I-Precision Microjet Laser System ye-Hard & Brittle Materials

Incazelo emfushane:

Uhlolojikelele:

Idizayinelwe ukucutshungulwa okunembayo kwezinto ezinenani eliphezulu, eziqinile neziphukayo, lolu hlelo oluthuthukisiwe lwe-laser machining lusebenzisa ubuchwepheshe belaser ye-microjet obuhlanganiswe nomthombo we-laser we-DPSS Nd:YAG, ohlinzeka ngokusebenza kwamaza akabili ku-532nm naku-1064nm. Ngokuphuma kwamandla alungisekayo angu-50W, 100W, kanye no-200W, kanye nokunemba okuphawulekayo kokuma okungu-±5μm, isistimu ithuthukiselwe izinhlelo zokusebenza ezivuthiwe ezifana nokusikela, ukudayela, nokuzungezisa onqenqemeni kwamawafa e-silicon carbide. Iphinde isekele uhla olubanzi lwezinto zesizukulwane esilandelayo okuhlanganisa i-gallium nitride, idayimane, i-gallium oxide, izinhlanganisela ze-aerospace, ama-substrates e-LTCC, ama-wafers e-photovoltaic, namakristalu e-scintillator.

Ifakwe kokubili okukhethwa kukho kwemoto eqondile neqondile, le sistimu ifinyelela ukulingana okuphelele phakathi kokunemba okuphezulu nesivinini sokucubungula—okuyenza ifaneleke kuzo zombili izikhungo zocwaningo kanye nezindawo zokukhiqiza zezimboni.

Thumela i-imeyili kithi

Izici

Izici Eziyinhloko

1. Dual-Wavelength Nd:YAG Laser Source
Isebenzisa i-diode-pumped solid-state laser Nd:YAG, isistimu isekela kokubili ubude begagasi obuluhlaza (532nm) kanye ne-infrared (1064nm). Leli khono le-dual-band lenza ukuhambisana okuphakeme nenqwaba yamaphrofayili okumuncwa okubalulekile, ukuthuthukisa isivinini sokucubungula kanye nekhwalithi.

2. I-Innovative Microjet Laser Transmission
Ngokuhlanganisa i-laser ne-microjet yamanzi enengcindezi ephezulu, le sistimu isebenzisa ukuboniswa okuphelele kwangaphakathi ukuze kushaneli amandla e-laser eduze komfudlana wamanzi. Le ndlela yokulethwa eyingqayizivele iqinisekisa ukugxila okuhle kakhulu okunokuhlakazeka okuncane futhi iletha ububanzi bomugqa obucolisekileyo njengo-20μm, ihlinzeka ngekhwalithi yokusikwa engenakuqhathaniswa.

3. Ukulawula Okushisayo Esikalini Esincane
Imojuli ehlanganisiwe yokunemba yokupholisa amanzi ilawula izinga lokushisa endaweni yokucubungula, igcine indawo ethinteke ukushisa (HAZ) ngaphakathi kuka-5μm. Lesi sici sibaluleke kakhulu uma usebenza ngezinto ezingezwani nokushisa nezinto ezivame ukuphuka njenge-SiC noma i-GaN.

4. Ukucushwa kwe-Modular Power
Inkundla isekela izinketho ezintathu zamandla e-laser—50W, 100W, kanye no-200W—okuvumela amakhasimende ukuthi akhethe ukulungisa okufana nezidingo zawo zokuphuma nokuxazulula.

5. I-Precision Motion Control Platform
Uhlelo luhlanganisa isigaba sokunemba okuphezulu ngokuma okungu-±5μm, okuhlanganisa ukunyakaza kwe-axis engu-5 kanye namamothoni angakhethwa alayini noma ashayelayo. Lokhu kuqinisekisa ukuphindaphindwa okuphezulu kanye nokuguquguquka, ngisho namajiyometri ayinkimbinkimbi noma ukucubungula kwenqwaba.

Izindawo Zokufaka Isicelo

I-Silicon Carbide Wafer Processing:

Ilungele ukusika onqenqemeni, ukusika, nokudayela ama-wafer e-SiC ku-electronics power.

I-Gallium Nitride (GaN) Substrate Machining:

Isekela ukubhala nokusika okunembayo okuphezulu, okwenzelwe izinhlelo zokusebenza ze-RF ne-LED.

Ukuma kwe-Wide Bandgap Semiconductor:

Ihambisana nedayimane, i-gallium oxide, nezinye izinto ezivelayo zokusetshenziswa kwe-high-frequency, high-voltage.

I-Aerospace Composite Cutting:

Ukusikwa okunembile kwezinhlanganisela ze-ceramic matrix kanye nama-substrates ebanga le-aerospace-grade.

I-LTCC ne-Photovoltaic Materials:

Isetshenziselwa i-micro ngokubhola, i-trenching, kanye ne-scribing ku-PCB ye-high-frequency kanye nokukhiqizwa kwamaseli elanga.

I-Scintilator & Optical Crystal Shaping:

Inika amandla ukusika okunesici esiphansi kwe-yttrium-aluminium garnet, LSO, BGO, namanye ama-optics anembile.

Ukucaciswa

Ukucaciswa	Inani
Uhlobo lweLaser	I-DPSS Nd:YAG
Ama-Wavelengths Asekelwe	532nm / 1064nm
Izinketho zamandla	50W / 100W / 200W
Ukunemba Kokumisa	±5μm
Ubuncane Bobubanzi Bolayini	≤20μm
Indawo Ethinteke Ukushisa	≤5μm
Uhlelo Lokunyakaza	I-Linear / Direct-drive motor
I-Max Energy Density	Kufika ku-10⁷ W/cm²

Isiphetho

Lolu hlelo lwe-laser microjet luchaza kabusha imikhawulo yemishini ye-laser yezinto eziqinile, eziphukayo, nezizwela ukushisa. Ngokuhlanganiswa kwayo okuyingqayizivele kwe-laser-amanzi, ukuhambisana kwe-wavelength ekabili, kanye nesistimu yokunyakaza eguquguqukayo, inikeza isisombululo esilungiselelwe abacwaningi, abakhiqizi, nabahlanganisi besistimu abasebenza ngezinto ezisezingeni eliphezulu. Kungakhathaliseki ukuthi isetshenziswa kundwangu ye-semiconductor, amalebhu e-aerospace, noma ukukhiqizwa kwephaneli yelanga, le nkundla iletha ukwethembeka, ukuphindaphinda, nokunemba okunika amandla ukucubungula kwezinto zesizukulwane esilandelayo.