Imishini Yokuphakamisa I-Laser Ye-Semiconductor

Isithombe Esivelele Semishini Yokuphakamisa I-Laser Semiconductor

Incazelo emfushane:

I-Semiconductor Laser Lift-Off Equipment imele ikhambi lesizukulwane esilandelayo lokunciphisa i-ingot okuthuthukisiwe ekucutshungulweni kwezinto ze-semiconductor. Ngokungafani nezindlela zendabuko zokuwafer ezincike ekugayweni kwemishini, ukusaha ucingo lwedayimane, noma ukuhleleka kwamakhemikhali, le pulatifomu esekelwe ku-laser inikeza enye indlela engenakuthintana, engonakalisi yokususa izendlalelo ezincane kakhulu kuma-ingots e-semiconductor amaningi.

Ilungiselelwe izinto ezibuthakathaka nezinenani eliphezulu njenge-gallium nitride (GaN), i-silicon carbide (SiC), i-sapphire, ne-gallium arsenide (GaAs), i-Semiconductor Laser Lift-Off Equipment ivumela ukunqunywa okunembile kwamafilimu esikali se-wafer ngqo kusuka ku-ingot yekristalu. Lobu buchwepheshe obuphambili bunciphisa kakhulu imfucuza yezinto ezibonakalayo, buthuthukisa ukuphuma, futhi buthuthukisa ubuqotho be-substrate - konke okubalulekile kumadivayisi esizukulwane esilandelayo kuma-electronics anamandla, izinhlelo ze-RF, ama-photonics, kanye nama-micro-display.

Sithumelele i-imeyili

Izici

Umdwebo Oningiliziwe

Ukubuka Konke Komkhiqizo Wemishini Yokuphakamisa I-Laser

Ngokugcizelela ukulawula okuzenzakalelayo, ukwakheka kwe-beam, kanye nokuhlaziywa kokusebenzisana kwezinto ze-laser, i-Semiconductor Laser Lift-Off Equipment yakhelwe ukuhlanganiswa kalula emisebenzini yokukhiqiza ye-semiconductor ngenkathi isekela ukuguquguquka kwe-R&D kanye nokukhula kokukhiqiza ngobuningi.

Ubuchwepheshe kanye nesimiso sokusebenza semishini yokuphakamisa i-laser

Inqubo eyenziwa yi-Semiconductor Laser Lift-Off Equipment iqala ngokukhanyisa i-ingot yomnikelo kusukela kolunye uhlangothi kusetshenziswa i-ultraviolet laser beam enamandla aphezulu. Lo msebe ugxile kakhulu ekujuleni kwangaphakathi okuthile, ngokuvamile ku-interface eklanywe ngobunjiniyela, lapho ukumuncwa kwamandla kwandiswa khona ngenxa yokungafani kokukhanya, ukushisa, noma amakhemikhali.

Kulesi sigaba sokumunca amandla, ukushisa kwendawo kuholela ekuqhumeni okusheshayo kwe-micro-explosion, ukwanda kwegesi, noma ukubola kwesigaba esiphakathi (isb., ifilimu yokucindezela noma i-sacrificial oxide). Lokhu kuphazamiseka okulawulwa kahle kubangela ukuthi ungqimba oluphezulu lwekristalu - olunobukhulu obungama-micrometer angamashumi - lusuke endaweni eyisisekelo kahle.

I-Semiconductor Laser Lift-Off Equipment isebenzisa amakhanda okuskena avumelaniswe nokunyakaza, ukulawula i-z-axis okuhleliwe, kanye ne-reflectometry yesikhathi sangempela ukuqinisekisa ukuthi ukushaya kwenhliziyo ngakunye kuletha amandla ngqo endaweni eqondiwe. Imishini ingalungiswa futhi ngamakhono e-burst-mode noma ama-multi-pulse ukuze kuthuthukiswe ukushelela kwe-detachment nokunciphisa ukucindezeleka okusele. Okubalulekile, ngoba umsebe we-laser awukaze uthinte izinto ngokoqobo, ingozi yokuqhekeka, ukugoba, noma ukuqhekeka kwendawo incishiswa kakhulu.

Lokhu kwenza indlela yokunciphisa i-laser lift-off ibe yinto eshintsha kakhulu, ikakhulukazi ezisetshenziswayo lapho kudingeka khona ama-wafer acwebezelayo kakhulu, acwebezelayo kakhulu ane-sub-micron TTV (Total Thickness Variation).

Ipharamitha Yemishini Yokuphakamisa I-Laser Ye-Semiconductor

Ubude begagasi	I-IR/SHG/THG/FHG
Ububanzi be-Pulse	I-Nanosecond, i-Picosecond, i-Femtosecond
Uhlelo Lokubona	Uhlelo oluqondile lwe-optical noma uhlelo lwe-Galvano-optical
Isigaba se-XY	500 mm × 500 mm
Ibanga Lokucubungula	160 mm
Isivinini Sokunyakaza	Ubuningi obungu-1,000 mm/sec
Ukuphindaphinda	±1 μm noma ngaphansi
Ukunemba Kwesikhundla Esiphelele:	±5 μm noma ngaphansi
Usayizi we-Wafer	Amasentimitha angu-2–6 noma enziwe ngezifiso
Ukulawula	I-Windows 10, 11 kanye ne-PLC
I-Voltage Yokunikezwa Kwamandla	I-AC 200 V ±20 V, Isigaba esisodwa, 50/60 kHz
Ubukhulu Bangaphandle	2400 mm (W) × 1700 mm (D) × 2000 mm (H)
Isisindo	1,000 kg

Ukusetshenziswa Kwezimboni Kwemishini Yokuphakamisa I-Laser

Imishini Yokuphakamisa I-Laser Semiconductor ishintsha ngokushesha indlela izinto ezilungiselelwa ngayo ezizindeni eziningi ze-semiconductor:

Amadivayisi Amandla e-GaN aqondile emishini yokuphakamisa i-Laser

Ukususwa kwamafilimu e-GaN-on-GaN amancane kakhulu avela kuma-ingot amakhulu kwenza ukwakheka kokuqhuba okuqondile kanye nokusetshenziswa kabusha kwezingxenye ezibizayo.

