I-CNC Ingot Rounding Machine (yeSapphire, SiC, njll.)

Umshini Ozungezayo we-CNC Ingot (ye-Sapphire, i-SiC, njll.) Isithombe Esifakiwe

Incazelo emfushane:

Uhlolojikelele:

Umshini Wokuzungeza I-CNC Ingot uyisisombululo esiphezulu, esihlakaniphile sokucubungula esenzelwe ukubumba kabusha izinto zekristalu eqinile njengesafire (Al₂O₃), i-silicon carbide (SiC), i-YAG, nezinye. Lesi sisetshenziswa esithuthukisiwe siklanyelwe ukuguqula ama-ingots ekristalu angajwayelekile noma akhule abe yizimo ezijwayelekile zesilinda ezinobukhulu obunembile kanye nokuqedwa kwendawo. Ihambisana nesistimu yokulawula eshayelwa yi-servo eyinkimbinkimbi namayunithi okugaya ngokwezifiso, inikezela ngokuzenzakalelayo okugcwele, okuhlanganisa ukubeka phakathi nendawo okuzenzakalelayo, ukugaya, nokulungiswa kobukhulu. Ilungele ukucutshungulwa okuphezulu embonini ye-LED, ye-optics, ne-semiconductor.

Thumela i-imeyili kithi

Izici

Izici Eziyinhloko

Iyahambisana Nezinto Ezihlukahlukene Zekristalu

Iyakwazi ukucubungula isafire, i-SiC, i-quartz, i-YAG, nezinye izinti zekristalu eqinile. Idizayini eguquguqukayo yokuhambisana kwezinto ezibanzi.

High-Precision CNC Control

Ifakwe inkundla ye-CNC ethuthukisiwe eyenza ukulandelela isikhundla sesikhathi sangempela nesinxephezelo esizenzakalelayo. Ukubekezelela kobubanzi bangemva kokucubungula kungagcinwa phakathi kuka-±0.02 mm.

I-Automated Centering kanye Nokulinganisa

Ihlanganiswe nesistimu yokubona ye-CCD noma imojuli yokuqondanisa i-laser ukuze ibeke phakathi ngokuzenzakalelayo i-ingot futhi ithole amaphutha okuqondanisa kwe-radial. Khulisa isivuno sokudlula kuqala futhi kunciphisa ukungenelela okwenziwa ngesandla.

Izindlela Zokugaya Ezihlelekayo

Isekela amasu amaningi okuzungeza: ukubunjwa kwe-cylindrical okujwayelekile, ukushelela kokungasebenzi kahle kwendawo, kanye nokulungiswa kwekhonta ngendlela oyifisayo.

I-Modular Mechanical Design

Yakhiwe ngezici ze-modular kanye ne-footprint ehlangene. Isakhiwo esenziwe lula siqinisekisa ukunakekelwa okulula, ukushintshwa kwengxenye ngokushesha, kanye nesikhathi esincane sokuphumula.

Ukupholisa Okudidiyelwe Nothuli Ukuqoqwa

Ifaka isistimu enamandla yokupholisa amanzi ehlanganiswe neyunithi yokukhipha uthuli ecindezelwe evaliwe. Yehlisa ukuhlanekezela okushisayo kanye nezinhlayiya ezihamba emoyeni ngesikhathi sokugaya, iqinisekisa ukusebenza okuphephile nokuzinzile.

Izindawo Zokufaka Isicelo

I-Sapphire Wafer Pre-processing yama-LED

Isetshenziselwa ukubumba ama-ingots wesafire ngaphambi kokusikwa kuma-wafers. Ukuzungezisa okufanayo kuthuthukisa kakhulu isivuno futhi kunciphisa umonakalo onqenqemeni lwe-wafer ngesikhathi sokusika okulandelayo.

I-SiC Rod Grinding Yokusetshenziswa Kwe-Semiconductor

Ibalulekile ekulungiseleleni i-silicon carbide ingots ezinhlelweni zikagesi zikagesi. Inika amandla ububanzi obungaguquki kanye nekhwalithi yendawo ephezulu, ebalulekile ekukhiqizeni i-SiC wafer enesivuno esiphezulu.

I-Optical kanye ne-Laser Crystal Shaping

Ukufinyezwa okunembayo kwe-YAG, Nd:YVO₄, nezinye izinto ze-laser kuthuthukisa i-optical symmetry kanye nokufana, kuqinisekisa ukuphuma okungaguquki kwe-beam.

Ucwaningo Nokulungiselela Okubalulekile

Kuthenjwa amanyuvesi namalebhu ocwaningo ukuze kulungiswe umzimba wamakristalu anoveli ukuze kuhlaziywe umumo nokuhlolwa kwesayensi yezinto.

Ukucaciswa Kwe

Ukucaciswa	Inani
Uhlobo lweLaser	I-DPSS Nd:YAG
Ama-Wavelengths Asekelwe	532nm / 1064nm
Izinketho zamandla	50W / 100W / 200W
Ukunemba Kokumisa	±5μm
Ubuncane Bobubanzi Bolayini	≤20μm
Indawo Ethinteke Ukushisa	≤5μm
Uhlelo Lokunyakaza	I-Linear / Direct-drive motor
I-Max Energy Density	Kufika ku-10⁷ W/cm²

Isiphetho

Lolu hlelo lwe-laser microjet luchaza kabusha imikhawulo yemishini ye-laser yezinto eziqinile, eziphukayo, nezizwela ukushisa. Ngokuhlanganiswa kwayo okuyingqayizivele kwe-laser-amanzi, ukuhambisana kwe-wavelength ekabili, kanye nesistimu yokunyakaza eguquguqukayo, inikeza isisombululo esilungiselelwe abacwaningi, abakhiqizi, nabahlanganisi besistimu abasebenza ngezinto ezisezingeni eliphezulu. Kungakhathaliseki ukuthi isetshenziswa kundwangu ye-semiconductor, amalebhu e-aerospace, noma ukukhiqizwa kwephaneli yelanga, le nkundla iletha ukwethembeka, ukuphindaphinda, nokunemba okunika amandla ukucubungula kwezinto zesizukulwane esilandelayo.