English

Uhlelo Lokuqondisa I-Wafer Lokulinganisa Ukuqondiswa Kwekristalu

Uhlelo Lokuqondisa I-Wafer Lokulinganisa Ukuqondiswa Kwekristalu Isithombe Esifakiwe
  • Uhlelo Lokuqondisa I-Wafer Lokulinganisa Ukuqondiswa Kwekristalu
  • Uhlelo Lokuqondisa I-Wafer Lokulinganisa Ukuqondiswa Kwekristalu
  • Uhlelo Lokuqondisa I-Wafer Lokulinganisa Ukuqondiswa Kwekristalu
  • Uhlelo Lokuqondisa I-Wafer Lokulinganisa Ukuqondiswa Kwekristalu

Incazelo emfushane:

Ithuluzi lokuqondiswa kwe-wafer liyithuluzi elinembile kakhulu elisebenzisa izimiso ze-X-ray diffraction ukuze lenze ngcono izinqubo zokukhiqiza ze-semiconductor kanye nesayensi yezinto ezibonakalayo ngokunquma ukuqondiswa kwe-crystallographic. Izingxenye zalo eziyinhloko zifaka umthombo we-X-ray (isb., I-Cu-Kα, ubude be-wavelength obungu-0.154 nm), i-goniometer enembile (i-angle resolution ≤0.001°), kanye nama-detector (ama-CCD noma ama-scintillation counters). Ngokujikelezisa amasampula nokuhlaziya amaphethini e-diffraction, ibala izinkomba ze-crystallographic (isb., 100, 111) kanye nesikhala se-lattice ngokunemba kwe-±30 arcsecond. Uhlelo lusekela ukusebenza okuzenzakalelayo, ukulungiswa kwe-vacuum, kanye nokujikeleza kwe-multi-axis, okuhambisana nama-wafer angu-2-8-intshi ukuze kulinganiswe ngokushesha imiphetho ye-wafer, izindiza zokubhekisela, kanye nokulungiswa kwezingqimba ze-epitaxial. Izinhlelo zokusebenza ezibalulekile zifaka phakathi i-silicon carbide eqondiswe ekusikeni, ama-wafer e-sapphire, kanye ne-turbine blade high-temperature validation, okuthuthukisa ngqo izakhiwo zikagesi ze-chip kanye ne-yield.


Izici

Isingeniso Semishini​

Amathuluzi okuqondisa i-Wafer amadivayisi anembile asekelwe ezimisweni ze-X-ray diffraction (XRD), ezisetshenziswa kakhulu ekukhiqizeni ama-semiconductor, izinto ezibonakalayo, izinto zobumba, kanye neminye imboni yezinto ezikristalu.

Lezi zinsimbi zinquma ukuma kwe-crystal lattice futhi ziqondisa izinqubo zokusika noma zokupholisha ezinembile. Izici ezibalulekile zifaka:

  • Izilinganiso ezinembile kakhulu:Iyakwazi ukuxazulula izindiza ze-crystallographic ezinezinqumo ze-angular ezifinyelela ku-0.001°.
  • Ukuhambisana okukhulu kwesampula​​:Isekela ama-wafer afinyelela ku-450 mm ububanzi kanye nesisindo esingu-30 kg, afaneleka ezintweni ezifana ne-silicon carbide (SiC), i-sapphire, ne-silicon (Si).
  • Idizayini ye-Modular:Imisebenzi enwebekayo ifaka phakathi ukuhlaziywa kwejika eligobile, imephu yesici sobuso se-3D, kanye namadivayisi okufaka inqwaba yokucubungula amasampula amaningi.

Amapharamitha Obuchwepheshe Abalulekile​

Isigaba Sepharamitha

Amanani/Ukucushwa Okujwayelekile

Umthombo we-X-ray

I-Cu-Kα (indawo yokugxila engu-0.4×1 mm), i-voltage esheshisa engu-30 kV, i-tube current elungisekayo engu-0–5 mA

Ububanzi be-Angular

θ: -10° kuya ku-+50°; 2θ: -10° kuya ku-+100°

Ukunemba​​

Ukulungiswa kwe-engeli yokutsheka: 0.001°, ukutholwa kwesici sobuso: ±30 arcseconds (ijika elinyakazayo)

Isivinini sokuskena

Ukuskena kwe-Omega kuqeda ukuqondiswa kwe-lattice okugcwele ngemizuzwana emi-5; Ukuskena kwe-Theta kuthatha umzuzu ongu-1

Isigaba Sesampula

I-V-groove, ukumunca umoya, ukujikeleza okune-engeli eziningi, kuhambisana nama-wafer angu-2–8 intshi

Imisebenzi Enwebekayo

Ukuhlaziywa kwejika eligobile, imephu ye-3D, idivayisi yokufaka inqwaba, ukutholwa kwezinkinga zokubona (ukuklwebheka, ama-GB)

Isimiso Sokusebenza​

1. Isisekelo Sokwehluka Kwe-X-ray​

  • Ama-X-ray asebenzisana nama-nuclei e-athomu nama-electron ku-crystal lattice, akhiqiza amaphethini okuhlukanisa. Umthetho kaBragg (​nλ = 2d sinθ​​) ulawula ubudlelwano phakathi kwama-engeli okuhlukanisa (θ) kanye nesikhala se-lattice (d).
    Ama-detector athwebula la maphethini, ahlaziywa ukuze akhe kabusha isakhiwo se-crystallographic.

