Isisetshenziswa sokusika indandatho ye-wafer ezenzakalelayo Ngokugcwele Usayizi Osebenzayo 8inch/12inch Wafer Ring Cutting

Isisetshenziswa Sokusika Indandatho Yesilundi Esizenzakalelayo Ngokugcwele Usayizi Osebenzayo 8inch/12inch Wafer Ring Cutting Isithombe Esifakiwe

Incazelo emfushane:

I-XKH ithuthukise ngokuzimela isistimu yokunquma onqenqemeni oluyisicwecwana oluzenzakalelayo ngokugcwele, emele isisombululo esithuthukisiwe esiklanyelwe izinqubo zokukhiqiza ama-semiconductor angaphambili. Lesi sixhobo sihlanganisa ubuchwepheshe bokulawula obuvumelanayo obunama-axis amaningi futhi sibonisa isistimu yokuphotha eqinile (isivinini esikhulu sokuzungeza: 60,000 RPM), iletha ukusika okunembayo konqenqema ngokunemba kokusika kufika ku-±5μm. Uhlelo lubonisa ukuhambisana okuhle kakhulu nama-semiconductor substrates ahlukahlukene, okuhlanganisa kodwa kungagcini nje:
1.Amawafa e-Silicon (Si): Afanele ukucutshungulwa onqenqemeni kwama-wafers angama-intshi angu-8-12;
2.Ama-semiconductors e-Compound: Izinto zokwakha ze-semiconductor yesizukulwane sesithathu njenge-GaAs ne-SiC;
3.Ama-substrates akhethekile: Ama-wafer we-Piezoelectric material kuhlanganise ne-LT/LN;

Idizayini ye-modular isekela ukushintshwa ngokushesha kwezinto ezisetshenziswayo eziningi okuhlanganisa izindwani zedayimane namakhanda okusika i-laser, nokuhambisana okudlula izindinganiso zomkhakha. Ngezidingo zenqubo ekhethekile, sinikeza izixazululo ezibanzi ezihlanganisa:
· Ukunikezela okusebenzisekayo kokusika okuzinikele
· Amasevisi okucubungula ngokwezifiso
· Izixazululo zepharamitha yenqubo yokwenza kahle

Thumela i-imeyili kithi

Izici

Imingcele yezobuchwepheshe

Ipharamitha	Iyunithi	Ukucaciswa
Ubukhulu Usayizi Womsebenzi	mm	ø12"
I-spindle	Ukucushwa	I-Single Spindle
	Isivinini	3,000-60,000 rpm
	Amandla Okukhiphayo	1.8 kW (2.4 ozikhethela) ku-30,000 min⁻¹
	UMax Blade Dia.	Ø58 mm
I-X-eksisi	Cutting Range	310 mm
I-Y-eksisi	Cutting Range	310 mm
	Isinyathelo Ukunyuka	0.0001 mm
	Ukunemba Kokumisa	≤0.003 mm/310 mm, ≤0.002 mm/5 mm (iphutha elilodwa)
I-Z-Axis	Ukulungiswa Kokunyakaza	0.00005 mm
I-Z-Axis	Ukuphindaphinda	0.001 mm
θ-I-eksisi	Ukujikeleza Okukhulu	380 deg
Uhlobo lwe-Spindle		I-spindle eyodwa, ifakwe i-blade eqinile yokusika indandatho
Ukunemba kokusika indandatho	μm	±50
Ukunemba kwe-Wafer Positioning	μm	±50
Ukusebenza Kwe-Single-Wafer	iminithi/isinkwa	8
I-Multi-Wafer Efficiency		Kufika kuma-wafers angu-4 acutshungulwa kanyekanye
Isisindo Sezisetshenziswa	kg	≈3,200
Ubukhulu besisetshenziswa (W×D×H)	mm	2,730 × 1,550 × 2,070

Isimiso sokusebenza

Isistimu izuza ukusebenza okukhethekile kokunquma ngalabu buchwepheshe obuyinhloko:

1.I-Intelligent Motion Control System:
· Idrayivu yemoto yomugqa enembe kakhulu (phinda ukunemba kokuma: ±0.5μm)
· Ukulawula okuhambisanayo kwe-eksisi eyisithupha okusekela ukuhlela okuyinkimbinkimbi komgudu
· I-Real-time vibration suppression algorithms eqinisekisa ukuzinza kokusika

2.Isistimu Yokuthola Okuthuthukisiwe:
· Inzwa yobude be-laser ye-3D ehlanganisiwe (ukunemba: 0.1μm)
· Indawo yokubuka ye-CCD yokulungiswa okuphezulu (ama-megapixel angu-5)
· Imojula yokuhlola ikhwalithi eku-inthanethi

3.Inqubo Ezenzakalelayo Ngokugcwele:
· Ukulayisha/ukukhipha okuzenzakalelayo (i-FOUP interface ejwayelekile iyahambisana)
· Uhlelo lokuhlunga oluhlakaniphile
· Iyunithi yokuhlanza iluphu evaliwe (ukuhlanzeka: Ikilasi le-10)

Izicelo Ezijwayelekile

Lo mshini uletha inani elibalulekile kuzo zonke izinhlelo zokusebenza zokukhiqiza ze-semiconductor:

