Ngo-1965, umsunguli we-Intel uGordon Moore waveza lokho okwaba “uMthetho kaMoore.” Iminyaka engaphezu kwengxenye yekhulu isekela izinzuzo eziqhubekayo ekusebenzeni kwe-integrated-circuit (IC) kanye nokwehla kwezindleko—isisekelo sobuchwepheshe besimanje bedijithali. Ngamafuphi: inani lama-transistors ku-chip liphindwe kabili njalo eminyakeni emibili.
Iminyaka eminingi, inqubekelaphambili ilandelela lowo mshophi. Manje isithombe siyashintsha. Ukuncipha okuqhubekayo kuye kwaba nzima; osayizi besici behlele kuma-nanometer ambalwa nje. Onjiniyela bangena emikhawulweni yomzimba, izinyathelo zenqubo eyinkimbinkimbi, kanye nezindleko ezikhuphukayo. Amajiyometri amancane nawo acindezela isivuno, okwenza ukukhiqizwa kwevolumu ephezulu kube nzima. Ukwakha nokusebenzisa indwangu ehamba phambili kudinga imali eningi nobungcweti. Ngakho-ke abaningi bathi uMthetho kaMoore uphelelwa umoya.
Lolo shintsho luye lwavula umnyango wendlela entsha: ama-chiplets.
I-chiplet idayi elincane elenza umsebenzi othile—empeleni ucezu lwalokho okwakukade kuyi-chip eyodwa ye-monolithic. Ngokuhlanganisa ama-chiplets amaningi ephaketheni elilodwa, abakhiqizi bangahlanganisa uhlelo oluphelele.
Esikhathini se-monolithic, yonke imisebenzi yayiphila endaweni eyodwa enkulu, ngakho-ke ukukhubazeka noma kuphi kwakungasusa yonke i-chip. Ngama-chiplets, amasistimu akhiwa "kukufa okwaziwayo" (KGD), athuthukisa ngokuphawulekayo isivuno kanye nokusebenza kahle kokukhiqiza.
Ukuhlanganiswa okuhlukahlukene—ukuhlanganisa ukufa okwakhelwe phezu kwamanodi enqubo ahlukene kanye nemisebenzi ehlukene—kwenza ama-chiplets abe namandla ikakhulukazi. Amabhulokhi ekhompiyutha asebenza kahle kakhulu angasebenzisa ama-node akamuva, kuyilapho amasekhethi enkumbulo nama-analogi ahlala kubuchwepheshe obuvuthiwe, obungabiza kakhulu. Umphumela: ukusebenza okuphezulu ngezindleko eziphansi.
Imboni yezimoto inentshisekelo ikakhulukazi. Abakhiqizi bezimoto abakhulu basebenzisa lawa maqhinga ukuze bathuthukise ama-SoCs emoto esikhathini esizayo, nokutholwa ngobuningi okuqondiswe ngemva kuka-2030. Ama-Chiplets awavumela ukuba alinganise i-AI nezithombe ngendlela ephumelela kakhudlwana kuyilapho ethuthukisa isivuno—enyusa kokubili ukusebenza nokusebenza kuma-semiconductors ezimoto.
Ezinye izingxenye zezimoto kufanele zenelise izindinganiso eziqinile zokuphepha futhi ngaleyo ndlela zithembele kumanodi amadala, aqinisekisiwe. Ngaleso sikhathi, izinhlelo zesimanje ezifana nosizo oluthuthukisiwe lwabashayeli (ADAS) kanye nezimoto ezichazwe ngesoftware (SDVs) zifuna ukubala okwengeziwe. Ama-Chiplets avala lelo gebe: ngokuhlanganisa izilawuli ezincane zesigaba sokuphepha, inkumbulo enkulu, nama-accelerator e-AI anamandla, abakhiqizi bangakwazi ukuhlanganisa ama-SoCs ngokwezidingo zomakhi ngamunye—ngokushesha.
Lezi zinzuzo zidlulela ngale kwezimoto. I-Chiplet architectures isakazekela ku-AI, telecom, nakwezinye izizinda, isheshisa ukuqanjwa kabusha kuzo zonke izimboni futhi iba ngokushesha insika yomgwaqo we-semiconductor.
Ukuhlanganiswa kwe-Chiplet kuncike ekuxhumekeni okuhlangene, okunesivinini esikhulu sokufa ukuze ufe. Isici esiyinhloko yi-interposer—ungqimba oluphakathi nendawo, ngokuvamile i-silicon, ngaphansi kwe-dies ehambisa amasignali afana nebhodi lesifunda elincane. Ama-interposer angcono asho ukuhlangana okuqinile kanye nokushintshaniswa kwesignali okusheshayo.
Ukupakisha okuthuthukisiwe nakho kuthuthukisa ukulethwa kwamandla. Amalungu afanayo aminyene oxhumano lwensimbi oluncane phakathi kwama-dies ahlinzeka ngezindlela ezanele zamanje kanye nedatha ngisho nasezikhaleni eziqinile, okuvumela ukudluliswa komkhawulokudonsa ophezulu kuyilapho kusetshenziswa kahle indawo yephakheji elinganiselwe.
Indlela yanamuhla evamile ukuhlanganisa okungu-2.5D: ukubeka amafa amaningi ngapha nangapha kusifakeli. Ukweqa okulandelayo ukuhlanganiswa kwe-3D, okuyizitaki ezifa ziqonde kusetshenziswa i- through-silicon vias (TSVs) ngokuminyana okuphezulu nakakhulu.
Ukuhlanganisa i-modular chip design (imisebenzi ehlukanisayo nezinhlobo zamasekethe) ne-3D stacking ikhiqiza ngokushesha, okuncane, ama-semiconductors awonga amandla kakhudlwana. Ukuthola inkumbulo ngokuhlanganyela kanye nokubamba iqhaza kuletha umkhawulokudonsa omkhulu kumadathasethi amakhulu—okulungele i-AI neminye imisebenzi esebenza kahle kakhulu.
Ukupakisha okuqondile, nokho, kuletha izinselele. Ukushisa kunqwabelana kalula, kube nzima ukuphatha okushisayo kanye nesivuno. Ukubhekana nalokhu, abacwaningi bathuthukisa izindlela ezintsha zokupakisha zokusingatha kangcono izithiyo ezishisayo. Noma kunjalo, umfutho unamandla: ukuhlangana kwama-chiplets nokuhlanganiswa kwe-3D kubukwa kabanzi njengepharadigm ephazamisayo—elungele ukuthwala ithoshi lapho uMthetho kaMoore ushiya khona.
Isikhathi sokuthumela: Oct-15-2025