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I-Wafer Orientation System ye-Crystal Orientation Measurement

I-Wafer Orientation System ye-Crystal Orientation Measurement Isithombe Esifakiwe
  • I-Wafer Orientation System ye-Crystal Orientation Measurement
  • I-Wafer Orientation System ye-Crystal Orientation Measurement
  • I-Wafer Orientation System ye-Crystal Orientation Measurement
  • I-Wafer Orientation System ye-Crystal Orientation Measurement

Incazelo emfushane:

Insimbi yokuqondisa i-wafer iyidivayisi enembayo ephezulu esebenzisa izimiso ze-X-ray diffraction ukuze kuthuthukiswe ukukhiqizwa kwe-semiconductor nezinqubo zesayensi yezinto ezibonakalayo ngokunquma umumo we-crystallographic. Izingxenye zayo eziyinhloko zifaka umthombo we-X-ray (isb, i-Cu-Kα, i-wavelength engu-0.154 nm), i-goniometer enembile (i-angular resolution ≤0.001°), kanye nezitholi (CCD noma izibali ze-scintillation). Ngokuzungezisa amasampula nokuhlaziya amaphethini okushintshashintsha, ibala izinkomba zecrystallographic (isb, 100, 111) nesikhala selathisi ngokunemba okungu-±30 kwe-arcsecond. Uhlelo lusekela ukusebenza okuzenzakalelayo, ukulungiswa kwe-vacuum, nokuzungezisa kwe-axis eminingi, okuhambisana namawafa angu-2-8-intshi ukuze kukale ngokushesha imiphetho ye-wafer, izindiza eziyinkomba, nokuqondanisa kongqimba lwe-epitaxial. Izinhlelo zokusebenza ezibalulekile zifaka i-silicon carbide egxile ekusikeni, amawafa esafire, nokuqinisekisa ukusebenza kwe-turbine blade lokushisa eliphezulu, okuthuthukisa ngokuqondile izakhiwo zikagesi ze-chip kanye nesivuno.


Izici

Isingeniso Sezisetshenziswa

Amathuluzi e-wafer orientation angamadivayisi anemba asuselwa kuzimiso ze-X-ray diffraction (XRD)​, asetshenziswa kakhulu ekukhiqizweni kwe-semiconductor, izinto ezibonakalayo, izitsha zobumba, nezinye izimboni ze-crystalline material.

Lawa mathuluzi anquma umumo we-crystal lattice futhi aqondise ukusika okunembayo noma izinqubo zokupholisha. Izici ezibalulekile zifaka:

  • Izilinganiso zokunemba okuphezulu:Iyakwazi ukuxazulula izindiza zekristalu ezinezinqumo ezingu-angular ezifika ku-0.001°.
  • Ukuhambisana kwesampula enkulu:Isekela ama-wafers afinyelela ku-450 mm ububanzi nezisindo ezingama-30 kg, afanele izinto ezifana ne-silicon carbide (SiC), isafire, ne-silicon (Si).
  • Idizayini ye-modular:Imisebenzi enwebekayo ihlanganisa ukuhlaziywa kwe-rocking curve, imephu ye-3D surface defect, kanye namadivayisi wokupakisha wokucubungula amasampula amaningi.

Amapharamitha Abalulekile Wezobuchwepheshe

Isigaba sepharamitha

Amanani Ajwayelekile/Ukucushwa

Umthombo we-X-ray

I-Cu-Kα (indawo okugxilwe kuyo engu-0.4×1 mm), 30 kV amandla kagesi asheshayo, 0–5 mA ishubhu yamanje eshintshwayo

I-Angular Range

θ: -10 ° kuya +50 °; 2θ: -10° ukuya +100°

Ukunemba

Ukulungiswa kwe-engeli etshekile: 0.001°, ukutholwa kokonakala kwendawo: ±30 arcseconds (ijika elinyakazayo)

Isivinini sokuskena

Ukuskena kwe-Omega kuqeda ukuma okugcwele kwe-lattice ngemizuzwana emi-5; Ukuskena kwe-Theta kuthatha iminithi elingu-1

Isiteji sesampula

I-V-groove, ukumunca umoya, ukuzungezisa okunama-engeli amaningi, kuhambisana namawafa angama-intshi angu-2–8

Imisebenzi Enwebekayo

Ukuhlaziya ijika elinyakazayo, ukumepha i-3D, idivayisi yokupakisha, ukutholwa kokukhubazeka kwamehlo (imihuzuko, ama-GB)

Isimiso Sokusebenza

1. I-X-ray Diffraction Foundation

  • Ama-X-ray asebenzisana nama-nuclei e-athomu nama-electron ku-crystal lattice, akhiqiza amaphethini okushintshashintsha. Umthetho kaBragg (​nλ = 2d sinθ​) ulawula ubudlelwano phakathi kwama-engeli e-diffraction (θ) nesikhala se-lattice (d).
    Izitholi zithwebula lawa maphethini, ahlaziywa ukuze akhe kabusha ukwakheka kwecrystallographic.