2. Ubuchwepheshe Bokuskena be-Omega​​

  • Ikristalu lijikeleza njalo lizungeze i-axis eqinile kuyilapho ama-X-ray eyikhanyisa.
  • Ama-detector aqoqa amasignali okuphambuka kuzo zonke izindiza eziningi ze-crystallographic, okwenza kube lula ukunquma ukuqondiswa kwe-lattice okugcwele ngemizuzwana emi-5.

3. Ukuhlaziywa kwe-Rocking Curve

  • I-engeli yekristalu elungisiwe enezingqimba ze-X-ray ezahlukahlukene ukuze kulinganiswe ububanzi be-peak (FWHM), kuhlolwa amaphutha e-lattice kanye nobunzima.

4. Ukulawula Okuzenzakalelayo

  • Izixhumi ze-PLC kanye nesikrini sokuthinta zivumela ama-engeli okusika asethwe ngaphambilini, impendulo yesikhathi sangempela, kanye nokuhlanganiswa nemishini yokusika yokulawula i-close-loop.

Ithuluzi Lokuqondisa I-Wafer 7

Izinzuzo kanye nezici​

1. Ukunemba Nokusebenza Kahle​

  • Ukunemba kwe-angular ±0.001°, ukulungiswa kokutholwa kwephutha <30 arcseconds.
  • Isivinini sokuskena se-Omega sishesha ngo-200×​ kunesiskena sendabuko se-Theta.

2. Ukuguquguquka kanye Nokukhuliswa​

  • Inganwetshwa ngezinhlelo zokusebenza ezikhethekile (isb., ama-wafer e-SiC, ama-turbine blades).
  • Ihlangana nezinhlelo ze-MES zokuqapha ukukhiqizwa ngesikhathi sangempela.

3. Ukuhambisana kanye nokuzinza​

  • Ivumela amasampula angakhekile ngendlela engavamile (isb., ama-sapphire ingots aqhekekile).
  • Umklamo opholiswe ngomoya unciphisa izidingo zokulungisa.

4. Ukusebenza Okuhlakaniphile​

  • Ukulinganisa ngokuchofoza kanye kanye kanye nokucubungula imisebenzi eminingi.
  • Ukulinganisa okuzenzakalelayo ngamakristalu okubhekisela ukuze kuncishiswe amaphutha omuntu.

Ithuluzi Lokuqondisa I-Wafer 5-5

Izicelo

1. Ukukhiqiza Ama-semiconductor​

  • Ukuqondiswa kwe-wafer dicing​: Kunquma ukuqondiswa kwe-wafer ye-Si, i-SiC, ne-GaN ukuze kusebenze kahle kakhulu ukusika.
  • Imephu yamaphutha: Ikhomba imihuzuko noma ukukhubeka kobuso ukuze kuthuthukiswe ukukhiqizwa kwama-chip.

2. Izinto Zokusebenza​​

  • Amakristalu angewona aqondile (isib., i-LBO, i-BBO) amadivayisi e-laser.
  • Uphawu lokubhekisela ebusweni be-sapphire wafer lwe-substrates ze-LED.

3. Izinto zobumba kanye nezinhlanganisela

  • Ihlaziya ukuqondiswa kokusanhlamvu ku-Si3N4 kanye ne-ZrO2 ukuze kusetshenziswe amazinga okushisa aphezulu.

4. Ucwaningo kanye nokulawulwa kwekhwalithi

  • Amanyuvesi/amalebhu okuthuthukiswa kwezinto ezintsha (isib., ama-alloy ane-entropy ephezulu).
  • I-QC Yezimboni ukuqinisekisa ukuhambisana kweqembu.

Izinsizakalo ze-XKH

I-XKH inikeza ukwesekwa kobuchwepheshe okuphelele komjikelezo wokuphila kwezinsimbi zokuqondiswa kwe-wafer, okuhlanganisa ukufakwa, ukulungiswa kwamapharamitha enqubo, ukuhlaziywa kwejika lokugwedla, kanye nokumapha kwe-3D surface defect mapping. Izixazululo ezenzelwe wena (isb., ubuchwepheshe be-ingot stacking) zinikezwa ukuthuthukisa ukusebenza kahle kokukhiqizwa kwe-semiconductor kanye nezinto ezibonakalayo ngaphezu kuka-30%. Ithimba elizinikele liqhuba ukuqeqeshwa endaweni, kuyilapho ukwesekwa okukude amahora angama-24 ngosuku, izinsuku eziyi-7 ngesonto kanye nokufakwa kwezingxenye ezisele ngokushesha kuqinisekisa ukuthembeka kwemishini.

  • Okwedlule:
  • Olandelayo:

    • Imikhiqizo Ehlobene

    Bhala umlayezo wakho lapha bese uwuthumela kithi
    Cindezela u-enter ukuze useshe noma u-ESC ukuze uvale