Imishini Yokuphakamisa I-Laser Ye-Semiconductor Iguqula Ukuncipha Kwe-Ingot

Imishini Yokuphakamisa I-Laser Ye-Semiconductor Guqula Ukuncipha Kwe-Ingot Isithombe Esivelele

Incazelo emfushane:

I-Semiconductor Laser Lift-Off Equipment iyisisombululo sezimboni esikhethekile kakhulu esenzelwe ukunciphisa ama-ingots e-semiconductor ngendlela enembile nengathintani ngokusebenzisa amasu okuphakamisa abangelwa yi-laser. Lolu hlelo oluthuthukisiwe ludlala indima ebalulekile ezinqubweni zesimanje zokusula ama-ingots e-semiconductor, ikakhulukazi ekwakhiweni kwama-wafers amancane kakhulu e-electronics yamandla aphezulu, ama-LED, namadivayisi e-RF. Ngokuvumela ukuhlukaniswa kwezingqimba ezincane kuma-ingots amakhulu noma ama-substrates anikelayo, i-Semiconductor Laser Lift-Off Equipment iguqula ukunciphisa ama-ingot ngokuqeda izinyathelo zokusaha, ukugaya, kanye nokusika amakhemikhali.

Sithumelele i-imeyili

Izici

Umdwebo Oningiliziwe

Isingeniso Somkhiqizo Wemishini Yokuphakamisa I-Laser Semiconductor

Ukunciphisa okwendabuko kwama-ingot e-semiconductor, njenge-gallium nitride (GaN), i-silicon carbide (SiC), ne-sapphire, kuvame ukuba nzima kakhulu, kuyachitha, futhi kuvame ukuba nemifantu emincane noma ukulimala kwendawo. Ngokuphambene nalokho, i-Semiconductor Laser Lift-Off Equipment inikeza enye indlela engonakalisi, enembile nengabhubhisi enciphisa ukulahleka kwezinto kanye nokucindezeleka kwendawo ngenkathi ikhulisa umkhiqizo. Isekela izinhlobo eziningi zezinto ezikristalu nezihlanganisiwe futhi ingahlanganiswa kalula emigqeni yokukhiqiza ye-front-end noma ye-midstream semiconductor.

Ngama-wavelength e-laser alungisekayo, izinhlelo zokugxila eziguquguqukayo, kanye nama-wafer chucks ahambisana ne-vacuum, lo mshini ulungele kakhulu ukunqunywa kwe-ingot, ukudalwa kwe-lamella, kanye nokususwa kwefilimu okunciphile kakhulu kwezakhiwo zedivayisi eziqondile noma ukudluliselwa kwesendlalelo se-heteroepitaxial.

Ipharamitha Yemishini Yokuphakamisa I-Laser Ye-Semiconductor

Ubude begagasi	I-IR/SHG/THG/FHG
Ububanzi be-Pulse	I-Nanosecond, i-Picosecond, i-Femtosecond
Uhlelo Lokubona	Uhlelo oluqondile lwe-optical noma uhlelo lwe-Galvano-optical
Isigaba se-XY	500 mm × 500 mm
Ibanga Lokucubungula	160 mm
Isivinini Sokunyakaza	Ubuningi obungu-1,000 mm/sec
Ukuphindaphinda	±1 μm noma ngaphansi
Ukunemba Kwesikhundla Esiphelele:	±5 μm noma ngaphansi
Usayizi we-Wafer	Amasentimitha angu-2–6 noma enziwe ngezifiso
Ukulawula	I-Windows 10, 11 kanye ne-PLC
I-Voltage Yokunikezwa Kwamandla	I-AC 200 V ±20 V, Isigaba esisodwa, 50/60 kHz
Ubukhulu Bangaphandle	2400 mm (W) × 1700 mm (D) × 2000 mm (H)
Isisindo	1,000 kg

Isimiso Sokusebenza Semishini Yokuphakamisa I-Laser Semiconductor

Indlela eyinhloko yokusebenza kwe-Semiconductor Laser Lift-Off Equipment incike ekuqhekekeni kwe-photothermal okukhethiwe noma ekususweni endaweni ehlangana ne-donor ingot kanye ne-epitaxial noma ungqimba oluqondiwe. I-UV laser enamandla aphezulu (ngokuvamile i-KrF ku-248 nm noma ama-UV lasers aqinile azungeze i-355 nm) igxile ezintweni zomnikeli ezicacile noma ezicacile, lapho amandla amuncwa ngokukhetha ekujuleni okunqunyiwe.

