I-4inch Silicon wafer FZ CZ N-Type DSP noma ibanga lokuhlola le-SSP

4inch Silicon wafer FZ CZ N-Type DSP noma Ibanga Lokuhlola le-SSP Isithombe Esifakiwe

Incazelo emfushane:

I-silicon wafer iyishidi elincanyana elisikwe ku-silicon eyodwa ye-crystal. Ama-wafer e-Silicon atholakala ngo-2-intshi, 3-intshi, 4-intshi, 6-intshi, no-8-intshi ububanzi, futhi asetshenziswa kakhulu ukukhiqiza amasekhethi ahlanganisiwe. Ama-wafers e-Silicon ayimpahla nje eluhlaza futhi ama-chips angumkhiqizo oqediwe. Amawafa e-silicon ayizinto ezibalulekile zokwenza amasekethe ahlanganisiwe, futhi amadivaysi e-semiconductor ahlukahlukene angenziwa ngokusebenzisa i-photolithography nokufakwa kwe-ion kumawafa e-silicon.

Thumela i-imeyili kithi

Imininingwane Yomkhiqizo

Omaka bomkhiqizo

Ukwethulwa kwebhokisi le-wafer

Ama-silicone wafers ayingxenye ebalulekile yomkhakha wezobuchwepheshe okhulayo wanamuhla. Imakethe yezinto zokwakha ze-semiconductor idinga ama-silicon wafers anemininingwane eqondile ukukhiqiza inani elikhulu lamadivayisi wesekethe ahlanganisiwe. Siyaqaphela ukuthi njengoba izindleko zokukhiqiza i-semiconductor zikhuphuka, kanjalo nezindleko zalezo zinto zokwakha, njengama-silicon wafers. Siyakuqonda ukubaluleka kwekhwalithi nokusebenza kahle kwezindleko emikhiqizweni esiyinikeza amakhasimende ethu. Sinikeza ama-wafers angabizi futhi anekhwalithi engashintshi. Sikhiqiza ikakhulukazi ama-silicon wafers nama-ingots (CZ), ama-epitaxial wafers, namawafa e-SOI.

Ububanzi	Ububanzi	Ipholishiwe	I-Doped	Ukuqondisa	Ukumelana/Ω.cm	Ubukhulu/um
2intshi	50.8±0.5mm	I-SSP I-DSP	P/N	100	1-20	200-500
3inch	76.2±0.5mm	I-SSP I-DSP	P/B	100	NA	525±20
4intshi	101.6±0.2 101.6±0.3 101.6±0.4	I-SSP I-DSP	P/N	100	0.001-10	200-2000
6intshi	152.5±0.3	I-SSPI-DSP	P/N	100	1-10	500-650
8inch	200±0.3	I-DSPI-SSP	P/N	100	0.1-20	625

Ukusetshenziswa kwama-wafers e-silicon

I-Substrate: I-PECVD/LPCVD enamathela, i-magnetron sputtering

I-Substrate: I-XRD, i-SEM, i-atomic force infrared spectroscopy, i-electron microscopy yokudlulisa, i-fluorescence spectroscopy nezinye izivivinyo zokuhlaziya, ukukhula kwe-molecular beam epitaxial, ukuhlaziya i-X-ray yokucubungula kwe-crystal microstructure: i-etching, i-bonding, amadivayisi we-MEMS, izisetshenziswa zikagesi, amadivaysi e-MOS nokunye. ukucubungula

Kusukela 2010, Shanghai XKH Material Tech. I-Co., Ltd izibophezele ekuhlinzekeni amakhasimende ngezixazululo ezibanzi ezingu-4-intshi ze-Silicon Wafer, kusukela kuma-wafers wezinga lokulungisa i-Dummy Wafer, ama-wafers wokuhlola izinga lokuhlola, kuya kuma-wafers wezinga lomkhiqizo i-Prime Wafer, kanye namawafa akhethekile, ama-Oxide wafers Oxide, I-Nitride wafers i-Si3N4, ama-wafers ane-Aluminium plated, ama-silicon wafers ane-Copper plated, i-SOI Wafer, Ingilazi ye-MEMS, amawafa angokwezifiso amakhulu kakhulu nayisicaba, njll., anosayizi abasukela ku-50mm-300mm, futhi singahlinzeka ngamawafa angama-semiconductor anokupholishwa okuyingxenye eyodwa/ekabili, ukucwenga, ukudayela, i-MEMS nokunye ukucubungula nokwenza ngendlela oyifisayo. amasevisi.