2. I-Omega Scanning Technology

  • Ikristalu izungeza ngokuqhubekayo izungeze i-eksisi egxilile kuyilapho ama-X-ray ayikhanyisa.
  • Izihloli ziqoqa amasiginali wokuhlukanisa phakathi kwezindiza eziningi ze-crystallographic, ezivumela ukuzimisela okugcwele kokuma kwe-lattice ngemizuzwana emi-5.

3. Ukuhlaziya ijika le-Rocking

  • I-engeli yekristalu egxilile enama-engeli e-X-ray esenzeko ukuze kukale ububanzi obuphakeme (i-FWHM), ihlola ukukhubazeka kwe-lattice kanye nobunzima.

4. Ukulawula Okuzenzakalelayo

  • I-PLC ne-touchscreen interface inika amandla ama-engeli okusika asethiwe, impendulo yesikhathi sangempela, nokuhlanganiswa nemishini yokusika yokulawula iluphu evaliwe.

I-Wafer Orientation Instrument 7

Izinzuzo kanye nezici

1. Ukunemba nokusebenza kahle

  • Ukunemba kwe-angular ±0.001°, ukulungiswa kokutholwa kokukhubazeka <30 arcsecond.
  • Isivinini sokuskena se-Omega singu-200× ngokushesha kunezikena ze-Theta ezivamile.

2. I-Modularity kanye ne-Scalability

  • Anwebeka ezinsizeni ezikhethekile (isb., amawafa e-SiC, ama-turbine blades).
  • Ihlanganisa nezinhlelo ze-MES zokuqapha ukukhiqizwa kwesikhathi sangempela.

3. Ukuhambisana nokuzinza

  • Ivumela amasampula amise ngendlela engavamile (isb., ama-sapphire ingots).
  • Idizayini epholile emoyeni inciphisa izidingo zokunakekela.

4. Ukusebenza Okukhaliphile

  • Ukulinganisa ngokuchofoza okukodwa nokucutshungulwa kwemisebenzi eminingi.
  • Ukulinganisa okuzenzakalelayo ngamakristalu ayizethenjwa ukuze kuncishiswe iphutha lomuntu.

I-Wafer Orientation Instrument 5-5

Izinhlelo zokusebenza

1. Ukukhiqiza I-Semiconductor

  • I-wafer dicing orientation: Inquma i-Si, i-SiC, i-GaN wafer orientation ngokusebenza kahle kokusika.
  • Imephu enesici​: Ikhomba ukuklwebheka kwendawo noma ukugudluka ukuze kuthuthukiswe ukuvunwa kwe-chip.

2. Izinto ezibonakalayo

  • Amakristalu angaqondile (isb, i-LBO, i-BBO) yamadivayisi we-laser.
  • Ireferensi ye-Sapphire wafer surface marking ye-LED substrates.

3. I-Ceramics kanye ne-Composites

  • Ihlaziya umumo wokusanhlamvu ku-Si3N4 kanye ne-ZrO2 ukuze uthole izinhlelo zokusebenza ezisezingeni eliphezulu.

4. Ucwaningo Nokulawulwa Kwekhwalithi

  • Amanyuvesi/amalebhu okuthuthukiswa kwezinto ezinoveli (isb, ama-alloys aphezulu).
  • I-Industrial QC ukuqinisekisa ukufana kwenqwaba.

Izinkonzo ze-XKH

I-XKH inikezela ngosekelo olubanzi lomjikelezo wempilo wamathuluzi e-wafer orientation, okuhlanganisa ukufakwa, ukuthuthukiswa kwepharamitha yenqubo, ukuhlaziya ijika elinyakazayo, kanye nemephu yokukhubazeka kwe-3D. Izixazululo ezenzelwe wena (isb, ubuchwepheshe bokupakisha ingot) zihlinzekwa ukuthuthukisa ukusebenza kahle kwe-semiconductor kanye ne-optical material yokukhiqiza ngama-30%. Ithimba elizinikele liqhuba ukuqeqeshwa endaweni, kuyilapho ukwesekwa okukude okungu-24/7 nokushintshwa kwengxenye eyisipele ngokushesha kuqinisekisa ukwethembeka kwemishini.

  • Okwedlule:
  • Olandelayo:

    • Imikhiqizo Ehlobene

    Bhala umyalezo wakho lapha futhi usithumelele wona
    Chofoza u-enter ukuze useshe noma u-ESC ukuze uvale