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Umshini Wokusika Idayimane Osebenzisa Izintambo Eziningi Wezinto Eziqinile Eziqinile Ze-SiC Sapphire

Umshini Wokusika Idayimane Osebenzisa Izintambo Eziningi Wezinto Eziqinile Eziqinile Ze-SiC Sapphire Isithombe Esifakiwe
  • Umshini Wokusika Idayimane Osebenzisa Izintambo Eziningi Wezinto Eziqinile Eziqinile Ze-SiC Sapphire
  • Umshini Wokusika Idayimane Osebenzisa Izintambo Eziningi Wezinto Eziqinile Eziqinile Ze-SiC Sapphire
  • Umshini Wokusika Idayimane Osebenzisa Izintambo Eziningi Wezinto Eziqinile Eziqinile Ze-SiC Sapphire

Incazelo emfushane:

Umshini wokusika idayimane onezintambo eziningi uwuhlelo lokusika olusezingeni eliphezulu olwenzelwe ukucubungula izinto eziqinile kakhulu neziphuka kalula. Ngokusebenzisa izintambo eziningi ezimbozwe ngedayimane ezifanayo, umshini ungasika ama-wafer amaningi ngesikhathi esisodwa ngomjikelezo owodwa, ufeze kokubili ukukhiqiza okuphezulu kanye nokunemba.


Izici

Isingeniso kuMshini Wokusika Idayimane Osebenzisa Izintambo Eziningi

Umshini wokusika idayimane onezintambo eziningi uwuhlelo lokusika olusezingeni eliphezulu olwenzelwe ukucubungula izinto eziqinile kakhulu neziphuka kalula. Ngokusebenzisa izintambo eziningi ezimbozwe ngedayimane ezifanayo, umshini ungasika ama-wafer amaningi ngesikhathi esisodwa ngomjikelezo owodwa, ufeze kokubili ukukhiqiza okuphezulu kanye nokunemba. Lobu buchwepheshe sebube ithuluzi elibalulekile ezimbonini ezifana nama-semiconductor, ama-photovoltaics elanga, ama-LED, kanye ne-ceramics ethuthukisiwe, ikakhulukazi ezintweni ezifana ne-SiC, i-sapphire, i-GaN, i-quartz, ne-alumina.

Uma kuqhathaniswa nokusika okuvamile kwentambo eyodwa, ukucushwa kwentambo eziningi kuletha amashumi kuya kwamakhulu ezingcezu ngebhetshi ngayinye, kunciphisa kakhulu isikhathi sokujikeleza ngenkathi kugcina ukuthamba okuhle kakhulu (Ra < 0.5 μm) kanye nokunemba okulinganayo (± 0.02 mm). Umklamo wayo we-modular uhlanganisa ukucindezela kwentambo okuzenzakalelayo, izinhlelo zokuphatha izinto zokusebenza, kanye nokuqapha ku-inthanethi, ukuqinisekisa ukukhiqizwa kwesikhathi eside, okuzinzile, nokuzenzakalelayo ngokugcwele.

Amapharamitha Obuchwepheshe Bomshini Wokusika Idayimane Osebenzisa Izintambo Eziningi

Into Imininingwane Into Imininingwane
Usayizi womsebenzi omkhulu (Isikwele) 220 × 200 × 350 mm Injini yokushayela 17.8 kW × 2
Usayizi womsebenzi omkhulu (Uyindilinga) Φ205 × 350 mm Injini yokushayela ngocingo 11.86 kW × 2
Isikhala se-spindle Φ250 ±10 × 370 × 2 i-axis (mm) Injini yokuphakamisa itafula elisebenzayo 2.42 kW × 1
I-axis eyinhloko 650 mm Injini yokushintsha 0.8 kW × 1
Isivinini sokusebenza kwezintambo 1500 m/min Injini yokuhlela 0.45 kW × 2
Ububanzi bentambo Φ0.12–0.25 mm Injini yokucindezela 4.15 kW × 2
Isivinini sokuphakamisa 225 mm/min Injini ye-slurry 7.5 kW × 1
Ukujikeleza kwetafula okuphezulu ±12° Umthamo wethangi le-slurry 300 L
I-engeli yokujika ±3° Ukugeleza kwesibandisi 200 L/min
Imvamisa yokushintshashintsha ~Izikhathi ezingu-30/umzuzu Ukunemba kwezinga lokushisa ±2 °C
Izinga lokuphakelayo 0.01–9.99 mm/min Ukunikezwa kwamandla kagesi 335+210 (mm²)
Izinga lokuphakelwa kwentambo 0.01–300 mm/min Umoya ocindezelwe 0.4–0.6 MPa
Usayizi womshini 3550 × 2200 × 3000 mm Isisindo 13,500 kg

Indlela Yokusebenza Yomshini Wokusika Idayimane Osebenzisa Izintambo Eziningi

  1. Ukunyakaza Kokusika Ngezintambo Eziningi
    Izintambo eziningi zedayimane zihamba ngesivinini esivumelanisiwe esifinyelela ku-1500 m/min. Ama-pulley aqondiswa ngokunembile kanye nokulawula ukucindezeleka okuvaliwe (15–130 N) kugcina izintambo zizinzile, kunciphisa amathuba okuphambuka noma ukuphuka.

  2. Ukondla Nokubeka Okunembile
    Ukuma okuqhutshwa yi-servo kufinyelela ukunemba okungu-±0.005 mm. Ukulungiswa okukhethwayo nge-laser noma okusizwa umbono kuthuthukisa imiphumela yezimo eziyinkimbinkimbi.

