Umshini omncane wetafula le-laser punching punching engu-1000w-6000W ubumbano oluncane 0.1mm lungasetshenziselwa izinto ze-ceramic zensimbi

Umshini omncane weTable Laser punching umshini ongu-1000w-6000W ubuncane be-aperture 0.1mm bungasetshenziselwa izinto ze-ceramic zensimbi yensimbi

Incazelo emfushane:

Umshini omncane we-Laser Punching Machine omncane uyimishini ephezulu ye-Laser eyenzelwe ukucubungula okuhle. Kuhlanganisa ubuchwepheshe be-laser ethuthukisiwe kanye nokwakhiwa kwemishini okunembile ukufezekisa ukumba okunembe okunenqakuni kwe-micron-level emisebenzini emincane yokusebenza. Ngomklamo wayo we-compact hompact, umthamo wokucubungula ofanele kanye nesibonisi sokusebenza esisebenzayo, imishini ihlangabezana nezidingo zomkhakha wesimanje wokukhiqiza ngokunemba okuphezulu nokucutshungulwa okuphezulu.

Usebenzisa ugongolo lwe-laser olunamandla amakhulu wamandla njengethuluzi lokucubungula, lingangena ngokushesha nangokunembile izinto, kufaka phakathi i-cerals, futhi akukho thintayo futhi akukho thonya lokusebenza kanye nokunemba komsebenzi wokusebenza. Ngasikhathi sinye, imishini isekela izindlela ezahlukahlukene zokubhoboza nokucubungula ukulungiswa kwepharamitha, abasebenzisi bangasetha kalula ngokwezidingo zangempela, ukufezekisa ukucubungula okwenziwe ngezifiso.

Thumela i-imeyili kithi

Imininingwane Yomkhiqizo

Amathegi Omkhiqizo

Izinto ezisebenzayo

1. Izinto zensimbi: njenge-aluminium, ithusi, i-titanium alloy, insimbi engenacala, njll.

2. Izinto ezingezona zensimbi: njengePulasitiki (kufaka phakathi i-polyethylene pe, i-polypropylene pp, ingilazi ye-polyester, ingilazi ekhethekile, kepha ingilazi evamile, kepha ingilazi evamile ngenxa yezakhiwo zayo ezikhethekile, njll., Njll.

3. Izinto ezihlanganisiwe: Kwakhiwa ngezinto ezimbili noma ngaphezulu ngezakhiwo ezahlukahlukene ngezindlela zomzimba noma zamakhemikhali, ezinezakhiwo ezinhle kakhulu.

Izinsizakusebenza ze-4.Special: Ezindaweni ezithile, imishini yokubhoboza ye-laser nayo ingasetshenziswa ukucubungula ezinye izinto ezikhethekile.

Amapharamitha acacisa

Ibizo	Umbhalo
Amandla we-Laser:	1000w-6000w
Ukusika ukunemba:	± 0.03mm
I-REEN-VALUE ALCERTURE:	I-0.1MM
Ubude be-CUT:	I-650mm × 800mm
Ukunemba kwesikhashana:	≤ ± 0.008mm
Ukunemba okuphindaphindiwe:	0.008mm
Ukusika igesi:	Umoya
Imodeli Elungisiwe:	I-Pneumatic Edge Clamping, ukwesekwa kokulungiswa
Uhlelo lokushayela:	Ukumiswa kazibuthe ukumiswa okuqondile motor
Ukusika ubukhulu	0.01mm-3mm

Izinzuzo Zobuchwepheshe

I-Effeeffmight yokumba: Ukusetshenziswa komshini wamandla we-laser ephezulu kakhulu yokucutshungulwa okungathintwa, okusheshayo, oku-1 kwesibili ukuqedela ukucutshungulwa kwezimbobo ezincane.

Ukunemba kwe-2.High: Ngokulawula kahle amandla, imvamisa ye-pulse kanye nokugxila kwesikhundla se-laser, ukusebenza kokudla okunempilo ye-micro.

I-3. Kusebenza kabanzi: kungacubungula izinhlobo ezahlukene ze-brittle, kunzima ukucubungula kanye nezinto ezikhethekile, njengepulasitiki, insimbi engagqwali, i-aluminium, i-allper, i-titanium alloy, njll.

I-4. Ukusebenza kwe-Intelligent: Umshini we-laser punching uhlome ngohlelo lokulawula izinombolo oluthuthukile, olunobuhlakani obukhulu futhi oluhlanganisa ukuhlanganisa nokwakheka kwesisekelo sekhompyutha kanye nohlelo lokukhiqiza oluyisisekelo lwekhompyutha ukubona indlela esheshayo yokudlulisa kanye nokwenza kahle.

Izimo Zokusebenza

I-1.DIVERVITITITITITITITITITITITITITITITY

Ikhwalithi ye-Onehigh: Ikhwalithi yembobo iphakeme, umkhawulo ubushelelezi, awukho umuzwa onzima, futhi ukuguquguquka kuncane.

I-3.Automation: Ingaqedela ukucubungula okune-micro-hole ngosayizi ofanayo we-apertire nokusatshalaliswa okufanayo ngasikhathi sinye, futhi kusekela ukucubungula umgodi weqembu ngaphandle kokungenela okumabhandini.

