SOI Wafers	Iqinisekisa ukuthembeka kwedivayisi
Amadivayisi e-RF	Ama-Wafer e-GaAs	Kuthuthukisa ukusebenza kwemvamisa ephezulu
Ukupakisha Okuthuthukisiwe	Ama-Wafers Aphinde Akhiwa	Kwandisa isivuno sokupakisha

Izici

1. Ukucushwa kwesiteshi esine ukuze kucutshungulwe kahle kakhulu;
2. Ukususwa nokususwa kwendandatho ye-TAIKO eqinile ；
3.Ukuhambisana okuphezulu nezinto ezisetshenziswayo eziyinhloko ；
4. Ubuchwepheshe bokusika obuhambisanayo be-Multi-axis buqinisekisa ukusika okuqondile komphetho;
5. Ukugeleza kwenqubo okuzenzakalelayo ngokugcwele kunciphisa kakhulu izindleko zabasebenzi ；
6. Umklamo wetafula lokusebenza owenziwe ngokwezifiso uvumela ukucutshungulwa okuzinzile kwezakhiwo ezikhethekile ；

Imisebenzi

1. Uhlelo lokuthola indandatho;
2. Ukuhlanza itafula lokusebenza okuzenzakalelayo ；
3. Uhlelo lokususa izibopho ze-UV oluhlakaniphile ；
4. Ukuqoshwa kwelogi yokusebenza ；
5. Ukuhlanganiswa kwemodyuli yokuzenzakalela kwefektri ；

Ukuzibophezela Kwenkonzo

I-XKH inikeza izinsizakalo zokusekela eziphelele neziphelele eziklanyelwe ukwandisa ukusebenza kahle kwemishini kanye nokusebenza kahle kuyo yonke indlela yakho yokukhiqiza.
1. Izinsizakalo Zokwenza Ngokwezifiso
· Ukucushwa Kwemishini Eyenzelwe Wena: Ithimba lethu lobunjiniyela lisebenzisana eduze namakhasimende ukuze lenze ngcono amapharamitha esistimu (isivinini sokusika, ukukhethwa kwe-blade, njll.) ngokusekelwe ezicini ezithile zezinto (i-Si/SiC/GaAs) kanye nezidingo zenqubo.
· Ukusekelwa Kokuthuthukiswa Kwezinqubo: Sinikeza ukucutshungulwa kwamasampula ngemibiko yokuhlaziya enemininingwane ehlanganisa ukulinganiswa kobulukhuni bomphetho kanye nokuhlelwa kwemephu yamaphutha.
· Ukuthuthukiswa Kokubambisana Kwezinto Ezisetshenziswayo: Ngezinto ezintsha (isib. i-Ga₂O₃), sibambisana nabakhiqizi abaphambili bezinto ezisetshenziswayo ukuthuthukisa ama-blade/ama-laser optics aqondene nohlelo lokusebenza.

2. Usekelo Lobuchwepheshe Lochwepheshe
· Ukusekelwa Okuzinikele Esizeni: Nika onjiniyela abaqinisekisiwe izigaba ezibalulekile zokunyuka (ngokuvamile amasonto ama-2-4), okuhlanganisa:
Ukulinganiswa kwemishini kanye nokulungiswa kwenqubo
Ukuqeqeshwa kwamakhono omqhubi
Isiqondiso sokuhlanganiswa kwegumbi lokuhlanza le-ISO Class 5
· Ukulungiswa Okubikezelayo: Ukuhlolwa kwempilo kwekota ngokuhlaziywa kokudlidliza kanye nokuxilongwa kwe-servo motor ukuvimbela isikhathi sokungasebenzi esingahleliwe.
· Ukuqapha Kude: Ukulandelela ukusebenza kwemishini ngesikhathi sangempela ngeplatifomu yethu ye-IoT (JCFront Connect®) ngezaziso ezizenzakalelayo ezingavamile.

3. Izinsizakalo Ezenezelwe Inani
· Isisekelo Solwazi Lwenqubo: Finyelela izindlela zokupheka zokusika eziqinisekisiwe ezingaphezu kuka-300 zezinto ezahlukahlukene (ezibuyekezwa njalo ngekota).
· Ukuqondaniswa Kwemephu Yobuchwepheshe: Ukuvikela ukutshalwa kwezimali kwakho esikhathini esizayo ngezindlela zokuthuthukisa ihadiwe/isofthiwe (isb., imodyuli yokuthola amaphutha esekelwe ku-AI).
· Impendulo Ephuthumayo: Ukuxilongwa okukude okuqinisekisiwe kwamahora ama-4 kanye nokungenelela endaweni amahora angama-48 (ukumbozwa komhlaba wonke).

4. Ingqalasizinda Yesevisi
· Isiqinisekiso Sokusebenza: Ukuzibophezela kwenkontileka esikhathini sokusebenza semishini esingu-≥98% ngezikhathi zokuphendula ezisekelwa yi-SLA.

Intuthuko Eqhubekayo

Senza izinhlolovo zokwaneliseka kwamakhasimende kabili ngonyaka futhi sisebenzisa izinhlelo zeKaizen zokuthuthukisa ukulethwa kwezinsizakalo. Ithimba lethu le-R&D lihumusha ukuqonda kwensimu ekuthuthukisweni kwemishini - u-30% wokuthuthukiswa kwe-firmware uvela kwimpendulo yamakhasimende.