I-12inch Ngokugcwele Okuzenzakalelayo Okuzenzakalelayo Kokuhlukanisa Isisetshenziswa Sesisetshenziswa Sesicwecwe Esizinikezele Sokusika se-Si/SiC & HBM (Al)

I-12inch Ngokugcwele Okuzenzakalelayo Okuzenzakalelayo Kwesisetshenziswa Sesisetshenziswa Se-Dicing Saw I-wafer Dedicated Cutting System ye-Si/SiC & HBM (Al) Isithombe Esifakiwe

Incazelo emfushane:

Imishini yokudayela enembe ngokuzenzakalelayo iwuhlelo lokusika olunembe kakhulu olusungulwe ngokukhethekile imboni ye-semiconductor kanye nezingxenye ze-elekthronikhi. Ihlanganisa ubuchwepheshe obuthuthukisiwe bokulawula ukunyakaza kanye nokuma okubonakalayo okuhlakaniphile ukuze kuzuzwe ukunemba kokucubungula kwezinga le-micron. Lo mshini ulungele ukudayela ngokunemba kwezinto ezihlukahlukene eziqinile neziphukayo, okuhlanganisa:
I-1.Semiconductor Materials: I-Silicon (Si), i-silicon carbide (SiC), i-gallium arsenide (GaAs), i-lithium tantalate/lithium niobate (LT/LN) substrates, njll.
2.Izinto Zokupakisha: Ama-Ceramic substrates, amafreyimu e-QFN/DFN, ama-substrate okupakisha e-BGA.
3.Amadivayisi Asebenzayo: Izihlungi ze-Surface acoustic wave (SAW), amamojula wokupholisa we-thermoelectric, amawafa e-WLCSP.

I-XKH ihlinzeka ngokuhlolwa kokuhambisana kwezinto futhi icubungule izinsizakalo zokwenza ngokwezifiso ukuze kuqinisekiswe ukuthi okokusebenza kufanelana kahle nezidingo zokukhiqiza zamakhasimende, iletha izixazululo eziphelele zazo zombili amasampula e-R&D kanye nokucutshungulwa kweqoqo.

Thumela i-imeyili kithi

Izici

Imingcele yezobuchwepheshe

Ipharamitha	Ukucaciswa
Usayizi Wokusebenza	Φ8", Φ12"
I-spindle	I-Dual-eksisi 1.2/1.8/2.4/3.0, Max 60000 rpm
Usayizi we-Blade	2" ~ 3"
I-eksisi ye-Y1 / Y2	Ukunyuka kwesinyathelo esisodwa: 0.0001 mm
	Ukunemba kokuma: <0.002 mm
	Ububanzi bokusika: 310 mm
I-X eksisi	Ibanga lesivinini sokuphakelayo: 0.1–600 mm/s
I-Axis ye-Z1 / Z2	Ukunyuka kwesinyathelo esisodwa: 0.0001 mm
I-Axis ye-Z1 / Z2	Ukunemba kokuma: ≤ 0.001 mm
θ I-eksisi	Ukunemba kokuma: ±15"
Isiteshi Sokuhlanza	Isivinini sokujikeleza: 100-3000 rpm
Isiteshi Sokuhlanza	Indlela yokuhlanza: Hlanza ngokuzenzakalelayo futhi usomise
I-Voltage yokusebenza	3-isigaba 380V 50Hz
Ubukhulu (W×D×H)	1550×1255×1880 mm
Isisindo	2100 kg

Isimiso Sokusebenza

Imishini ifinyelela ukusika okuphezulu ngobuchwepheshe obulandelayo:
I-1.I-High-Rigidity Spindle System: Isivinini sokujikeleza sifika ku-60,000 RPM, ifakwe ama-diamond blades noma amakhanda okusika ama-laser ukuze avumelane nezakhiwo ezihlukahlukene zezinto ezibonakalayo.

2.I-Multi-Axis Motion Control: Ukunemba kokuma kwe-axis ye-X/Y/Z okungu-±1μm, kubhangqwe nezikali zokugezela ezinembayo ukuze kuqinisekiswe izindlela zokusika ezingenazo ukuchezuka.

3.Ukuqondanisa Okubonakalayo Okukhaliphile: I-CCD enokulungiswa okuphezulu (amamegaphikiseli angu-5) ibona ngokuzenzakalela imigwaqo esikayo futhi inxephezele ukungqubuzana kwezinto noma ukungahambi kahle.

4.Ukupholisa Nokususwa Kothuli: Isistimu yokupholisa amanzi ahlanzekile edidiyelwe kanye nokususwa kothuli lwe-vacuum ukuze kuncishiswe umthelela oshisayo kanye nokungcoliswa kwezinhlayiyana.

Cutting Modes

1.I-Blade Dicing: Ifanele izinto ze-semiconductor zendabuko ezifana ne-Si kanye ne-GaAs, enobubanzi be-kerf obungu-50–100μm.

2.I-Stealth Laser Dicing: Isetshenziselwa amawafa amancane kakhulu (<100μm) noma izinto ezithambile (isb, i-LT/LN), evumela ukuhlukana okungenakucindezeleka.

