12inch 300mm single wafer substrate carrier box of PC and PP
Ukwethulwa kwebhokisi le-wafer
Ibhokisi le-wafer elingu-12-intshi lenziwe ngezinto ze-PC (polycarbonate). Ingamandla aphezulu, izinga lokushisa eliphezulu kanye nezinto ezimelana namakhemikhali ezinokukhanya okuhle kanye nezakhiwo zokuvikela ugesi.
Umkhiqizo usetshenziswa ngokuyinhloko embonini yokukhiqiza i-semiconductor kanye nezimboni zesekethe ezididiyelwe njengesiqukathi se-wafer encapsulation nokuvikela. Ingakwazi ukuhlukanisa ngempumelelo ukuguguleka nokungcoliswa kwemvelo yangaphandle ku-wafer, futhi iqinisekise ikhwalithi nokuzinza kwe-wafer.
Izinzuzo zihlanganisa
Amandla aphezulu: Izinto ze-PC zinamandla aqine kakhulu nokuqina, ezingavikela ama-wafers ekushaqekeni kwangaphandle kanye nokuguqulwa.
Ukumelana nokushisa okuphezulu: Impahla ye-PC inokumelana okuhle nokushisa okuphezulu futhi ingasetshenziswa ngaphansi kwezimo ezihlukahlukene zokushisa ukuze ivumelane nezidingo zenqubo yokukhiqiza i-semiconductor.
Ukungafihli: Impahla ye-PC inokucaca okuhle, okungabona ngokucacile isimo se-wafer futhi ibone umphumela wokusebenza.
Ukumelana namakhemikhali: Izinto ze-PC zinokumelana kwamakhemikhali okuhle kakhulu futhi zingavikela ama-wafers ekugqwaleni nasekungcoleni.
Amabhokisi e-monolithic angu-12 intshi ngokuvamile anezincazelo ezilandelayo:
Ubukhulu bangaphandle: Imvamisa cishe u-300mm x 300mm (12 "x 12"), kodwa futhi kungenziwa ngokwezifiso ngokuya ngezidingo.
Impahla: Izinto ezisetshenziswa kakhulu yi-PC (i-polycarbonate), i-PP (i-polypropylene), njll. Ukukhethwa kwezinto ngokuvamile kuncike endaweni ethile yohlelo lokusebenza kanye nezidingo.
Ukujiya kodonga: Ukuqina kodonga lwebhokisi le-monolithic kuvame ukuba ngu-2-3mm, namandla anele nokuqina ukuze kuvikelwe i-wafer yangaphakathi.
Ifomu lephakheji: Amabhokisi e-Monolithic ngokuvamile anomklamo ovaliwe ukuvimbela uthuli, umswakama, nokunye ukungcola ukuthi kungangeni ebhokisini futhi kuthinte ikhwalithi ye-wafer.