I-Silicon Wafer Embozwe Ngensimbi ye-Ti/Cu (i-Titanium/ithusi)

Incazelo emfushane:

OkwethuAma-wafer e-silicon ambozwe ngensimbi e-Ti/Cuine-substrate ye-silicon esezingeni eliphezulu (noma ingilazi/i-quartz ongayikhetha) embozwe nge-isendlalelo sokunamathela se-titaniumkanyeungqimba oluqhubayo lwethusiusebenzisaukuphalaza okujwayelekile kwe-magnetron. I-Ti interlayer ithuthukisa kakhulu ukunamathela kanye nokuqina kwenqubo, kuyilapho i-Cu top layer inikeza indawo engamelani kakhulu, efanayo, efaneleka kakhulu ekuhlanganiseni ugesi kanye nokwakhiwa kwe-microfabrication ngezansi.


Izici

Ukubuka konke

OkwethuAma-wafer e-silicon ambozwe ngensimbi e-Ti/Cuine-substrate ye-silicon esezingeni eliphezulu (noma ingilazi/i-quartz ongayikhetha) embozwe nge-isendlalelo sokunamathela se-titaniumkanyeungqimba oluqhubayo lwethusiusebenzisaukuphalaza okujwayelekile kwe-magnetron. I-Ti interlayer ithuthukisa kakhulu ukunamathela kanye nokuqina kwenqubo, kuyilapho i-Cu top layer inikeza indawo engamelani kakhulu, efanayo, efaneleka kakhulu ekuhlanganiseni ugesi kanye nokwakhiwa kwe-microfabrication ngezansi.

Yakhelwe kokubili izinhlelo zokusebenza zocwaningo kanye nezinhlelo zokuhlola, lawa ma-wafer atholakala ngobukhulu obuhlukahlukene kanye nobubanzi bokumelana, kanye nokwenza ngokwezifiso okuguquguqukayo kobukhulu, uhlobo lwe-substrate, kanye nokucushwa kokumboza.

Izici Eziyinhloko

  • Ukunamathela okuqinile nokuthembeka: Isendlalelo se-Ti bonding sithuthukisa ukunamathela kwefilimu ku-Si/SiO₂ futhi sithuthukisa ukuqina kokuphatha

  • Ubuso obuphezulu bokuqhuba: I-Cu coating inikeza ukusebenza okuhle kakhulu kukagesi kwezakhiwo zoxhumana nabo kanye nokuhlolwa

  • Ububanzi bokwenza ngokwezifiso: usayizi we-wafer, ukumelana, ukuma, ubukhulu be-substrate, kanye nobukhulu befilimu kuyatholakala uma uceliwe

  • Izingxenye ezilungele inqubo: iyahambisana nemisebenzi ejwayelekile yelebhu kanye neyezinto zokwenza izinto (i-lithography, ukwakheka kwe-electroplating, i-metrology, njll.)

  • Uchungechunge lwezinto luyatholakala: ngaphandle kwe-Ti/Cu, siphinde sinikeze ama-wafer ambozwe ngensimbi e-Au, Pt, Al, Ni, Ag

Isakhiwo Esijwayelekile Nokubekwa Kwaso

  • Isitaki: Isendlalelo se-substrate + isendlalelo sokunamathela se-Ti + isendlalelo sokumboza se-Cu

  • Inqubo ejwayelekile: Ukuphalaza kwe-Magnetron

  • Izinqubo zokuzikhethela: Ukuhwamuka kokushisa / Ukufakelwa ngogesi (ngezidingo ze-Cu ezijiyile)