Izicelo Ezijwayelekile

Izinto Ezivumelanayo	Inkambu yohlelo lokusebenza	Icubungula Izidingo
I-silicon (Si)	Ama-IC, izinzwa ze-MEMS	Ukusika okunembe kakhulu, ukusika <10μm
I-Silicon Carbide (SiC)	Amadivayisi kagesi (MOSFET/diodes)	Ukusika okunomonakalo ophansi, ukwenziwa ngcono kokuphathwa kokushisa
I-Gallium Arsenide (GaAs)	Amadivaysi e-RF, ama-optoelectronic chips	Ukuvimbela imifantu emincane, ukulawula inhlanzeko
I-LT/LN Substrates	Izihlungi ze-SAW, ama-modulators optical	Ukusika okungenakucindezeleka, ukulondoloza izakhiwo ze-piezoelectric
I-Ceramic Substrates	Amamojula wamandla, ukupakishwa kwe-LED	High-hardness material processing, umphetho flatness
QFN/DFN Frames	Ukupakisha okuthuthukile	Ukusika kwe-Multi-chip kanyekanye, ukwenziwa kahle
I-WLCSP Wafers	Ukupakishwa kwezinga le-wafer	Ukudayela okungenakulimala kwama-wafers amancanyana kakhulu (50μm)

Izinzuzo

1. Ukuskena kozimele wekhasethi lesivinini esikhulu ngama-alamu okuvimbela ukushayisana, ukuma kokudlulisa okusheshayo, namandla aqinile okulungisa amaphutha.

2. Imodi yokusika yokuphotha kabili ethuthukisiwe, ithuthukisa ukusebenza kahle cishe ngo-80% uma kuqhathaniswa nezinhlelo zokuphotha okukodwa.

3. Izikulufu zebhola ezingeniswe ngokunemba, iziqondiso zomugqa, nesikali se-Y-axis grating isilawuli esiyiluphu esivaliwe, esiqinisekisa ukuzinza kwesikhathi eside komshini wokunemba okuphezulu.

4. Ukulayisha/ukukhipha okuzenzakalelayo ngokugcwele, ukuma kokudlulisa, ukusika ukuqondanisa, nokuhlolwa kwe-kerf, kunciphisa kakhulu umthwalo womsebenzi womqhubi (OP).

5.Isakhiwo sokugxumeka sokuphotha sesitayela se-Gantry, esinesikhala esincane se-dual-blade esingu-24mm, okuvumela ukuguquguquka okubanzi kwezinqubo zokusika ezikabili-ezimbili.

Izici

1.Isilinganiso sobude esinganembe kakhulu esingathintani nabo.

2.Ukusika ama-Multi-wafer dual-blade ethreyini eyodwa.

3.Ukulinganisa okuzenzakalelayo, ukuhlolwa kwe-kerf, namasistimu okubona ukuphuka kwe-blade.

4.Isekela izinqubo ezihlukahlukene ezinama-algorithms okuqondanisa okuzenzakalelayo.

5.Ukusebenza kokuzilungisa okunephutha kanye nokuqapha kwezindawo eziningi ngesikhathi sangempela.

6.Ikhono lokuhlola lokuqala lokusika ngemuva kokudayela kokuqala.

7.Amamojula we-automation wefekthri angenziwa ngokwezifiso kanye neminye imisebenzi ongayikhetha.

Izinto ezihambisanayo

Amasevisi Ezinsiza

Sinikeza ukwesekwa okuphelele kusukela ekukhethweni kwemishini kuya ekulungisweni kwesikhathi eside:

(1) Ukuthuthukiswa Ngokwezifiso
· Ncoma izixazululo zokusika i-blade/laser ngokusekelwe ezintweni ezibonakalayo (isb, ubulukhuni be-SiC, i-GaAs brittleness).

· Nikeza ukuhlolwa kwamahhala kwesampula ukuze uqinisekise ikhwalithi yokusika (okuhlanganisa ukusika, ububanzi be-kerf, ukuhwalala kwendawo, njll.).

(2) Ukuqeqeshwa Kwezobuchwepheshe
· Ukuqeqeshwa Okuyisisekelo: Ukusebenza kwemishini, ukulungiswa kwepharamitha, ukunakekelwa okujwayelekile.
· Izifundo Ezithuthukile: Ukwenza ngcono inqubo yezinto eziyinkimbinkimbi (isb., ukusika okungenakucindezeleka kwama-LT substrates).

(3) Ukusekela Ngemva Kokuthengisa
· 24/7 Impendulo: Ukuxilongwa kwesilawuli kude noma usizo lwesayithi.
· Ukunikezwa kwezingxenye eziyisipele: Izinsimbi zokuphotha, izindwani, nezinto ezibonakalayo ukuze zishintshwe ngokushesha.
· Ukugcinwa Kokuvikela: Ukulinganisa okuvamile ukuze kugcinwe ukunemba nokwelula impilo yesevisi.

Izinzuzo Zethu

✔ Isipiliyoni Semboni: Isebenzela ama-semiconductor angama-300+ womhlaba jikelele kanye nabakhiqizi bezinto zikagesi.
✔ Ubuchwepheshe Be-Cutting-Edge: Imihlahlandlela eqondile eqondile nezinhlelo ze-servo ziqinisekisa ukuzinza okuhamba phambili embonini.
✔ Inethiwekhi Yesevisi Yomhlaba Wonke: Ukusabalala e-Asia, eYurophu naseNyakatho Melika ukuze uthole ukwesekwa kwendawo.
Ukuhlola noma ukubuza, xhumana nathi!