Izisekelo zeglasi ze-TGV 12inch wafer Ukubhoboza ngengilazi

Izisekelo zengilazi zisebenza kangcono ngokwezakhiwo zokushisa, ukuzinza ngokomzimba, futhi zimelana nokushisa kakhulu futhi azinazo izinkinga zokugoba noma zokuguquka ngenxa yokushisa okuphezulu;

Ngaphezu kwalokho, izakhiwo zikagesi ezihlukile ze-core yengilazi zivumela ukulahlekelwa okuphansi kwe-dielectric, okuvumela isignali ecacile kanye nokudluliswa kwamandla. Ngenxa yalokho, ukulahlekelwa kwamandla ngesikhathi sokudluliswa kwesignali kuyancipha futhi ukusebenza kahle kwe-chip kukhula ngokwemvelo. Ubukhulu be-substrate ye-core yengilazi bungancishiswa cishe ngesigamu uma kuqhathaniswa nepulasitiki ye-ABF, futhi ukuncishiswa kuthuthukisa isivinini sokudluliswa kwesignali kanye nokusebenza kahle kwamandla.

Ubuchwepheshe bokwakha imigodi ye-TGV:

Indlela yokuchoma ebangelwa yi-laser isetshenziselwa ukuvusa indawo yokubola okuqhubekayo nge-laser evunguziwe, bese ingilazi ephathwe nge-laser ifakwa esixazululweni se-hydrofluoric acid ukuze ichome. Izinga lokuchoma lengilazi yendawo yokubola ku-hydrofluoric acid lishesha kunelengilazi engabolanga ukuze yakheke ngezimbobo.

Ukugcwaliswa kwe-TGV:

Okokuqala, kwenziwa imigodi eyimpumputhe ye-TGV. Okwesibili, ungqimba lwembewu lubekwe ngaphakathi kwembobo eyimpumputhe ye-TGV ngokufaka umhwamuko ongokoqobo (i-PVD). Okwesithathu, ukufaka i-electroplating phansi kuya phezulu kufeza ukugcwaliswa okungenamthungo kwe-TGV; Okokugcina, ngokubopha okwesikhashana, ukugaya emuva, ukuvezwa kwethusi nge-chemical mechanical polishing (CMP), ukuqaqa, kwakha ipuleti lokudlulisa eligcwele insimbi ye-TGV.