Ngo-1965, umsunguli we-Intel uGordon Moore waveza lokho okwaba “uMthetho kaMoore.” Iminyaka engaphezu kwengxenye yekhulu leminyaka yasekela inzuzo eqhubekayo ekusebenzeni kwesekethe ehlanganisiwe (IC) kanye nokwehla kwezindleko—okuyisisekelo sobuchwepheshe bedijithali besimanje. Ngamafuphi: inani lama-transistor ku-chip cishe liphindeka kabili njalo eminyakeni emibili.
Sekuyiminyaka eminingi, intuthuko ilandelela lelo jubane. Manje isithombe siyashintsha. Ukuncipha okwengeziwe kuye kwaba nzima; osayizi bezici behle baba ngama-nanometer ambalwa nje. Onjiniyela bahlangabezana nemikhawulo ebonakalayo, izinyathelo zenqubo eziyinkimbinkimbi kakhulu, kanye nezindleko ezikhuphukayo. Amajiyometri amancane nawo anciphisa isivuno, okwenza ukukhiqizwa okuphezulu kube nzima. Ukwakha nokusebenzisa i-fab ehamba phambili kudinga imali enkulu kanye nobuchwepheshe. Ngakho-ke abaningi baphikisana ngokuthi uMthetho kaMoore ulahlekelwa yisivinini.
Lolo shintsho luvule ithuba lendlela entsha: ama-chiplets.
I-chiplet iyisitsha esincane esenza umsebenzi othile—empeleni ucezu lwalokho okwakuyi-chip eyodwa ye-monolithic. Ngokuhlanganisa ama-chiplet amaningi ephaketheni elilodwa, abakhiqizi bangahlanganisa uhlelo oluphelele.
Esikhathini se-monolithic, yonke imisebenzi yayiphila ngedayi eyodwa enkulu, ngakho-ke isici noma kuphi sasingakwazi ukulahla yonke i-chip. Ngama-chiplets, izinhlelo zakhiwe nge-"known-good die" (KGD), okuthuthukisa kakhulu ukusebenza kahle kwesivuno kanye nokukhiqiza.
Ukuhlanganiswa okungafani—ukuhlanganisa ama-dies akhelwe kuma-node enqubo ahlukene kanye nemisebenzi ehlukene—kwenza ama-chiplet abe namandla kakhulu. Amabhulokhi e-compute asebenza kahle angasebenzisa ama-node akamuva, kuyilapho imemori kanye ne-analog circuits zihlala kubuchwepheshe obuvuthiwe nobungabizi kakhulu. Umphumela: ukusebenza okuphezulu ngezindleko eziphansi.
Imboni yezimoto inentshisekelo enkulu. Abakhiqizi bezimoto abakhulu basebenzisa lawa masu ukuthuthukisa ama-SoC esikhathi esizayo emotweni, okuhloswe ngawo ukwamukelwa ngobuningi ngemva kuka-2030. Ama-Chiplet awavumela ukuthi akhulise i-AI kanye nehluzo ngempumelelo enkulu ngenkathi ethuthukisa isivuno—okukhulisa ukusebenza kanye nokusebenza kuma-semiconductor ezimoto.
Ezinye izingxenye zezimoto kumele zihlangabezane nezindinganiso eziqinile zokusebenza nokuphepha futhi ngaleyo ndlela zithembele kuma-node amadala, aqinisekisiwe. Okwamanje, izinhlelo zesimanje ezifana nosizo lomshayeli oluthuthukisiwe (i-ADAS) kanye nezimoto ezichazwe yisoftware (ama-SDV) zidinga ukubalwa okwengeziwe. Ama-Chiplet avala leso sikhala: ngokuhlanganisa ama-microcontroller ekilasi lokuphepha, inkumbulo enkulu, kanye nama-accelerator e-AI anamandla, abakhiqizi bangenza ama-SoC avumelane nezidingo zomenzi ngamunye wezimoto—ngokushesha.
Lezi zinzuzo zidlulela ngale kwezimoto. Ukwakhiwa kwe-chiplet kusakazekela ku-AI, ezokuxhumana, nakwezinye izindawo, kusheshisa ukusungula izinto ezintsha kuzo zonke izimboni futhi kuba yinsika yendlela ye-semiconductor.
Ukuhlanganiswa kwe-Chiplet kuncike ekuxhumekeni okuqinile, okusheshayo kwe-die-to-die. Isihluthulelo esiyinhloko yi-interposer—ungqimba oluphakathi, ngokuvamile i-silicon, ngaphansi kwe-dies ehambisa izimpawu njengebhodi elincane lesifunda. Ama-interposer angcono asho ukuhlangana okuqinile kanye nokushintshana kwesignali okusheshayo.
Ukupakishwa okuthuthukisiwe nakho kuthuthukisa ukulethwa kwamandla. Ukuhlanganiswa okuningana kwezinsimbi ezincane phakathi kwamadayi kuhlinzeka ngezindlela ezanele zamanje kanye nedatha ngisho nasezindaweni ezixineneyo, okuvumela ukudluliselwa kwe-bandwidth ephezulu ngenkathi kusetshenziswa kahle indawo yephakheji elinganiselwe.
Indlela evamile yanamuhla ukuhlanganiswa kwe-2.5D: ukubeka ama-dies amaningi eceleni kwe-interposer. Igxathu elilandelayo ukuhlanganiswa kwe-3D, lapho ama-dies anqwabelana khona ngokuqondile kusetshenziswa ama-via e-through-silicon (ama-TSV) ukuze kube nobuningi obukhulu nakakhulu.
Ukuhlanganisa ukwakheka kwe-modular chip (ukuhlukanisa imisebenzi kanye nezinhlobo zesekethe) nge-3D stacking kuveza ama-semiconductor asheshayo, amancane, futhi asebenzisa amandla amaningi. Ukuhlanganisa inkumbulo kanye nokubala kuletha i-bandwidth enkulu kumasethi edatha amakhulu—kufanelekile kwi-AI kanye neminye imisebenzi esebenza kahle.
Nokho, ukuhlanganisa izinto ngokuqondile kuletha izinselele. Ukushisa kuqongelela kalula, okwenza kube nzima ukuphathwa kokushisa kanye nokukhiqiza. Ukuze kuxazululwe lokhu, abacwaningi bathuthukisa izindlela ezintsha zokupakisha ukuze babhekane kangcono nemingcele yokushisa. Noma kunjalo, umfutho unamandla: ukuhlangana kwama-chiplets kanye nokuhlanganiswa kwe-3D kubhekwa kabanzi njengepharadesi eliphazamisayo—elilungele ukuthwala isibani lapho uMthetho kaMoore ushiya khona.
Isikhathi sokuthunyelwe: Okthoba-15-2025