Uhlelo lwe-Precision Microjet Laser lwezinto eziqinile nezithambile

Incazelo emfushane:

Ukubuka konke:

Njengoba yakhelwe ukucutshungulwa ngokunembile kwezinto ezibiza kakhulu, eziqinile neziphuka kalula, lolu hlelo oluthuthukisiwe lokugaya i-laser lusebenzisa ubuchwepheshe be-laser ye-microjet obuhambisana nomthombo we-laser we-DPSS Nd:YAG, olunikeza ukusebenza kwe-wavelength ephindwe kabili ku-532nm kanye no-1064nm. Ngokukhishwa kwamandla okulungisekayo okungu-50W, 100W, kanye no-200W, kanye nokunemba okumangalisayo kokubeka okungu-±5μm, uhlelo lulungiselelwe izinhlelo zokusebenza ezivuthiwe njengokusika, ukunquma, kanye nokuzungeza unqenqema lwama-wafer e-silicon carbide. Iphinde isekele uhla olubanzi lwezinto zesizukulwane esilandelayo okuhlanganisa i-gallium nitride, idayimane, i-gallium oxide, ama-composites e-aerospace, ama-substrate e-LTCC, ama-wafer e-photovoltaic, namakristalu e-scintillator.

Ifakwe kokubili izinketho zenjini eziqondile nezishayela ngqo, lolu hlelo lufinyelela ibhalansi ephelele phakathi kokunemba okuphezulu kanye nesivinini sokucubungula—okwenza lube luhle kakhulu kokubili ezikhungweni zocwaningo kanye nasezindaweni zokukhiqiza zezimboni.

Sithumelele i-imeyili

Izici

Izici Eziyinhloko

1. Umthombo We-Laser Ongama-Dual-Wavelength Nd:YAG
Isebenzisa i-laser ye-Nd:YAG efakwe i-diode-pumped solid-state Nd:YAG, uhlelo lusekela amaza okukhanya aluhlaza (532nm) kanye ne-infrared (1064nm). Leli khono le-dual-band lenza kube nokuhambisana okuhle kakhulu nezinhlobo eziningi zamaphrofayili okumunca izinto, okuthuthukisa isivinini sokucubungula kanye nekhwalithi.

2. Ukudluliselwa Kwe-Microjet Laser Okusha
Ngokuhlanganisa i-laser ne-microjet yamanzi enomfutho ophezulu, lolu hlelo lusebenzisa ukubonakaliswa kwangaphakathi okuphelele ukuhambisa amandla e-laser ngqo emfuleni wamanzi. Le ndlela yokulethwa ehlukile iqinisekisa ukugxila okuhle kakhulu ngokusabalala okuncane futhi inikeza ububanzi bomugqa obungu-20μm, okunikeza ikhwalithi yokusika engenakuqhathaniswa.

3. Ukulawulwa Kokushisa Kwe-Micro Scale
Imojula yokupholisa amanzi ngokunemba ehlanganisiwe ilawula izinga lokushisa endaweni yokucubungula, igcina indawo ethintekile ekushiseni (HAZ) ingaphakathi kwama-5μm. Lesi sici sibaluleke kakhulu lapho usebenza ngezinto ezizwela ukushisa futhi ezivame ukuphuka njenge-SiC noma i-GaN.

4. Ukucushwa Kwamandla E-Modular
Ipulatifomu isekela izinketho ezintathu zamandla e-laser—50W, 100W, kanye no-200W—okuvumela amakhasimende ukuthi akhethe ukucushwa okuhambisana nezidingo zawo zokusebenzisa kanye nesisombululo.

5. Ipulatifomu Yokulawula Ukunyakaza Okunembile
Uhlelo luhlanganisa isigaba sokunemba okuphezulu esinokubekwa okungu-±5μm, okubonisa ukunyakaza okungu-5-axis kanye nama-motor aqondile noma aqondile angakhethwa. Lokhu kuqinisekisa ukuphindaphindeka okuphezulu kanye nokuguquguquka, ngisho nakuma-geometri ayinkimbinkimbi noma ukucubungula kweqembu.

Izindawo Zokufaka Isicelo

Ukucutshungulwa kwe-Silicon Carbide Wafer:

Ilungele ukusika, ukusika, kanye nokusika ama-wafer e-SiC kuma-electronics anamandla.

Umshini Wokwenza I-Gallium Nitride (GaN) Substrate:

Isekela ukubhala nokusika okunembe kakhulu, okwenzelwe izinhlelo zokusebenza ze-RF kanye ne-LED.

Ukwakhiwa kwe-Wide Bandgap Semiconductor:

Iyahambisana nedayimane, i-gallium oxide, nezinye izinto ezivelayo zezinhlelo zokusebenza ezisebenza ngesivinini esiphezulu, ezisebenza nge-voltage ephezulu.

Ukusikwa Kwe-Aerospace Composite:

Ukusikwa okunembile kwezinhlanganisela ze-ceramic matrix kanye nezingxenye ezisezingeni eliphezulu zezindiza.

Izinto ze-LTCC kanye ne-Photovoltaic:

Isetshenziselwa ukubhoboza, ukubhoboza imisele, kanye nokubhala ekukhiqizweni kwama-PCB namaseli elanga asebenza kakhulu.

Ukubumba Amakristalu Okubonakalayo kanye ne-Scintlator:

Ivumela ukusika okunesici esincane kwe-yttrium-aluminium garnet, i-LSO, i-BGO, kanye nezinye i-optics ezinembile.

Imininingwane

Imininingwane	Inani
Uhlobo lwe-Laser	I-DPSS Nd:YAG
Ubude bamagagasi busekelwe	532nm / 1064nm
Izinketho Zamandla	50W / 100W / 200W
Ukunemba Kokubeka	±5μm
Ububanzi Bomugqa Obuncane	≤20μm
Indawo Ethintekile Ekushiseni	≤5μm
Uhlelo Lokunyakaza	Injini eqondile/eqhutshwa ngqo
Ubuningi Bamandla Obuningi	Kufika ku-10⁷ W/cm²

Isiphetho

Lolu hlelo lwe-laser lwe-microjet luchaza kabusha imikhawulo yomshini we-laser wezinto eziqinile, ezibuthakathaka, nezizwela ukushisa. Ngokuhlanganisa kwayo okuhlukile kwe-laser namanzi, ukuhambisana kwe-dual-wavelength, kanye nohlelo lokunyakaza oluguquguqukayo, lunikeza ikhambi elenzelwe abacwaningi, abakhiqizi, kanye nabahlanganisi bezinhlelo abasebenza ngezinto ezisezingeni eliphezulu. Kungakhathaliseki ukuthi kusetshenziswa kuma-semiconductor fabs, ama-aerospace lab, noma ukukhiqizwa kwamaphaneli elanga, le nkundla inikeza ukuthembeka, ukuphindaphindeka, kanye nokunemba okunika amandla ukucubungula izinto zesizukulwane esilandelayo.