I-4inch Silicon wafer FZ CZ N-Type DSP noma ibanga lokuhlola le-SSP

Incazelo emfushane:

I-silicon wafer iyishidi elincanyana elisikwe ku-silicon eyodwa ye-crystal.Ama-wafer e-Silicon atholakala ngo-2-intshi, 3-intshi, 4-intshi, 6-intshi, no-8-intshi ububanzi, futhi asetshenziswa kakhulu ukukhiqiza amasekhethi ahlanganisiwe.Ama-wafers e-Silicon ayimpahla nje eluhlaza futhi ama-chips angumkhiqizo oqediwe.Amawafa e-silicon ayizinto ezibalulekile zokwenza amasekethe ahlanganisiwe, futhi amadivaysi e-semiconductor ahlukahlukene angenziwa ngokusebenzisa i-photolithography nokufakwa kwe-ion kumawafa e-silicon.

Thumela i-imeyili kithi

Imininingwane Yomkhiqizo

Omaka bomkhiqizo

Ukwethulwa kwebhokisi le-wafer

Ama-silicone wafers ayingxenye ebalulekile yomkhakha wezobuchwepheshe okhulayo wanamuhla.Imakethe yezinto zokwakha ze-semiconductor idinga ama-silicon wafers anemininingwane eqondile ukukhiqiza inani elikhulu lamadivayisi wesekethe ahlanganisiwe.Siyaqaphela ukuthi njengoba izindleko zokukhiqiza i-semiconductor zikhuphuka, kanjalo nezindleko zalezo zinto zokukhiqiza, njengama-silicon wafers.Siyakuqonda ukubaluleka kwekhwalithi nokusebenza kahle kwezindleko emikhiqizweni esiyinikeza amakhasimende ethu.Sinikeza ama-wafers angabizi futhi anekhwalithi engashintshi.Sikhiqiza ikakhulukazi ama-silicon wafers nama-ingots (CZ), ama-epitaxial wafers, namawafa e-SOI.

Ububanzi	Ububanzi	Ipholishiwe	I-Doped	Ukuqondisa	Ukumelana/Ω.cm	Ubukhulu/um
2intshi	50.8±0.5mm	I-SSP I-DSP	P/N	100	1-20	200-500
3inch	76.2±0.5mm	I-SSP I-DSP	P/B	100	NA	525±20
4	101.6±0.2 101.6±0.3 101.6±0.4	I-SSP I-DSP	P/N	100	0.001-10	200-2000
6	152.5±0.3	I-SSP I-DSP	P/N	100	1-10	500-650
8	200±0.3	I-DSP I-SSP	P/N	100	0.1-20	625

Ukusetshenziswa kwama-wafers e-silicon

I-Substrate: I-PECVD/LPCVD enamathela, i-magnetron sputtering

I-Substrate: I-XRD, i-SEM, i-atomic force infrared spectroscopy, i-electron microscopy yokudlulisa, i-fluorescence spectroscopy nezinye izivivinyo zokuhlaziya, ukukhula kwe-molecular beam epitaxial, ukuhlaziya i-X-ray yokucubungula kwe-crystal microstructure: i-etching, i-bonding, amadivayisi we-MEMS, izisetshenziswa zikagesi, amadivayisi we-MOS nokunye. ukucubungula

Kusukela 2010, Shanghai XKH Material Tech.I-Co., Ltd izibophezele ekuhlinzekeni amakhasimende ngezixazululo ezibanzi ezingu-4-intshi ze-Silicon Wafer, kusukela kuma-wafers wezinga lokulungisa i-Dummy Wafer, ama-wafers wokuhlola izinga lokuhlola, kuya kuma-wafers wezinga lomkhiqizo i-Prime Wafer, kanye namawafa akhethekile, ama-Oxide wafers Oxide, Amawafa e-Nitride i-Si3N4, amawafa e-Aluminium plated, amawafa e-silicon e-Copper plated, i-SOI Wafer, i-MEMS Glass, amawafa enziwe ngokwezifiso ama-ultra-thick and ultra-flat, njll., anosayizi abasukela ku-50mm-300mm, futhi singahlinzeka ngamawafa e-semiconductor anohlangothi olulodwa /ukupholisha okunezinhlangothi ezimbili, ukunciphisa, ukudayela, i-MEMS nezinye izinkonzo zokucubungula nokwenza ngokwezifiso.