Izakhiwo Zemishini ze-Quartz Glass

Into Izinketho
Usayizi we-wafer 2", 4", 6", 8"; 10×10 mm; osayizi bokusika ngokwezifiso
Uhlobo lokuqhuba Uhlobo lwe-P / Uhlobo lwe-N / Ukumelana okuphezulu kwangaphakathi (Un)
Ukuqondiswa <100>, <111>, njll.
Ukumelana <0.0015 Ω·cm; 1–10 Ω·cm; >1000–10000 Ω·cm
Ubukhulu (µm) 2": 200/280/400/500; 4": 450/500/525; 6": 625/650/675; 8": 650/700/725/775; ngokwezifiso
Izinto ezingaphansi komhlaba I-Silicon; i-quartz ongayikhetha, ingilazi ye-BF33, njll.
Ubukhulu befilimu 10 nm / 50 nm / 100 nm / 150 nm / 300 nm / 500 nm / 1 µm (kungenziwa ngezifiso)
Izinketho zefilimu yensimbi Ti/Cu; futhi Au, Pt, Al, Ni, Ag iyatholakala

 

I-Ti/Cu Metal-Coated Silicon Wafer (Titanium/Copper)4

Izicelo

  • Izinto zokuthintana ze-Ohmic kanye ne-conductivekokuhlolwa kwe-R&D yedivayisi kanye nokuhlolwa kukagesi

  • Izendlalelo zembewu zokufaka i-electroplating(I-RDL, izakhiwo ze-MEMS, ukwakheka kwe-Cu okujiyile)

  • I-Sol-gel kanye ne-nanomaterial growth substratesucwaningo lwe-nano kanye nefilimu encane

  • I-Microscopy kanye ne-metrology yobuso(Ukulungiselela nokulinganisa isampula ye-SEM/AFM/SPM)

  • Izindawo ze-bio/amakhemikhalinjengezinkundla zokukhulisa amaseli, ama-microarray e-protein/DNA, kanye ne-reflectometry substrates

I-FAQ (I-Ti/Cu Metal-Coated Silicon Wafers)

Q1: Kungani kusetshenziswa ungqimba lwe-Ti ngaphansi kwengubo ye-Cu?
A: I-Titanium isebenza njenge-ungqimba lokunamathela (ukubopha), ukuthuthukisa ukunamathela kwethusi ku-substrate nokuthuthukisa ukuzinza kwesikhombimsebenzisi, okusiza ekunciphiseni ukuxebuka noma ukuhlukanisa phakathi kokuphathwa nokucubungula.

Q2: Iyini indlela ejwayelekile yokwakheka kobukhulu be-Ti/Cu?
A: Izinhlanganisela ezivamile zifaka phakathiI-Ti: amashumi e-nm (isb., 10–50 nm)futhiI-Cu: 50–300 nmamafilimu agcwele amathe. Izendlalelo ze-Cu ezijiyile (µm-level) zivame ukufezwa yiukufakelwa ngogesi kungqimba lwembewu ye-Cu ethosiwe, kuye ngesicelo sakho.

U-Q3: Ungakwazi yini ukumboza izinhlangothi zombili ze-wafer?
A: Yebo.Ukugqoka ohlangothini olulodwa noma ohlangothini oluphindwe kabiliiyatholakala uma iceliwe. Sicela ucacise isidingo sakho lapho u-oda.

Mayelana NATHI

I-XKH igxile ekuthuthukisweni kobuchwepheshe obuphezulu, ekukhiqizweni, nasekuthengisweni kwengilazi ekhethekile ye-optical kanye nezinto ezintsha zekristalu. Imikhiqizo yethu ihlinzeka nge-optical electronics, i-consumer electronics, kanye nezempi. Sinikeza izingxenye ze-optical ze-Sapphire, izembozo zelensi yeselula, i-Ceramics, i-LT, i-Silicon Carbide SIC, i-Quartz, kanye nama-semiconductor crystal wafers. Ngobuchwepheshe obunekhono kanye nemishini esezingeni eliphezulu, sihamba phambili ekucutshungulweni komkhiqizo okungewona ojwayelekile, sihlose ukuba yibhizinisi elihamba phambili lezinto ze-optoelectronic tech.

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