Lokhu kudonswa kwamandla endaweni ethile kudala isigaba segesi esinomfutho ophezulu noma ungqimba lokunwetshwa kokushisa endaweni ehlanganayo, okuqalisa ukuhlukaniswa okuhlanzekile kwengqimba ephezulu noma yedivayisi kusukela esisekelweni se-ingot. Inqubo ilungiswa kahle ngokulungisa amapharamitha afana nobubanzi be-pulse, ukufiphala kwe-laser, isivinini sokuskena, kanye nokujula kwe-z-axis focal. Umphumela uba yisilayi esincane kakhulu—ngokuvamile esibangeni esingu-10 kuya ku-50 µm—esihlukaniswe kahle ne-ingot yomzali ngaphandle kokuhuzuka ngomshini.

Le ndlela yokususa nge-laser ukuze kuncishiswe i-ingot igwema ukulahlekelwa yi-kerf kanye nomonakalo womphezulu ohambisana nokusaha i-diamond wire noma ukugoqa ngomshini. Iphinde igcine ubuqotho bekristalu futhi inciphise izidingo zokupholisha ezingezansi, okwenza i-Semiconductor Laser Lift-Off Equipment ibe ithuluzi elishintsha umdlalo lokukhiqizwa kwe-wafer yesizukulwane esilandelayo.

Imishini Yokuphakamisa I-Laser Ye-Semiconductor Guqula Ukuncipha Kwe-Ingot 2

Ukusetshenziswa Kwemishini Yokuphakamisa I-Laser Ye-Semiconductor

Imishini Yokuphakamisa I-Laser Semiconductor ithola ukusetshenziswa okubanzi ekuncipheni kwe-ingot kuzo zonke izinhlobo zezinto ezithuthukisiwe nezinhlobo zamadivayisi, okuhlanganisa:

Ukuncipha Kwe-GaN kanye ne-GaAs Ingot Kwamadivayisi Amandla
Ivumela ukudalwa kwe-wafer encane ukuze kube nama-transistors anamandla asebenza kahle kakhulu futhi amelana nokumelana okuphansi.

Ukuvuselelwa kwe-SiC Substrate kanye nokuhlukaniswa kwe-Lamella
Ivumela ukukhushulwa kwesilinganiso se-wafer kusuka kuma-substrate e-SiC amaningi ukuze kusetshenziswe izakhiwo zedivayisi eziqondile kanye nokusetshenziswa kabusha kwe-wafer.

Ukusikwa kwe-LED Wafer
Kwenza kube lula ukukhushulwa kwezingqimba ze-GaN kusuka kuma-ingot amakhulu e-sapphire ukuze kukhiqizwe ama-substrate e-LED amancane kakhulu.

Ukwakhiwa Kwedivayisi ye-RF kanye ne-Microwave
Isekela izakhiwo ze-transistor ezisebenza ngama-electron-mobility (HEMT) ezincane kakhulu ezidingekayo ezinhlelweni ze-5G kanye ne-radar.

Ukudluliselwa Kwesendlalelo Se-Epitaxial
Isusa ngokunembile izingqimba ze-epitaxial kuma-ingot ekristalu ukuze zisetshenziswe kabusha noma zihlanganiswe nezakhiwo ezihlukene.

Amaseli Elanga Anefilimu Encane kanye nama-Photovoltaics
Kusetshenziselwa ukuhlukanisa izendlalelo ezincane zokufunxa amaseli elanga aguquguqukayo noma asebenza kahle kakhulu.

Kuzo zonke lezi zindawo, i-Semiconductor Laser Lift-Off Equipment inikeza ukulawula okungenakuqhathaniswa kokufana kobukhulu, ikhwalithi yobuso, kanye nobuqotho besendlalelo.

Izinzuzo Zokunciphisa Ingot Esekelwe Ku-Laser

Ukulahlekelwa Izinto Ezingaguquki
Uma kuqhathaniswa nezindlela zendabuko zokusika i-wafer, inqubo ye-laser iphumela ekusetshenzisweni kwezinto cishe okungu-100%.

