Isigaba Sokuthwala Umoya Esine-Ultra-Precision SiC

Isithombe Esifakiwe Sesiteji Sokuthwala Umoya Se-SiC Esinembile Kakhulu

Incazelo emfushane:

Ngokuthuthuka okuqhubekayo kwemboni ye-semiconductor, imishini yokucubungula nokuhlola idinga ukusebenza okuphezulu kakhulu. Ngokwakhela phezu kobuchwepheshe obubanzi ekulawuleni ukunyakaza kanye nokubeka izinga le-nanometer, sithuthukise isigaba se-planar H-type dual-axis ultra-precision air-bearing stage.

Sithumelele i-imeyili

Izici

Umdwebo Oningiliziwe

Ukubuka konke

Yakhiwe ngesakhiwo se-ceramic se-silicon carbide (SiC) esilungiselelwe izinto ezilinganiselwe kanye nobuchwepheshe obuhambisana nomoya obuhambisanayo, lesi sigaba sinikeza ukunemba okuvelele, ukuqina, kanye nokuphendula okuguquguqukayo. Ifaneleka kahle kakhulu:

Ukucubungula nokuhlola kwe-semiconductor
Ukwenziwa kwe-micro/nano kanye ne-metrology
Ukusikwa nokupholishwa kwe-nanometer
Ukuskena okunembile ngesivinini esikhulu

Izici Eziyinhloko

Umzila othwala umoya we-SiCngokuqina okuphezulu kakhulu nokunemba
Amandla aphezulu: ijubane elifika ku-1 m/s, ukusheshisa okufika ku-4 g, ukuqina okusheshayo
I-gantry ene-drive ephindwe kabili i-Y-axiskuqinisekisa umthamo omkhulu womthwalo kanye nokuqina
Izinketho zokufaka ikhodi: i-optical grating noma i-laser interferometer
Ukunemba kokubeka: ± 0.15 μm;ukuphindaphindeka: ±75 nm
Umzila wekhebula olungiselelwe kahleukuze kube nomklamo ohlanzekile kanye nokuthembeka kwesikhathi eside
Ukucushwa okungenziwa ngezifisongezidingo ezithile zesicelo

Umklamo Oqondile Kakhulu kanye Nokwakhiwa Okuqondile, Okungathintani

Uhlaka lwe-Ceramic lwe-SiC: ~5 × ukuqina kwe-aluminium alloy kanye ~5 × ukwanda kokushisa okuphansi, okuqinisekisa ukuzinza kwesivinini esikhulu kanye nokuqina kokushisa.
Ukuthwala Umoya Okukhokhelwayo: Ukwakheka kobunikazi kuthuthukisa ukuqina, amandla omthwalo, kanye nokuqina kokunyakaza.
Ukusebenza Okuguquguqukayo: Isekela ijubane elingu-1 m/s kanye nokusheshisa okungu-4 g, okulungele izinqubo zokusebenzisa amandla amaningi.
Ukuhlanganiswa Okungenamthungo: Iyahambisana nezinhlelo zokuhlukanisa ukudlidliza, izigaba ezijikelezayo, amamojula okuthambekela, kanye namapulatifomu okuphatha ama-wafer.
Ukuphathwa Kwekhebula: Irediyasi egobile elawulwayo inciphisa ukucindezeleka isikhathi eside senkonzo.

Injini Engenawo Umugqa Oyinhloko: Ukunyakaza okubushelelezi ngaphandle kwamandla okuvimba.
Idrayivu Yezimoto Eziningi: Ukubekwa kwenjini yemoto endaweni yomthwalo kuthuthukisa ukuqondeka, ukuba yisicaba, kanye nokunemba kwe-angular.
Ukuhlukaniswa Kwezimo Ezishisayo: Ama-motor ahlukaniswe nesakhiwo sesiteji; ukupholisa umoya noma amanzi okungakhethwa kukho ukuze kusetshenziswe imijikelezo ephezulu.