  3. Ukupholisa Nokususa Udoti
    Isipholisi esinomfutho ophezulu sisusa ama-chips futhi sipholise indawo yokusebenza, sivimbele umonakalo wokushisa. Ukuhlunga okunezigaba eziningi kwandisa impilo yesipholisi futhi kunciphisa isikhathi sokungasebenzi.

  4. Ipulatifomu Yokulawula Okuhlakaniphile
    Ama-servo drivers aphendula kakhulu (<1 ms) alungisa ngokuguquguqukayo okuphakelayo, ukucindezeleka, kanye nesivinini sentambo. Ukuphathwa kweresiphi okuhlanganisiwe kanye nokushintsha kwepharamitha ngokuchofoza okukodwa kwenza kube lula ukukhiqizwa kwesisindo.

Izinzuzo Eziyinhloko Zomshini Wokusika Idayimane Osebenzisa Izintambo Eziningi

  • Ukukhiqiza Okuphezulu
    Iyakwazi ukusika ama-wafer angu-50-200 ngokusebenza ngakunye, ngokulahlekelwa yi-kerf <100 μm, okuthuthukisa ukusetshenziswa kwezinto kuze kufike ku-40%. Umthamo wokusebenza ungama-5-10× awezinhlelo zendabuko zentambo eyodwa.

  • Ukulawula Okunembile
    Ukuqina kokucindezeleka kwentambo ngaphakathi kuka-±0.5 N kuqinisekisa imiphumela ehambisanayo ezintweni ezahlukahlukene ezibuthakathaka. Ukuqapha ngesikhathi sangempela ku-interface ye-HMI engu-10" kusekela isitoreji seresiphi kanye nokusebenza kude.

  • Ukwakheka Okuguquguqukayo, Okunemodular
    Iyahambisana nobubanzi bentambo kusukela ku-0.12–0.45 mm ezinqubweni ezahlukene zokusika. Ukuphathwa kwerobhothi okukhethwayo kuvumela imigqa yokukhiqiza ezenzakalelayo ngokuphelele.

  • Ukuthembeka Kwezinga Lezimboni
    Amafreyimu aqinile/ahlanganisiwe anciphisa ukuguguleka (<0.01 mm). Ama-pulleys aqondisayo anezimbozo ze-ceramic noma ze-carbide anikeza amahora angaphezu kuka-8000 okuphila kwenkonzo.

Uhlelo Lokusaha Idayimane Olunezintambo Eziningi Lwezinto Eziqinile Eziqinile Ze-SiC Sapphire 2

Izinkambu Zokusebenza Zomshini Wokusika Idayimane Osebenzisa Izintambo Eziningi

  • Ama-semiconductor: Ukusika i-SiC yamamojula kagesi e-EV, ama-substrate e-GaN amadivayisi e-5G.

  • I-Photovoltaics: Ukusikwa kwe-silicon wafer yesivinini esiphezulu enokulingana okungu-±10 μm.

  • I-LED kanye ne-Optics: Izisekelo ze-sapphire zezinto ezibonakalayo ze-epitaxy kanye ne-precision optical ezine-edge chipping edge engaphansi kuka-20 μm.

  • Izitsha Zobumba Ezithuthukisiwe: Ukucutshungulwa kwe-alumina, i-AlN, nezinto ezifanayo zezingxenye zokuphathwa kwezindiza kanye nokushisa.

Uhlelo Lokusaha Idayimane Olunezintambo Eziningi Lwezinto Eziqinile Eziqinile Ze-SiC Sapphire 3

 

Uhlelo Lokusaha Idayimane Olunezintambo Eziningi Lwezinto Eziqinile Eziqinile Ze-SiC Sapphire 5

Uhlelo Lokusaha Idayimane Olunezintambo Eziningi Lwezinto Eziqinile Eziqinile Ze-SiC Sapphire 6

Imibuzo Evame Ukubuzwa – Umshini Wokusika Idayimane Osebenzisa Izintambo Eziningi

Umbuzo 1: Yiziphi izinzuzo zokusaha ngezintambo eziningi uma kuqhathaniswa nemishini yezintambo eyodwa?
A: Izinhlelo zezintambo eziningi zingasika amashumi amaningi zibe amakhulu ama-wafer ngesikhathi esisodwa, okwandisa ukusebenza kahle ngo-5–10×. Ukusetshenziswa kwezinto ezibonakalayo kuphakeme kakhulu ngokulahleka kwe-kerf okungaphansi kuka-100 μm, okwenza kube kuhle kakhulu ekukhiqizweni ngobuningi.

Q2: Yiziphi izinhlobo zezinto ezingacutshungulwa?
A: Lo mshini wenzelwe izinto eziqinile neziphuka kalula, okuhlanganisa i-silicon carbide (SiC), i-sapphire, i-gallium nitride (GaN), i-quartz, i-alumina (Al₂O₃), kanye ne-aluminium nitride (AlN).

Q3: Kuyini ukunemba okungafinyeleleka kanye nekhwalithi yobuso?
A: Ubulukhuni bomphezulu bungafinyelela ku-Ra <0.5 μm, ngokunemba kobukhulu obungu-±0.02 mm. Ukuqhekeka komphetho kungalawulwa ku-<20 μm, kuhlangabezane nezindinganiso zemboni ye-semiconductor kanye ne-optoelectronic.

Umbuzo 4: Ingabe inqubo yokusika ibangela imifantu noma umonakalo?
A: Ngomshini wokupholisa onengcindezi ephezulu kanye nokulawula ukucindezeleka okuvaliwe, ingozi yokuqhekeka okuncane kanye nomonakalo wokucindezeleka iyancishiswa, okuqinisekisa ubuqotho obuhle be-wafer.

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