Umshini Wokuzungeza we-CNC Ingot (weSapphire, i-SiC, njll.)

Isithombe Esivelele Somshini Wokuzungeza we-CNC Ingot (we-Sapphire, i-SiC, njll.)

Incazelo emfushane:

Ukubuka konke:

Umshini Wokuzungeza Ingot we-CNC uyisisombululo sokucubungula esinembile kakhulu nesihlakaniphile esenzelwe ukushintsha izinto zekristalu eqinile njenge-sapphire (Al₂O₃), i-silicon carbide (SiC), i-YAG, nezinye. Lo mshini othuthukisiwe wenzelwe ukuguqula ama-ingot ekristalu angajwayelekile noma akhuliswe abe yizimo ezijwayelekile ze-cylindrical ezinobukhulu obuqondile kanye nokuqedwa kobuso. Unesistimu yokulawula eqhutshwa yi-servo eyinkimbinkimbi kanye namayunithi okugaya ngokwezifiso, unikeza ukuzenzekela okugcwele, kufaka phakathi ukugxilisa okuzenzakalelayo, ukugaya, kanye nokulungiswa kobukhulu. Ilungele ukucutshungulwa okuphezulu embonini ye-LED, i-optics, kanye ne-semiconductor.

Sithumelele i-imeyili

Izici

Izici Eziyinhloko

Iyahambisana nezinto ezahlukahlukene zekristalu

Iyakwazi ukucubungula i-sapphire, i-SiC, i-quartz, i-YAG, nezinye izinduku zekristalu eziqinile kakhulu. Idizayini eguquguqukayo yokuhambisana nezinto eziningi.

Ukulawulwa kwe-CNC Okunembe Kakhulu

Ifakwe ipulatifomu ye-CNC ethuthukisiwe evumela ukulandelela isikhundla ngesikhathi sangempela kanye nokubuyiselwa okuzenzakalelayo. Ukubekezelelana kobubanzi ngemuva kokucubungula kungagcinwa ngaphakathi kuka-±0.02 mm.

Ukubeka Ephakathi Nokulinganisa Okuzenzakalelayo

Kuhlanganiswe nohlelo lokubona lwe-CCD noma imojuli yokuqondanisa nge-laser ukuze kugxilwe ngokuzenzakalelayo ku-ingot futhi kutholakale amaphutha okuqondanisa nge-radial. Kwandisa isivuno sokuqala futhi kunciphisa ukungenelela ngesandla.

Izindlela Zokugaya Ezingahlelwa

Isekela amasu amaningi okuzungeza: ukwakheka okujwayelekile kwesilinda, ukushelela amaphutha ebusweni, kanye nokulungiswa kwe-contour okwenziwe ngokwezifiso.

Umklamo Wemishini Eyi-Modular

Yakhiwe ngezingxenye ze-modular kanye nendawo encane. Isakhiwo esilula siqinisekisa ukulungiswa okulula, ukushintshwa kwezingxenye okusheshayo, kanye nesikhathi esincane sokungasebenzi.

Ukuqoqwa Okuhlanganisiwe Kokupholisa Nothuli

Inesistimu esinamandla sokupholisa amanzi esihambisana neyunithi yokukhipha uthuli olucindezelwe kabi oluvaliwe. Yehlisa ukuphambuka kokushisa kanye nezinhlayiya eziphuma emoyeni ngesikhathi sokugaya, iqinisekisa ukusebenza okuphephile nokuzinzile.

Izindawo Zokufaka Isicelo

Ukucubungula kusengaphambili kwe-Sapphire Wafer kwama-LED

Isetshenziselwa ukwakha ama-sapphire ingots ngaphambi kokuwasika abe ama-wafer. Ukugoqa okufanayo kuthuthukisa kakhulu isivuno futhi kunciphisa umonakalo womphetho we-wafer ngesikhathi sokusika okulandelayo.

Ukugaya Induku ye-SiC Yokusetshenziswa Kwe-Semiconductor

Kubalulekile ekulungiseleleni ama-ingot e-silicon carbide ekusetshenzisweni kwamandla kagesi. Ivumela ububanzi obuhambisanayo kanye nekhwalithi yobuso, okubalulekile ekukhiqizweni kwe-wafer ye-SiC ekhiqiza kakhulu.

Ukubumba Amakristalu Okukhanya kanye Ne-Laser

Ukuzungeza kahle i-YAG, i-Nd:YVO₄, nezinye izinto ze-laser kuthuthukisa ukulingana kokukhanya kanye nokufana, okuqinisekisa ukuphuma kwe-beam okuhambisanayo.

Ukulungiselela Ucwaningo Nokuhlola Izinto

Ithenjwe amanyuvesi kanye namalebhu ocwaningo ukuze kuklanywe amakristalu amasha ukuze kuhlaziywe ukuqondiswa kanye nokuhlolwa kwesayensi yezinto ezibonakalayo.

Imininingwane Ka

Imininingwane	Inani
Uhlobo lwe-Laser	I-DPSS Nd:YAG
Ubude bamagagasi busekelwe	532nm / 1064nm
Izinketho Zamandla	50W / 100W / 200W
Ukunemba Kokubeka	±5μm
Ububanzi Bomugqa Obuncane	≤20μm
Indawo Ethintekile Ekushiseni	≤5μm
Uhlelo Lokunyakaza	Injini eqondile/eqhutshwa ngqo
Ubuningi Bamandla Obuningi	Kufika ku-10⁷ W/cm²

Isiphetho

Lolu hlelo lwe-laser lwe-microjet luchaza kabusha imikhawulo yomshini we-laser wezinto eziqinile, ezibuthakathaka, nezizwela ukushisa. Ngokuhlanganisa kwayo okuhlukile kwe-laser namanzi, ukuhambisana kwe-dual-wavelength, kanye nohlelo lokunyakaza oluguquguqukayo, lunikeza ikhambi elenzelwe abacwaningi, abakhiqizi, kanye nabahlanganisi bezinhlelo abasebenza ngezinto ezisezingeni eliphezulu. Kungakhathaliseki ukuthi kusetshenziswa kuma-semiconductor fabs, ama-aerospace lab, noma ukukhiqizwa kwamaphaneli elanga, le nkundla inikeza ukuthembeka, ukuphindaphindeka, kanye nokunemba okunika amandla ukucubungula izinto zesizukulwane esilandelayo.