Izici zemishini

■ usayizi omncane wemishini, ukuxazulula inkinga yesikhala esincane.

■ Ukunemba okuphezulu, umgodi omkhulu ungafinyelela ku-0.005mm.

■ Imishini kulula ukuyisebenzisa futhi kulula ukuyisebenzisa.

■ Umthombo wokukhanya ungafakwa esikhundleni ngokwezinto zokwakha ezahlukahlukene, futhi ukuhambisana kunamandla.

■ indawo encane efudumele ukushisa, i-oxidation encane ezungeze izimbobo.

Inkambu yesicelo

1. Imboni ye-Electronics
● I-Pripled Circuit Board (PCB) punching:

IMicrohole MachingCing: Isetshenziselwa ama-micining microholes ngesilinganiso esingaphansi kwe-0.1mm kumabhodi we-PC-density ancnonnect (HDI).
Izimbobo Ezimpumputhe Nezimpumputhe: Imishini eyimpumputhe neyangcwatshwa ngama-PCB ahlukahlukene ukuthuthukisa ukusebenza nokuhlanganiswa kweBhodi.

● Ukupakishwa kwe-semiconductor:
I-Lead Framere Drilling: Izimbobo zokunemba zenziwe ngohlaka lwe-semiconductor lokuxhuma i-chip kwisifunda sangaphandle.
I-Wafer Cutting Aid: punch izimbobo ku-wafer ukusiza ezinhlanganweni ezilandelayo zokusika kanye nezinqubo zokupakisha.

2. Imishini yokunemba
● Ukucutshungulwa kwezingxenye ezincane:
Ukushayela Isendi Yeqiniso Yeqiniso: Imishini enezimbobo eziphakeme eziphakemeyo emacesini amancane okunemba izinhlelo zokudlulisela ukupela.
I-Sensor Conton Drilling: Imishini yemishini yezimpawu zezinzwa ukuthuthukisa ukuzwela nokuphendula isivinini senzwa.

● Ukukhiqiza isikhunta:
Umgodi wokupholisa wokupholisa wombuso
Ukucutshungulwa kwe-Vent: Imishini emincane vents ekubumbeni ukunciphisa ukwakha iziphambeko.

3. Amadivayisi wezokwelapha
● Izinsimbi zokuhlinza ezihlaselayo:
I-catheter vermation: ama-microholes aculiswe ama-catheters amancane ahlasele okuhlinza izidakamizwa noma ama-fluid drainage.
Izakhi ze-Endoscope: Izimbobo zokunemba zitholwe kumalensi noma inhloko yamathuluzi ye-endoscope ukuthuthukisa ukusebenza kwensimbi.

● Uhlelo lokulethwa kwezidakamizwa:
I-MicroneEdle Aray Drilling: Imishini yemishini yezidakamizwa ku-patch yezidakamizwa noma i-micronedle array ukulawula isilinganiso sokukhishwa kwezidakamizwa.
I-Biochip Drilling: Ama-Microholes aculiswe kuma-biochips wesiko leselula noma ukutholwa.

4. Amadivayisi we-Optical
● Isixhumi se-Fiber Optic:
I-Optical Fibri End Hole Drilling: Imishini yemishini yokushayela emgodini wokuphela kwesixhumi se-Optical ukuthuthukisa ukusebenza kahle kokuhambisa izimpawu zokubona.
I-Fiby Array Machching: Imishini enezimbobo eziphakeme eziphezulu epuletini ye-fiber array yokuxhumana ngezikhathi ezithile.

● Isihlungi se-Optical:
Ukuhlunga kokuhlunga: Imishini microholes ekuhlungeleni kokubona ukufeza ukukhethwa kwama-wavelength athile.
I-DifRractive element Machcicing: Imishini Microholes ezintweni ezihlukile ze-Optical Orments for laser beam skingting noma zakha.

I-5. Ukukhiqiza izimoto
● Uhlelo lokuphikisa amafutha:
I-Insaction Nozzle punching: Icubungula izimbobo ezincane ku-Umjovo nozzle ukuze ulungenze nokwenza ngcono ukusebenza kwe-atomization.

● Ukukhiqiza inzwa:
Ukugqugquzela Inzwa Yengcindezelo: Imishini Microholes kwi-Sensor Sensor Diaphragm ukwenza ngcono ukuzwela nokunemba kwenzwa.

● Ibhethri lamandla:
I-Battery Pole Chip Drilling: Imishini Microholes ku-Lithium Battery Pole Chips ukuthuthukisa infilttation ye-electrolyte kanye ne-Ion Transport.

I-XKH inikeza uhla oluphelele lwezinsizakalo zokumisa zethebula le-Laser yetafula, kufaka phakathi: Ukuthengiselana okuthe xaxa, ukufakwa kohlelo lwekhwalithi ephezulu, ukuqeqeshwa kwesezingeni eliphakeme, ukuqeqeshwa kwensiza esebenza kahle, ukuqinisekisa ukuthi amakhasimende athola ulwazi olusebenza kahle kakhulu, olunembile futhi olungakhathali kwinqubo yokubhoboza.