Ukunciphisa i-SiC Wafer kwamadivayisi e-Schottky kanye ne-MOSFET

Kunciphisa ukujiya kwesendlalelo sedivayisi ngenkathi kulondolozwa ukuhleleka kwe-substrate — kulungele ama-electronics anamandla ashintsha ngokushesha.

Izinto ze-LED ezisekelwe ku-Sapphire kanye nezibonisi zemishini yokuphakamisa i-laser

Ivumela ukuhlukaniswa okuphumelelayo kwezingqimba zamadivayisi kusuka kuma-sapphire boules ukusekela ukukhiqizwa kwe-micro-LED encane, elungiselelwe ukushisa.

Ubunjiniyela Bezinto Ze-III-V Bemishini Yokuphakamisa I-Laser

Isiza ukuhlukanisa izendlalelo ze-GaAs, InP, kanye ne-AlGaN ukuze kuhlanganiswe i-optoelectronic ethuthukisiwe.

Ukwenziwa kwe-Thin-Wafer IC kanye ne-Sensor

Ikhiqiza izendlalelo ezincane ezisebenzayo zezinzwa zokucindezela, ama-accelerometer, noma ama-photodiode, lapho ubukhulu buyisithiyo sokusebenza.

I-Electronics Eguquguqukayo Nebonakalayo

Ilungiselela ama-substrate amancane kakhulu afanelekela izibonisi eziguquguqukayo, amasekethe agqokwayo, namafasitela ahlakaniphile abonakalayo.

Kuzo zonke lezi zindawo, i-Semiconductor Laser Lift-Off Equipment idlala indima ebalulekile ekwenzeni kube lula ukwenza izinto zibe zincane, ukusetshenziswa kabusha kwezinto, kanye nokwenza lula inqubo.

Imibuzo Evame Ukubuzwa (FAQ) Yemishini Yokuphakamisa I-Laser

Q1: Bungakanani ubukhulu obuncane engingakwazi ukubufinyelela ngisebenzisa i-Semiconductor Laser Lift-Off Equipment?
A1:Ngokuvamile iphakathi kwama-micron ayi-10–30 kuye ngokuthi isetshenziswa kanjani. Inqubo iyakwazi ukukhiqiza imiphumela emincane ngokusetha okushintshiwe.

Umbuzo 2: Ingabe lokhu kungasetshenziswa ukusika ama-wafer amaningi kusuka ku-ingot efanayo?
A2:Yebo. Amakhasimende amaningi asebenzisa indlela yokuphakamisa nge-laser ukuze akhiphe ngokulandelelana izendlalelo eziningi ezincane kusuka ku-ingot eyodwa enkulu.

Q3: Yiziphi izici zokuphepha ezifakiwe ekusebenzeni kwe-laser enamandla amakhulu?
A3:Izivalo ze-Class 1, izinhlelo zokukhiya, ukuvikela imisebe, kanye nokuvala okuzenzakalelayo konke kujwayelekile.

Umbuzo 4: Lolu hlelo luqhathaniswa kanjani nosaha bensimbi yedayimane ngokwezindleko?
A4:Nakuba i-capex yokuqala ingaba phezulu, ukukhushulwa nge-laser kunciphisa kakhulu izindleko ezisetshenziswayo, umonakalo we-substrate, kanye nezinyathelo zangemva kokucutshungulwa - kunciphisa izindleko eziphelele zobunikazi (TCO) zesikhathi eside.

U-Q5: Ingabe inqubo ingandiswa ibe yizingcezu ezingama-intshi angu-6 noma angu-8?
A5:Impela. Ipulatifomu isekela ama-substrate angafika ku-12-intshi anokusatshalaliswa kwemisebe efanayo kanye nezigaba zokunyakaza zefomethi enkulu.

Mayelana NATHI

I-XKH igxile ekuthuthukisweni kobuchwepheshe obuphezulu, ekukhiqizweni, nasekuthengisweni kwengilazi ekhethekile ye-optical kanye nezinto ezintsha zekristalu. Imikhiqizo yethu ihlinzeka nge-optical electronics, i-consumer electronics, kanye nezempi. Sinikeza izingxenye ze-optical ze-Sapphire, izembozo zelensi yeselula, i-Ceramics, i-LT, i-Silicon Carbide SIC, i-Quartz, kanye nama-semiconductor crystal wafers. Ngobuchwepheshe obunekhono kanye nemishini esezingeni eliphezulu, sihamba phambili ekucutshungulweni komkhiqizo okungewona ojwayelekile, sihlose ukuba yibhizinisi elihamba phambili lezinto ze-optoelectronic tech.