Inkambu yohlelo lokusebenza	Izinto Zokusebenza	Izinzuzo Zobuchwepheshe
I-IC Manufacturing	8/12" ama-Silicon Wafers	Ithuthukisa ukuqondana kwe-lithography
Amadivayisi Amandla	I-SiC/GaN Wafers	Igwema amaphutha asemaphethelweni
Izinzwa ze-MEMS	Ama-wafers e-SOI	Iqinisekisa ukwethembeka kwedivayisi
Amadivayisi e-RF	I-GaAs Wafers	Ithuthukisa ukusebenza kwe-high-frequency
Ukupakisha Okuthuthukile	Ama-wafers akhiwe kabusha	Yandisa isivuno sokupakisha

Izici

1.Four-station ukucushwa for high processing ukusebenza kahle;
2.I-TAIKO eqinile yokuxhuma nokususa indandatho;
3.Ukuhambisana okuphezulu nezinto ezisetshenziswayo ezibalulekile;
4.I-Multi-axis synchronous trimming technology iqinisekisa ukusika onqenqemeni olunembayo;
5.Ukugeleza kwenqubo okuzenzakalelayo ngokugcwele kunciphisa kakhulu izindleko zabasebenzi;
6.Umklamo osebenzayo owenziwe ngokwezifiso wenza ukucubungula okuzinzile kwezakhiwo ezikhethekile;

Imisebenzi

1.Isistimu yokuthola i-ring-drop;
2.Automatic worktable yokuhlanza;
3.I-Intelligent UV debonding system;
4. Ukurekhoda kwelogi yokusebenza;
5.Factory automation module ukuhlanganiswa;

Ukuzibophezela Kwesevisi

I-XKH ihlinzeka ngezinsiza eziphelele, eziphelele zokusekela umjikelezo wempilo yakhelwe ukukhulisa ukusebenza kwemishini nokusebenza kahle kulo lonke uhambo lwakho lokukhiqiza.
1. Amasevisi Okwenza ngokwezifiso
· Ukucushwa Kwezisetshenziswa Ezifanisiwe: Ithimba lethu lonjiniyela lisebenzisana eduze namakhasimende ukuze lithuthukise imingcele yesistimu (isivinini sokusika, ukukhetha i-blade, njll.) ngokusekelwe ezintweni ezibonakalayo ezithile (Si/SiC/GaAs) kanye nezidingo zenqubo.
· Usekelo Lokuthuthukiswa Kwenqubo: Sinikeza ukucutshungulwa kwesampula ngemibiko yokuhlaziya enemininingwane ehlanganisa ukukalwa konqenqema kanye nemephu yokukhubazeka.
· I-Consumables Co-Development: Ngezinto ezisetshenziswayo ezinoveli (isb, i-Ga₂O₃), sibambisene nabakhiqizi abahamba phambili abathengekayo ukuze sithuthukise ama-blade/i-laser optics eqondene nohlelo lokusebenza.

2. Professional Technical Support
· Ukusekelwa Okunikezelwe Kusayithi: Nikeza onjiniyela abaqinisekisiwe ngezigaba ezibalulekile zokukhuphuka (imvamisa amaviki angama-2-4), okuhlanganisa:
Ukulinganiswa kwezisetshenziswa nokucubungula ukushuna kahle
Ukuqeqeshwa kwekhono lomsebenzisi
Isiqondiso sokuhlanganisa igumbi lokuhlanza le-ISO Class 5
· Ukunakekela Okubikezelwayo: Ukuhlolwa kwezempilo kwekota ngokuhlaziywa kokudlidliza kanye nokuxilongwa kwe-servo motor ukuvimbela isikhathi sokuphumula esingahlelelwe.
· Ukuqapha Okukude: Ukulandelela ukusebenza kwemishini ngesikhathi sangempela ngeplathifomu yethu ye-IoT (JCFront Connect®) ngezexwayiso ezizenzakalelayo ezingaqondakali.

3. Izinsizakalo Zokwengeza Inani
Isisekelo Solwazi Lwenqubo: Finyelela ku-300+ izindlela zokupheka eziqinisekisiwe zokusika zezinto ezihlukahlukene (zibuyekezwa njalo ngekota).
· Ukuqondanisa Umhlahlandlela Wobuchwepheshe: Ubufakazi besikhathi esizayo bokutshalwa kwezimali kwakho ngezindlela zokuthuthukisa ihadiwe/isofthiwe (isb., imojula yokutholwa kokukhubazeka okusekelwe ku-AI).
· Impendulo Yezimo Eziphuthumayo: Ukuxilongwa okukude okuqinisekisiwe kwamahora angu-4 kanye nokungenelela endaweni yamahora angu-48 (ukusakazwa komhlaba wonke).

4. Ingqalasizinda Yesevisi
· Isiqinisekiso sokusebenza: Ukuzibophezela kwenkontileka ≥98% kwesikhathi sokusebenza kwemishini nezikhathi zokuphendula ezisekelwa yi-SLA.

Ukuthuthukiswa Okuqhubekayo

Senza izinhlolovo zokwaneliseka kwamakhasimende kabili ngonyaka futhi sisebenzisa izinhlelo ze-Kaizen zokuthuthukisa ukulethwa kwezinsizakalo. Ithimba lethu le-R&D lihumusha imininingwane yenkambu ekuthuthukisweni kwemishini - u-30% wokuthuthukiswa kwe-firmware asuka empendulweni yeklayenti.