I-LNOI Wafer (i-Lithium Niobate ku-Insulator) I-Telecommunications Sensing High Electro-Optic
Umdwebo Oningiliziwe
Ukubuka konke
Ngaphakathi kwebhokisi le-wafer kunemifantu elinganayo, ubukhulu bayo bufana ngokuphelele ukusekela izinhlangothi ezimbili ze-wafer. Ibhokisi lekristalu ngokuvamile lenziwe ngezinto ze-PP zepulasitiki ezikhanyayo ezingamelani nokushisa, ukuguguleka kanye nogesi ongashintshi. Imibala ehlukene yezithasiselo isetshenziselwa ukuhlukanisa izingxenye zenqubo yensimbi ekukhiqizweni kwe-semiconductor. Ngenxa yobukhulu obuncane be-semiconductors, amaphethini aminyene, kanye nezidingo zobukhulu bezinhlayiya eziqinile ekukhiqizweni, ibhokisi le-wafer kumele liqinisekiswe indawo ehlanzekile yokuxhuma emgodini wokusabela kwebhokisi lemvelo elincane lemishini ehlukene yokukhiqiza.
Indlela Yokukhiqiza
Ukwenziwa kwama-wafer e-LNOI kuqukethe izinyathelo eziningana eziqondile:
Isinyathelo 1: Ukufakelwa kwe-Helium IonAma-ion e-Helium afakwa ku-crystal ye-LN eningi kusetshenziswa i-implanter yama-ion. Lawa ma-ion ahlala ekujuleni okuthile, akha indiza ebuthaka ezokwenza kube lula ukuhlukanisa ifilimu ekugcineni.
Isinyathelo 2: Ukwakheka Kwesisekelo Se-SubstrateI-silicon noma i-LN wafer ehlukile ifakwa i-oxidized noma ibekwe nge-SiO2 kusetshenziswa i-PECVD noma i-thermal oxidation. Ingxenye yayo engaphezulu ihlelwe ngendlela yokuthi ihlanganiswe kahle.
Isinyathelo 3: Ukuhlanganiswa kwe-LN ne-SubstrateIkristalu le-LN elifakwe kuma-ion liyaphendulwa futhi linamathiselwe ku-base wafer kusetshenziswa i-direct wafer bonding. Ezimweni zocwaningo, i-benzocyclobutene (BCB) ingasetshenziswa njenge-glue ukuze kube lula ukubopha ngaphansi kwezimo eziqinile.
Isinyathelo 4: Ukwelashwa Kokushisa Nokuhlukaniswa KwamafilimuUkufakwa kwe-Annealing kuvuselela ukwakheka kwama-bubble ekujuleni okufakiwe, okuvumela ukuhlukaniswa kwefilimu encane (ungqimba oluphezulu lwe-LN) kusuka ku-bulk. Amandla omshini asetshenziswa ukuqedela ukukhishwa kwe-exfoliation.
Isinyathelo 5: Ukupholisha OkungaphezuluI-Chemical Mechanical Polishing (CMP) isetshenziswa ukuze kusheleleze ubuso obuphezulu be-LN, okuthuthukisa ikhwalithi yokukhanya kanye nokukhiqizwa kwedivayisi.
Amapharamitha Obuchwepheshe
| Izinto | Optical Ibanga I-LiNbO3 ama-wafes (amhlophe or Mnyama) | |
| I-Curie Izinga lokushisa | 1142±0.7℃ | |
| Ukusika I-engela | X/Y/Z njll. | |
| Ububanzi/usayizi | 2”/3”/4” ±0.03mm | |
| I-Tol(±) | <0.20 mm ±0.005mm | |
| Ubukhulu | 0.18～0.5mm noma ngaphezulu | |
| Okuyinhloko Ifulethi | 16mm/22mm/32mm | |
| I-TTV | <3μm | |
| Umnsalo | -30 | |
| I-Warp | <40μm | |
| Ukuqondiswa Ifulethi | Konke kuyatholakala | |
| Ubuso Uhlobo | Icala Elilodwa Elipholishiwe (SSP)/Izinhlangothi Ezimbili Ezipholishiwe (DSP) | |
| Kupholishiwe uhlangothi Ra | <0.5nm | |
| I-S/D | 20/10 | |
| Umphetho Imigomo | R=0.2mm Uhlobo lwe-C or Impumulo yenkomo | |
| Ikhwalithi | Mahhala of ukuqhekeka (amabhamuza futhi ukufakwa) | |
| Optical ukudakwa | I-Mg/Fe/Zn/MgO njll. ngoba ukukhanya ibanga I-LN ama-wafer nge kuceliwe | |
| I-Wafer Ubuso Imigomo | Inkomba yokubuka | Cha=2.2878/Ne=2.2033 @632nm indlela yokuxhuma ubude be-wavelength/prism. |
| Ukungcola, | Akukho | |
| Izinhlayiya c>0.3μ m | <=30 | |
| Ukuklwebha, Ukuqhekeza | Akukho | |
| Isici | Akukho ukuqhekeka komphetho, imihuzuko, amabala esaha, amabala | |
| Ukupakisha | Ubuningi/Ibhokisi le-Wafer | 25pcs ngebhokisi ngalinye |
Amakesi Okusetshenziswa
Ngenxa yokusebenza kwayo okuhlukahlukene, i-LNOI isetshenziswa emikhakheni eminingi:
Ama-Photonics:Ama-modulators aqinile, ama-multiplexers, kanye nama-photonic circuits.
I-RF/Acoustics:Ama-modulators e-Acousto-optic, izihlungi ze-RF.
Ikhompyutha ye-Quantum:Abaxubi bemvamisa abangewona umugqa kanye namajeneretha e-photon-pair.
Ukuzivikela kanye Nezindiza:Ama-gyro optical aphansi, amadivayisi okushintsha imvamisa.
Amadivayisi Ezokwelapha:Ama-biosensor optical kanye nama-probe esignali avame kakhulu.
Imibuzo Evame Ukubuzwa
Q: Kungani i-LNOI ikhethwa kakhulu kune-SOI ezinhlelweni zokukhanya?
A:I-LNOI inama-coefficients aphezulu e-electro-optic kanye nobubanzi obubanzi bokucaca, okuvumela ukusebenza okuphezulu kumasekethe e-photonic.
Q: Ingabe i-CMP iyimpoqo ngemva kokuhlukana?
A:Yebo. Ubuso be-LN obuveziwe buqinile ngemva kokusikwa kwe-ion futhi kumele bupholishwe ukuze kuhlangatshezwane nezimiso ze-optical-grade.
Q: Ungakanani usayizi we-wafer otholakalayo?
A:Ama-wafer e-LNOI ebhizinisini ngokuyinhloko angama-3” kanye nama-4”, yize abanye abahlinzeki bethuthukisa izinhlobo ezingama-6”.
U: Ingabe ungqimba lwe-LN lungasetshenziswa kabusha ngemva kokuhlukaniswa?
A:Ikristalu eyisisekelo ingaphinde ipholishwe futhi isetshenziswe kabusha izikhathi eziningana, yize ikhwalithi ingase yonakale ngemva kwemijikelezo eminingi.
Q: Ingabe ama-wafer e-LNOI ayahambisana nokucutshungulwa kwe-CMOS?
A:Yebo, zenzelwe ukuhambisana nezinqubo zokwenziwa kwe-semiconductor ezivamile, ikakhulukazi lapho kusetshenziswa ama-substrate e-silicon.