Imininingwane

Imodeli	400-400	500-500	600-600
Izimbazo	X (skena) / Y (isinyathelo)	X (skena) / Y (isinyathelo)	X (skena) / Y (isinyathelo)
Ukuhamba (mm)	400/400	500/500	600/600
Ukunemba (μm)	±0.15	±0.2	±0.2
Ukuphindaphinda (nm)	±75	±100	±100
Isixazululo (nm)	0.3	0.3	0.3
Isivinini Esiphezulu (m/s)	1	1	1
Ukusheshisa (g)	4	4	4
Ukuqonda (μm)	±0.2	±0.3	±0.4
Ukuzinza (nm)	±5	±5	±5
Umthwalo Omkhulu (kg)	20	20	20
Iphimbo/Ukugoqa/Ukugoqa (isekhondi le-arc)	±1	±1	±1

Izimo Zokuhlola:

Ukunikezwa komoya: kuhlanzekile, komile; iphuzu lamazolo ≤ 0°F; ukuhlunga kwezinhlayiya ≤ 0.25 μm; noma i-nitrogen engu-99.99%.
Ukunemba kukalwe ngama-25 mm ngaphezu kwesikhungo sesiteji ku-20±1 °C, 40–60% RH.

Izicelo

I-lithography ye-semiconductor, ukuhlolwa, kanye nokuphathwa kwe-wafer
Ukwenziwa kwe-micro/nano kanye ne-metrology yokunemba
Ukukhiqizwa kwe-optics ephezulu kanye ne-interferometry
Ucwaningo lwezindiza kanye nesayensi oluthuthukisiwe

Imibuzo Evame Ukubuzwa - Isigaba Sokuthwala Umoya Se-Silicon Carbide

1. Iyini isiteji esithwala umoya?

Isiteji esinomoya sisebenzisa ifilimu elincane lomoya ocindezelwe phakathi kwesiteji nomzila ukuze kuhlinzekweukunyakaza okungenamikhuhlane, okungenamikhuhlane, nobushelelezi kakhuluNgokungafani nama-bearings avamile omshini, iqeda ukushelela kwe-stick-slip, iletha ukunemba kwezinga le-nanometer, futhi isekela ukuthembeka kwesikhathi eside.

2. Kungani kufanele usebenzise i-silicon carbide (SiC) ekwakheni isiteji?

Ukuqina okuphezulu: ~5× okwe-aluminium alloy, okunciphisa ukuguquguquka ngesikhathi sokunyakaza okuguquguqukayo.
Ukwanda okuphansi kokushisa: ~5 × ngaphansi kune-aluminium, kugcina ukunemba ngaphansi kokushintsha kwezinga lokushisa.
Ilula: Ubuningi obuphansi uma kuqhathaniswa nensimbi, okuvumela ukusebenza kwesivinini esikhulu kanye nokusheshisa okuphezulu.
Ukuqina okuhle kakhulu: Ukudambisa okuphezulu nokuqina kokubeka indawo ngokunemba okukhulu.

3. Ingabe isiteji sidinga ukugcotshwa noma ukulungiswa?

Akukho ukugcoba kwendabuko okudingekayo ngoba kukhonaakukho ukuthintana komshiniUkunakekelwa okunconywayo kuhlanganisa:

Ukunikezaumoya ohlanzekile, owomile ocindezelwe noma i-nitrogen
Ukuhlolwa njalo kwezihlungi nezomisi
Ukuqapha izintambo kanye nezinhlelo zokupholisa

4. Yiziphi izidingo zokunikezwa komoya?

Iphuzu lomswakama: ≤ 0 °F (≈ –18 °C)
Ukuhlunga kwezinhlayiya: ≤ 0.25 μm
Umoya ohlanzekile, owomile noma i-nitrogen emsulwa engu-99.99%
Ingcindezi ezinzile enokuguquguquka okuncane

Mayelana NATHI

I-XKH igxile ekuthuthukisweni kobuchwepheshe obuphezulu, ekukhiqizweni, nasekuthengisweni kwengilazi ekhethekile ye-optical kanye nezinto ezintsha zekristalu. Imikhiqizo yethu ihlinzeka nge-optical electronics, i-consumer electronics, kanye nezempi. Sinikeza izingxenye ze-optical ze-Sapphire, izembozo zelensi yeselula, i-Ceramics, i-LT, i-Silicon Carbide SIC, i-Quartz, kanye nama-semiconductor crystal wafers. Ngobuchwepheshe obunekhono kanye nemishini esezingeni eliphezulu, sihamba phambili ekucutshungulweni komkhiqizo okungewona ojwayelekile, sihlose ukuba yibhizinisi elihamba phambili lezinto ze-optoelectronic tech.