I-Diamond-Copper Composite Thermal Management Materials

Incazelo emfushane:

I-Diamond-Copper Composite (Cu-Diamond) iwumsebenzi wokuphatha ukushisa okuphezulu okuphezulu kakhulu ohlanganisa i-conductor yokushisa ehamba phambili emhlabeni - idayimane - kanye nezimfanelo eziphakeme zikagesi nezemishini zethusi.
Idizayinelwe ukusika ugesi kanye namadivayisi kagesi, le nhlanganisela ifinyelela ibhalansi eyingqayizivele ye-thermal conductivity eyedlulele, ukunwetshwa kokushisa okulawulekayo, nokuzinza kwemishini, okuvumela ukusebenza okuthembekile ngisho nangaphansi kwezindawo ezishisayo ezidinga kakhulu.

Thumela i-imeyili kithi

Izici

Umdwebo onemininingwane

Isingeniso Somkhiqizo

IInhlanganisela ye-Diamond-Copper (Cu-Diamond)yi-Izinto zokuphatha ezishisayo ezisebenza kakhuluehlanganisa isikhombisi sokushisa esingcono kakhulu emhlabeni -idayimane- ngezici eziphakeme zikagesi nezemishini zeithusi.
Idizayinelwe izinto zikagesi ezisezingeni eliphezulu kanye namadivayisi kagesi, le nhlanganisela ifinyelela ibhalansi eyingqayiziveleukuziphatha okushisayo okwedlulele, ukunwetshwa kokushisa okulawulekayo, futhiukuzinza kwemishini, okuvumela ukusebenza okuthembekile ngisho nangaphansi kwezindawo ezishisayo ezidinga kakhulu.

Ngokungafani ne-copper evamile, i-tungsten, noma i-molybdenum-based substrates, izinhlanganisela ze-Diamond-Copper ziyaletha.kuze kube kabili i-thermal conductivityngenkathi kunciphisa kakhulu isisindo, okwenza kube yisinqumo esikhethwayoukupakishwa kwe-semiconductor, izinhlelo ze-laser, i-aerospace electronics, namamojula we-LED wamandla aphezulu.

Isimiso Esibalulekile

Enhliziyweni yenhlanganisela amangaizinhlayiya zedayimaneishumekwe ngokulinganayo ngaphakathi kwe-ai-matrix yethusi.
I-particle ngayinye yedayimane isebenza njenge-micro heat sink, isakaza ukushisa ngokushesha, kuyilapho i-matrix yethusi iqinisekisa ukuqhutshwa kukagesi kanye nobuqotho besakhiwo.
Ngezindlela ezithuthukisiwe zokukhiqiza - kufaka phakathiukungena kwe-vacuum, enamathela amakhemikhali, futhii-spark plasma sintering (SPS)- kwakhiwa ibhondi yokusebenzelana eqinile futhi ezinzile, eqinisekisa ukwethembeka kwesikhathi eside ngaphansi kokuhamba ngebhayisikili okushisayo okuqhubekayo.

Amaphuzu Avelele Ezobuchwepheshe

Impahla	Inani / Incazelo
I-Thermal Conductivity	400 – 700 W/m·K
I-Coefficient of Thermal Expansion (CTE)	5 – 8 × 10⁻⁶/K
I-Density	6.0 – 7.0 g/cm³
I-Surface Finish	I-Ni/Au plating iyatholakala ukuze ihlanganiswe noma ibhuqe
Ukwenza ngokwezifiso	Okuqukethwe kwedayimane kanye ne-CTE kungafanelana nezidingo zamakhasimende

Izinhlelo zokusebenza

Amamojula Amandla Aphezulu Semiconductor(IGBT, MOSFET, RF & microwave package)
I-Laser Diodes kanye namadivayisi we-Optoelectronic
I-Aerospace kanye ne-Defence Cooling Systems
Izisakazeli zokushisa ze-LED ezisebenza kahle kakhulu
I-IC kanye ne-CPU Heat Sinks for Advanced Computing
Ama-Amplifaya Amandla kanye Nezisetshenziswa Zokuxhumana Ze-Optical

Kungani Khetha Inhlanganisela ye-Diamond-Copper?

Ngobaizindaba zokushisa.
Esikhathini se-miniaturization kanye nokuminyana kwamandla aphezulu, ukuphatha ukushisa kuchaza kahle impilo nokusebenza kwayo yonke idivayisi.
Inhlanganisela ye-Cu-Diamond iqinisekisa:

Impilo yedivayisi ende
Ukuzinza okuthuthukisiwe kokusebenza
Ukusebenza kahle kwamandla okuthuthukisiwe
Ukunciphisa ukukhathala okushisayo

I-FAQ Yezingilazi Zequartz

I-Q1: Ingabe izinhlanganisela ze-Cu-Diamond zingenziwa ngezifiso izinto ezithile ze-chip?
Yebo. Ingxenye yevolumu yedayimane kanye ne-CTE ingashunwa kahle ukuze ifane namadivayisi asekelwe ku-Si, GaN, noma i-SiC.

Q2: Ingabe i-metallization iyadingeka ngaphambi kokudayiswa?
Yebo. I-Surface metallization (i-Ni/Au, i-Ti/Ni/Au) iyanconywa ukuze kuqinisekiswe ukuhlangana okuhle kakhulu nokumelana nokushisa okuncane.

I-Q3: Isebenza kanjani ngaphansi kwezimo zokushisa okuphezulu noma okushaywa umoya?
Ukusabalalisa ukushisa okuphakeme kwedayimane kuqinisekisa ukulingana kwezinga lokushisa okusheshayo, okulenza lilungele imvamisa ephezulu kanye nezingxenye ezilayishwe ukushaya kwenhliziyo.

Q4: Iyini izinga lokushisa eliphezulu lokusebenza?
Inhlanganisela ihlala izinzile kuze kube600°Cendaweni engenalutho noma ye-vacuum, kuye ngokuthi i-coating ne-bonding interface.

Mayelana NATHI

I-XKH igxile ekuthuthukisweni kobuchwepheshe obuphezulu, ukukhiqiza, nokudayiswa kwengilazi ekhethekile yokubona nezinto ezintsha zekristalu. Imikhiqizo yethu isebenza ngogesi obonakalayo, ugesi wabathengi, kanye nezempi. Sinikezela ngezinto ezibonakalayo ze-Sapphire, izembozo zamalensi omakhalekhukhwini, i-Ceramics, i-LT, i-Silicon Carbide SIC, i-Quartz, namawafa ekristalu e-semiconductor. Ngobungcweti abanamakhono nemishini esezingeni eliphezulu, sihamba phambili ekucutshungulweni komkhiqizo okungajwayelekile, sihlose ukuba yibhizinisi elihamba phambili le-optoelectronic materials high-tech.