Ukucindezeleka Okuncane Nokusonteka
Ukususwa kokungathintani kuqeda ukudlidliza komshini, kunciphisa ukwakheka komnsalo we-wafer kanye nokuqhekeka kwe-microcrack.

Ukulondolozwa Kwekhwalithi Yomphezulu
Akudingeki ukugoqa noma ukupholisha ngemuva kokuncipha ezimweni eziningi, njengoba ukuphakanyiswa nge-laser kugcina ubuqotho bomphezulu.

Ukulungela Ukukhiqiza Okuphezulu Nokuzenzakalela
Iyakwazi ukucubungula amakhulu ezingxenye ezingaphansi ngokushintsha ngokulayisha/ukukhulula ngokuzenzakalelayo.

Ingaguquguquka ezintweni eziningi
Iyahambisana nezinto ze-GaN, i-SiC, i-sapphire, i-GaAs, kanye nezinto ze-III-V ezisafufusa.

Kuphephile Ngokwemvelo
Kunciphisa ukusetshenziswa kwezinto zokukhuhla kanye namakhemikhali aqinile avamile ezinqubweni zokunciphisa ezisekelwe ku-slurry.

Ukusetshenziswa Kabusha Kwe-Substrate
Ama-ingot anikelayo angaphinde asetshenziswe emijikelezweni eminingi yokuphakamisa, okunciphisa kakhulu izindleko zezinto zokwakha.

Imibuzo Evame Ukubuzwa (Imibuzo Evame Ukubuzwa) Yemishini Yokuphakamisa I-Laser Semiconductor

Q1: Yiluphi ububanzi bokujiya obungafinyelelwa yi-Semiconductor Laser Lift-Off Equipment kuma-wafer slices?
A1:Ubukhulu besilayi obujwayelekile busukela ku-10 µm kuya ku-100 µm kuye ngokuthi izinto zisetshenziswa kanjani kanye nokucushwa kwazo.

Umbuzo 2: Ingabe le mishini ingasetshenziswa ukunciphisa ama-ingot enziwe ngezinto ezingacacile njenge-SiC?
A2:Yebo. Ngokulungisa ubude be-laser kanye nokwenza ngcono ubunjiniyela be-interface (isb., izingqimba ezizidelayo), ngisho nezinto ezingacacile kahle zingacutshungulwa.

Umbuzo 3: I-substrate yomnikeli iqondaniswa kanjani ngaphambi kokususwa nge-laser?
A3:Uhlelo lusebenzisa amamojula okuqondanisa asekelwe kumbono we-sub-micron anempendulo evela kumamaki e-fiducial kanye nokuskena kokukhanya kobuso.

Q4: Yisiphi isikhathi somjikelezo esilindelekile somsebenzi owodwa wokuphakamisa nge-laser?
A4:Kuye ngobukhulu be-wafer kanye nobukhulu, imijikelezo evamile ihlala kusukela kumaminithi amabili kuya kwangu-10.

Umbuzo 5: Ingabe inqubo idinga indawo yokuhlanza?
A5:Nakuba kungaphoqelekile, ukuhlanganiswa kwegumbi lokuhlanza kuyanconywa ukuze kulondolozwe ukuhlanzeka kwe-substrate kanye nokukhiqiza kwedivayisi ngesikhathi sokusebenza okunembe kakhulu.

Mayelana NATHI

I-XKH igxile ekuthuthukisweni kobuchwepheshe obuphezulu, ekukhiqizweni, nasekuthengisweni kwengilazi ekhethekile ye-optical kanye nezinto ezintsha zekristalu. Imikhiqizo yethu ihlinzeka nge-optical electronics, i-consumer electronics, kanye nezempi. Sinikeza izingxenye ze-optical ze-Sapphire, izembozo zelensi yeselula, i-Ceramics, i-LT, i-Silicon Carbide SIC, i-Quartz, kanye nama-semiconductor crystal wafers. Ngobuchwepheshe obunekhono kanye nemishini esezingeni eliphezulu, sihamba phambili ekucutshungulweni komkhiqizo okungewona ojwayelekile, sihlose ukuba yibhizinisi elihamba phambili lezinto ze-optoelectronic tech.