Isithando Sokutshala Esikhula Nge-SiC Ingot Sezindlela Ezinkulu Ze-SiC Crystal TSSG/LPE
Isimiso Sokusebenza
Isimiso esiyinhloko sokukhula kwe-silicon carbide ingot yesigaba soketshezi sihilela ukuncibilikisa izinto zokusetshenziswa ze-SiC ezihlanzekile kakhulu ezinsimbini ezincibilikisiwe (isb., Si, Cr) ku-1800-2100°C ukuze kwakheke izixazululo ezigcwele, kulandelwe ukukhula okulawulwayo kwamakristalu angawodwa e-SiC kumakristalu embewu ngokusebenzisa i-gradient eqondile yokushisa kanye nomthethonqubo we-supersaturation. Lobu buchwepheshe bufaneleka kakhulu ekukhiqizeni amakristalu angawodwa e-4H/6H-SiC ahlanzekile kakhulu (>99.9995%) anobuningi obuphansi besici (<100/cm²), ahlangabezana nezidingo eziqinile ze-substrate zama-electronics kagesi kanye namadivayisi e-RF. Uhlelo lokukhula lwesigaba soketshezi luvumela ukulawulwa okunembile kohlobo lokuqhuba i-crystal (uhlobo lwe-N/P) kanye nokumelana ngokusebenzisa ukwakheka kwesisombululo okulungiselelwe kanye nemingcele yokukhula.
Izingxenye Eziyinhloko
1. Uhlelo Olukhethekile Lokucwilisa: I-graphite/tantalum composite crucible ehlanzekile kakhulu, ukumelana nokushisa >2200°C, ukumelana nokugqwala kwe-SiC okuncibilikayo.
2. Uhlelo Lokushisa Olunezindawo Eziningi: Ukushisa okuhlanganisiwe kokumelana/ukungenisa okunokunemba kokulawula izinga lokushisa okungu-±0.5°C (ububanzi buka-1800-2100°C).
3. Uhlelo Lokunyakaza Oluqondile: Ukulawula okuphindwe kabili okuvaliwe kokujikeleza imbewu (0-50rpm) kanye nokuphakamisa (0.1-10mm/h).
4. Uhlelo Lokulawula Umoya: Ukuvikelwa kwe-argon/nitrogen okuhlanzekile kakhulu, ingcindezi yokusebenza elungisekayo (0.1-1atm).
5. Uhlelo Lokulawula Oluhlakaniphile: Ukulawula okungafuneki kwe-PLC + i-PC yezimboni ngokuqapha isikhombikubona sokukhula kwesikhathi sangempela.
6. Uhlelo Lokupholisa Olusebenza Kahle: Umklamo wokupholisa amanzi olinganisiwe uqinisekisa ukusebenza okuzinzile kwesikhathi eside.
Ukuqhathaniswa kwe-TSSG vs. LPE
| Izici | Indlela ye-TSSG | Indlela ye-LPE |
| Izinga Lokukhula | 2000-2100°C | 1500-1800°C |
| Izinga Lokukhula | 0.2-1mm/h | 5-50μm/h |
| Usayizi wekristalu | Ama-ingot angu-4-8 intshi | Izingqimba ze-epi ezingu-50-500μm |
| Isicelo Esiyinhloko | Ukulungiswa kwe-substrate | Izingqimba ze-epi zedivayisi yamandla |
| Ubuningi obuphelele | <500/cm² | <100/cm² |
| Ama-Polytype Afanelekile | 4H/6H-SiC | 4H/3C-SiC |
Izinhlelo Zokusebenza Eziyinhloko
1. Amandla kagesi: ama-substrate angu-6-intshi angu-4H-SiC ama-MOSFET/diode angu-1200V+.
2. Amadivayisi e-5G RF: Izisekelo ze-SiC ezivikela kancane ama-PA esiteshini esiyisisekelo.
3. Izinhlelo Zokusebenza Ze-EV: Izingqimba ze-epi ezijiyile kakhulu (>200μm) zamamojula ebanga lezimoto.
4. Ama-PV Inverters: Ama-substrate anesici esincane avumela ukusebenza kahle kokuguqulwa okungaphezulu kuka-99%.
Izinzuzo Eziyinhloko
1. Ukuphakama Kwezobuchwepheshe
1.1 Umklamo Ohlanganisiwe Wezindlela Eziningi
Lolu hlelo lokukhula kwe-SiC ingot olunesigaba soketshezi luhlanganisa ubuchwepheshe bokukhula kwekristalu ye-TSSG kanye ne-LPE. Uhlelo lwe-TSSG lusebenzisa ukukhula kwesisombululo esihlwanyelwe phezulu ngokulawula okunembile kokuncibilika kanye nokulawula i-gradient yokushisa (ΔT≤5℃/cm), okuvumela ukukhula okuzinzile kwama-ingot e-SiC amakhulu angu-4-8 intshi anezinzuzo eziqhutshwa kanye kuphela ezingu-15-20kg zamakristalu angu-6H/4H-SiC. Uhlelo lwe-LPE lusebenzisa ukwakheka kwe-solvent okulungiselelwe kahle (uhlelo lwe-alloy lwe-Si-Cr) kanye nokulawula i-supersaturation (±1%) ukukhulisa izendlalelo ze-epitaxial eziqinile zekhwalithi ephezulu ezinobukhulu obungaphansi kuka-100/cm² emazingeni okushisa aphansi kakhulu (1500-1800℃).
