12inch 300mm single wafer substrate carrier box of PC and PP

Incazelo emfushane:

Inkampani yethu ihlinzeka ngamayintshi angu-1, ama-intshi angu-2, ama-intshi angu-3, ​​ama-intshi angu-4, ama-intshi angu-6, ama-intshi angu-8, ama-intshi angu-10, ibhokisi le-wafer elilodwa lama-intshi angu-12, ibhokisi le-wafer elilodwa, ibhokisi le-wafer eyodwa, ithreyi yokupakisha ye-chip ye-IC, ibambisene namanyuvesi amaningi aphesheya. kanye nezikhungo zocwaningo lwesayensi, izinga eliphezulu, intengo ephansi inhloso yethu yebhizinisi, wamukelekile amakhasimende ukuthenga!


Imininingwane Yomkhiqizo

Omaka bomkhiqizo

Ukwethulwa kwebhokisi le-wafer

Ibhokisi le-wafer elingu-12-intshi lenziwe ngezinto ze-PC (polycarbonate). Ingamandla aphezulu, izinga lokushisa eliphezulu kanye nezinto ezimelana namakhemikhali ezinokukhanya okuhle kanye nezakhiwo zokuvikela ugesi.

Umkhiqizo usetshenziswa ngokuyinhloko embonini yokukhiqiza i-semiconductor kanye nezimboni zesekethe ezididiyelwe njengesiqukathi se-wafer encapsulation nokuvikela. Ingakwazi ukuhlukanisa ngempumelelo ukuguguleka nokungcoliswa kwemvelo yangaphandle ku-wafer, futhi iqinisekise ikhwalithi nokuzinza kwe-wafer.

Izinzuzo zihlanganisa

Amandla aphezulu: Izinto ze-PC zinamandla aqine kakhulu nokuqina, ezingavikela ama-wafers ekushaqekeni kwangaphandle kanye nokuguqulwa.

Ukumelana nokushisa okuphezulu: Impahla ye-PC inokumelana okuhle nokushisa okuphezulu futhi ingasetshenziswa ngaphansi kwezimo ezihlukahlukene zokushisa ukuze ivumelane nezidingo zenqubo yokukhiqiza i-semiconductor.

Ukungafihli: Impahla ye-PC inokucaca okuhle, okungabona ngokucacile isimo se-wafer futhi ibone umphumela wokusebenza.

Ukumelana namakhemikhali: Izinto ze-PC zinokumelana kwamakhemikhali okuhle kakhulu futhi zingavikela ama-wafers ekugqwaleni nasekungcoleni.

Amabhokisi e-monolithic angu-12 intshi ngokuvamile anezincazelo ezilandelayo:

Ubukhulu bangaphandle: Imvamisa cishe u-300mm x 300mm (12 "x 12"), kodwa futhi kungenziwa ngokwezifiso ngokuya ngezidingo.

Impahla: Izinto ezisetshenziswa kakhulu yi-PC (i-polycarbonate), i-PP (i-polypropylene), njll. Ukukhethwa kwezinto ngokuvamile kuncike endaweni ethile yohlelo lokusebenza kanye nezidingo.

Ukujiya kodonga: Ukuqina kodonga lwebhokisi le-monolithic kuvame ukuba ngu-2-3mm, namandla anele nokuqina ukuze kuvikelwe i-wafer yangaphakathi.

Ifomu lephakheji: Amabhokisi e-Monolithic ngokuvamile anomklamo ovaliwe ukuvimbela uthuli, umswakama, nokunye ukungcola ukuthi kungangeni ebhokisini futhi kuthinte ikhwalithi ye-wafer.

Umdwebo onemininingwane

12inch 300mm single wafer substrate carrier box of PC and PP (1)
12inch 300mm single wafer substrate carrier box of PC and PP (2)
12inch 300mm single wafer substrate carrier box of PC and PP (3)
12inch 300mm single wafer substrate carrier box of PC and PP (4)

  • Okwedlule:
  • Olandelayo:

  • Bhala umlayezo wakho lapha futhi usithumelele wona