12inch 300mm single wafer substrate carrier box of PC and PP

12inch 300mm ibhokisi lesiphakeli le-wafer substrate elilodwa le-PC kanye ne-PP Isithombe Esifakiwe

Incazelo emfushane:

Inkampani yethu ihlinzeka ngamayintshi angu-1, ama-intshi angu-2, ama-intshi angu-3, ama-intshi angu-4, ama-intshi angu-6, ama-intshi angu-8, ama-intshi angu-10, ibhokisi le-wafer elilodwa lama-intshi angu-12, ibhokisi le-wafer elilodwa, ibhokisi le-wafer eyodwa, ithreyi yokupakisha ye-chip ye-IC, ibambisene namanyuvesi amaningi aphesheya. kanye nezikhungo zocwaningo lwesayensi, izinga eliphezulu, intengo ephansi inhloso yethu yebhizinisi, wamukelekile amakhasimende ukuthenga!

Thumela i-imeyili kithi

Imininingwane Yomkhiqizo

Omaka bomkhiqizo

Ukwethulwa kwebhokisi le-wafer

Ibhokisi le-wafer elingu-12-intshi lenziwe ngezinto ze-PC (polycarbonate).Ingamandla aphezulu, izinga lokushisa eliphezulu kanye nezinto ezimelana namakhemikhali ezinokukhanya okuhle kanye nezakhiwo zokuvikela ugesi.

Umkhiqizo usetshenziswa ngokuyinhloko embonini yokukhiqiza i-semiconductor kanye nezimboni zesekethe ezididiyelwe njengesiqukathi se-wafer encapsulation nokuvikela.Ingakwazi ukuhlukanisa ngempumelelo ukuguguleka nokungcoliswa kwemvelo yangaphandle ku-wafer, futhi iqinisekise ikhwalithi nokuzinza kwewafa.

Izinzuzo zihlanganisa

Amandla aphezulu: Izinto ze-PC zinamandla aqine kakhulu nokuqina, ezingavikela ama-wafers ekushaqekeni kwangaphandle kanye nokuguqulwa.

Ukumelana nokushisa okuphezulu: Impahla ye-PC inokumelana okuhle nokushisa okuphezulu futhi ingasetshenziswa ngaphansi kwezimo ezihlukahlukene zokushisa ukuze ivumelane nezidingo zenqubo yokukhiqiza i-semiconductor.

Ukungafihli: Impahla ye-PC inokucaca okuhle, okungabona ngokucacile isimo se-wafer futhi ibone umphumela wokusebenza.

Ukumelana namakhemikhali: Izinto ze-PC zinokumelana okuhle kwamakhemikhali futhi zingavikela ama-wafers ekugqwaleni nasekungcolisweni.

Amabhokisi e-monolithic angu-12 intshi ngokuvamile anezincazelo ezilandelayo:

Ubukhulu bangaphandle: Imvamisa cishe u-300mm x 300mm (12 "x 12"), kodwa futhi kungenziwa ngendlela oyifisayo ngokuya ngezidingo.

Impahla: Izinto ezisetshenziswa kakhulu yi-PC (i-polycarbonate), i-PP (i-polypropylene), njll. Ukukhethwa kwezinto ngokuvamile kuncike endaweni ethile yohlelo lokusebenza kanye nezidingo.

Ukujiya kodonga: Ukuqina kodonga lwebhokisi le-monolithic kuvame ukuba ngu-2-3mm, namandla anele nokuqina ukuze kuvikelwe i-wafer yangaphakathi.

Ifomu lephakheji: Amabhokisi e-Monolithic ngokuvamile anomklamo ovaliwe ukuvimbela uthuli, umswakama, nokunye ukungcola ukuthi kungangeni ebhokisini futhi kuthinte ikhwalithi ye-wafer.