1.2 Uhlelo Lokulawula Oluhlakaniphile
Ifakwe ukulawula ukukhula okuhlakaniphile kwesizukulwane sesine okuhlanganisa:
• Ukuqapha kwe-multi-spectral in-situ (ububanzi bobude be-wavelength obungu-400-2500nm)
• Ukutholwa kwezinga lokuncibilika okusekelwe ku-laser (± 0.01mm ngokunemba)
• Ukulawula i-closed loop okusekelwe ku-CCD ububanzi (<±1mm ukushintshashintsha)
• Ukuthuthukiswa kwamapharamitha okukhula asebenzisa i-AI (ukonga amandla okungu-15%)
2. Izinzuzo Zokusebenza Kwenqubo
2.1 Indlela ye-TSSG Amandla Ayinhloko
• Amandla amakhulu: Isekela ukukhula kwekristalu okungamasentimitha angu-8 ngokufana kobubanzi obungu->99.5%.
• Ukuqina okuphezulu kwekristali: Ubuningi be-dislocation <500/cm², ubuningi be-micropipe <5/cm²
• Ukufana kwe-doping: <8% ukuhlukahluka kokumelana nohlobo lwe-n (ama-wafer angu-4 intshi)
• Izinga lokukhula elilungiselelwe: Lingalungiseka kusuka ku-0.3 kuya ku-1.2mm/h, ngokushesha okungu-3 kuya ku-5× kunezindlela zesigaba somswakama
2.2 Indlela ye-LPE Amandla Ayisisekelo
• I-epitaxy yesici esiphansi kakhulu: Ubuningi besimo se-interface <1×10¹¹cm⁻²·eV⁻¹
• Ukulawula ukujiya okunembile: Izingqimba ze-epi ezingu-50-500μm ezinokwehluka kobukhulu obungaphansi kuka-±2%.
• Ukusebenza kahle kwezinga lokushisa eliphansi: 300-500℃ ngaphansi kunezinqubo ze-CVD
• Ukukhula kwesakhiwo okuyinkimbinkimbi: Kusekela ama-pn junctions, ama-superlattice, njll.
3. Izinzuzo Zokusebenza Kahle Kokukhiqiza
3.1 Ukulawulwa Kwezindleko
• Ukusetshenziswa kwezinto zokusetshenziswa ezingavuthiwe okungu-85% (uma kuqhathaniswa no-60% ojwayelekile)
• Ukusetshenziswa kwamandla okuphansi ngo-40% (uma kuqhathaniswa ne-HVPE)
• Isikhathi sokusebenza semishini esingu-90% (umklamo we-modular unciphisa isikhathi sokusebenza)
3.2 Ukuqinisekiswa Kwekhwalithi
• Ukulawulwa kwenqubo okungu-6σ (CPK>1.67)
• Ukutholwa kwephutha ku-inthanethi (ukulungiswa okungu-0.1μm)
• Ukulandelelwa kwedatha okugcwele (amapharamitha esikhathi sangempela angaphezu kuka-2000)
3.3 Ukusabalala
• Iyahambisana nama-polytype angu-4H/6H/3C
• Ingathuthukiswa ibe amamojula enqubo angu-12-intshi
• Isekela ukuhlanganiswa kwe-SiC/GaN hetero
4. Izinzuzo Zokusetshenziswa Kwemboni
4.1 Amadivayisi Amandla
• Izisekelo eziqinile ezingamelani nokumelana (0.015-0.025Ω·cm) zamadivayisi angu-1200-3300V
• Izisekelo ezivikela kancane (>10⁸Ω·cm) zezinhlelo zokusebenza ze-RF
4.2 Ubuchwepheshe Obusha
• Ukuxhumana kwe-Quantum: Izisekelo zomsindo ophansi kakhulu (umsindo ongu-1/f<-120dB)
• Izindawo ezibucayi kakhulu: Amakristalu amelana nemisebe (<5% ukuwohloka ngemva kokushiswa kwemisebe okungu-1×10¹⁶n/cm²)
Izinsizakalo ze-XKH
1. Imishini Eyenziwe Ngokwezifiso: Ukucushwa kwesistimu ye-TSSG/LPE okulungiselelwe wena.
2. Ukuqeqeshwa Kwenqubo: Izinhlelo zokuqeqesha zobuchwepheshe eziphelele.
3. Ukusekelwa Kwangemva Kokuthengisa: Impendulo yobuchwepheshe kanye nokugcinwa amahora angama-24 ngosuku, izinsuku eziyi-7 ngesonto.
4. Izixazululo ze-Turnkey: Isevisi egcwele ama-spectrum kusukela ekufakweni kuya ekuqinisekisweni kwenqubo.
5. Izinto Ezitholakalayo: Ama-substrate/ama-epi-wafer angu-2-12 intshi e-SiC ayatholakala.
Izinzuzo ezibalulekile zifaka:
• Amandla okukhula kwekristalu angafika ku-8 intshi.
• Ukufana kokumelana <0.5%.
• Isikhathi sokusebenza kwemishini >95%.
• Usekelo lobuchwepheshe olusebenza amahora angu-24 ngosuku, izinsuku eziyi-7 ngesonto.









