Imishini ye-semiconductor
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Umugqa Wokuzilawula Ozenzakalelayo Wokupholisha Oxhumene Nezigaba Ezine we-Silicon / Silicon Carbide (SiC) (Umugqa Wokuphatha Ohlanganisiwe We-Post-Polish)
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Isixazululo Esihlanganisiwe Sokumboza Imbewu ye-SiC–Bonding–Sintering
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Uhlelo Lokusebenza Nge-Laser Micromachining Olunembe Kakhulu
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I-Multi-Wire Diamond Wire Saw Yokusika Izinto Eziqinile Nezithambile Ngokucophelela
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Umshini Wokucubungula I-Micro Waterjet Oqondiswa Yi-Laser
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Umshini Wokusika Idayimane Onocingo Oluningi Oluguquguqukayo Onokunemba Okuphezulu Okusheshayo
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I-Multi-Wire Diamond Saw TJ3000 12″ Inverted Downward Swing
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Imishini Yokusika Izintambo Yezinto Ze-Sapphire/Ceramics/Marble Ekusikeni Okuqondile/Okuvundlile/Okwezintambo Eziningi
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Izingxenye Zokuxhumana Ne-Laser Esheshayo Nama-Terminals
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Umshini Wokusika Owenziwe Ngezintambo Eziningi Zedayimane Osheshayo Oqondile Kakhulu Oqonde Phansi
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Imishini Yokupholisha Ehlangothini Elilodwa Enemba Kakhulu
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Umshini Wokugaya Oqondile Ohlangothini Olubili we-SiC Sapphire Si wafer