Imishini ye-semiconductor
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I-Glass Laser Cutting Machine yokucubungula ingilazi eyisicaba
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I-Precision Microjet Laser System ye-Hard & Brittle Materials
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I-High-Precision Laser Micromachining System
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I-High Precision Laser Drilling Machine laser drilling laser cutting
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Umshini Wokubhoboza we-Glass Laser
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I-12inch Ngokugcwele Okuzenzakalelayo Okuzenzakalelayo Kokuhlukanisa Isisetshenziswa Sesisetshenziswa Sesicwecwe Esizinikezele Sokusika se-Si/SiC & HBM (Al)
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Isisetshenziswa sokusika indandatho ye-wafer ezenzakalelayo Ngokugcwele Usayizi Osebenzayo 8inch/12inch Wafer Ring Cutting
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I-Laser Anti-Mgunyathi Imishini Yokumaka I-Sapphire Wafer
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Uhlelo Lokumaka I-Laser Anti-Counterfeiting lwe-Sapphire Substrates, Izidayeli zewashi, ubucwebe bokunethezeka
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Isithando somlilo se-SiC crystal I-SiC Ingot ekhulisa i-4inch 6inch 8inch PTV Lely TSSG LPE indlela yokukhula
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Umshini wokubhoboza wetafula elincane we-laser 1000W-6000W ubuncane bembobo obungu-0.1MM ungasetshenziselwa izinto zokwakha zengilazi zensimbi
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Umshini wokumba we-laser wokunemba okuphezulu we-sapphire ceramic material gem ephethe umbhobho wokumba