Umshini Wokusaha Wedayimane Onezintambo Eziningi Wezinto Zokusebenza ze-SiC Sapphire Ultra-Hard Brittle
Isingeniso somshini wokusaha wedayimane we-Multi-Wire
Umshini wokusaha wedayimane onezintambo eziningi uwuhlelo lwesimanje lokusika oluklanyelwe ukucubungula izinto eziqinile kakhulu neziphukayo. Ngokufaka izintambo eziningi ezihambisanayo ezinamekwe ngedayimane, umshini ungasika amawafa amaningi ngesikhathi esisodwa ngomjikelezo owodwa, uzuze kokubili ukuphuma okuphezulu nokunemba. Lobu buchwepheshe sebuphenduke ithuluzi elibalulekile ezimbonini ezifana nama-semiconductors, ama-solar photovoltaics, ama-LED, nezitsha zobumba ezithuthukisiwe, ikakhulukazi ezintweni ezifana ne-SiC, isafire, i-GaN, i-quartz, ne-alumina.
Uma kuqhathaniswa nokusika okuvamile kocingo olulodwa, ukucushwa kwezintambo eziningi kuletha inqwaba kumakhulu ezingcezu iqoqo ngalinye, kunciphisa kakhulu isikhathi somjikelezo kuyilapho kugcinwa ukucaba okubabazekayo (Ra <0.5 μm) nokunemba kobukhulu (±0.02 mm). Idizayini yayo eyimojula ihlanganisa ukucindezelwa kwezintambo okuzenzakalelayo, izinhlelo zokubamba izingcezu zokusebenza, nokuqapha ku-inthanethi, ukuqinisekisa ukukhiqizwa kwesikhathi eside, okuzinzile, nokuzenzakalelayo ngokuphelele.
Imingcele Yezobuchwepheshe Yomshini Wokusaha Idayimane Onezintambo Eziningi
| Into | Ukucaciswa | Into | Ukucaciswa |
|---|---|---|---|
| Ubukhulu bosayizi womsebenzi (Isikwele) | 220 × 200 × 350 mm | Shayela injini | 17.8 kW × 2 |
| Ubukhulu bosayizi womsebenzi (Umjikelezo) | Φ205 × 350 mm | I-wire drive motor | 11.86 kW × 2 |
| Ukuhlukaniswa kwe-spindle | Φ250 ±10 × 370 × 2 i-eksisi (mm) | I-motor ye-Worktable lift | 2.42 kW × 1 |
| I-eksisi eyinhloko | 650 mm | I-Swing motor | 0.8 kW × 1 |
| Isivinini sokugijima kwentambo | 1500 m/min | Injini yokuhlela | 0.45 kW × 2 |
| Ububanzi bentambo | Φ0.12–0.25 mm | I-tension motor | 4.15 kW × 2 |
| Phakamisa isivinini | 225 mm/min | I-slurry motor | 7.5 kW × 1 |
| Ubukhulu. ukuzungeza kwetafula | ±12° | Umthamo wethangi le-slurry | 300 L |
| Swing angle | ±3° | Ukugeleza okupholile | 200 L/min |
| Imvamisa ye-Swing | ~Izikhathi ezingama-30/min | Temp. ukunemba | ±2 °C |
| Izinga lokuphakelayo | 0.01–9.99 mm/min | Ukunikezwa kwamandla kagesi | 335+210 (mm²) |
| Isilinganiso sokuphakelwa kwentambo | 0.01–300 mm/min | Umoya ocindezelwe | 0.4–0.6 MPa |
| Usayizi womshini | 3550 × 2200 × 3000 mm | Isisindo | 13,500 kg |
I-Working Mechanism yomshini wokusaha wedayimane onezintambo eziningi
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I-Multi-Wire Cutting Motion
Izintambo eziningi zedayimane zihamba ngesivinini esivumelanisiwe ezifika ku-1500 m/min. Ama-pulley aqondiswa ngokunemba kanye nokulawula ukungezwani kweluphu evaliwe (15–130 N) kugcina izintambo zizinzile, zinciphisa ithuba lokuchezuka noma ukuphuka. -
Ukondla Okunembile Nokuma Kwendawo
Ukuma okuqhutshwa yi-Servo kufeza ukunemba okungu-±0.005 mm. I-laser yokuzikhethela noma ukuqondanisa okusizwa ukubona kuthuthukisa imiphumela yomumo oyinkimbinkimbi. -
Ukupholisa kanye Nokususwa Kwemfucumfucu
Ukupholisa okunomfutho ophezulu ngokuqhubekayo kususa ama-chips futhi kupholise indawo yokusebenza, kuvimbele ukulimala okushisayo. Ukuhlunga kwezigaba eziningi kwandisa impilo yokupholisa futhi kunciphisa isikhathi sokuphumula. -
I-Smart Control Platform
Izishayeli ze-servo eziphendula kakhulu (<1 ms) zilungisa ngokuguqukayo okuphakelayo, ukungezwani, nesivinini sezintambo. Ukuphathwa kweresiphi okudidiyelwe kanye nokushintsha ipharamitha yokuchofoza kanye kuqondisa ukukhiqizwa kwenqwaba.
Izinzuzo Eziyinhloko Zomshini Wokusaha Idayimane Onezintambo Eziningi
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Ukukhiqiza Okuphezulu
Iyakwazi ukusika ama-wafers angu-50-200 ngokugijima ngakunye, ngokulahleka kwe-kerf <100 μm, ukuthuthukisa ukusetshenziswa kwezinto ezibonakalayo kuze kufike ku-40%. I-throughput ingu-5–10× yezinhlelo zendabuko zocingo olulodwa. -
Ukulawula Ukunemba
Ukuzinza kwe-wire tension phakathi kuka-±0.5 N kuqinisekisa imiphumela engaguquki ezintweni ezihlukahlukene eziphukayo. Ukuqapha kwesikhathi sangempela kusixhumi esibonakalayo esingu-10" HMI kusekela ukugcinwa kweresiphi nokusebenza okukude. -
I-Flexible, i-Modular Build
Ihambisana namadiamitha ocingo ukusuka ku-0.12–0.45 mm ngezinqubo ezihlukene zokusika. Ukubamba kwerobhothi ongakukhetha kuvumela imigqa yokukhiqiza ezenzakalelayo ngokugcwele. -
Ukwethenjwa kwe-Industrial-Grade
Amafreyimu asebenza kanzima/afojiwe anciphisa ukuwohloka (<0.01 mm). Ama-pulleys aqondisayo ane-ceramic noma i-carbide coatings ahlinzeka amahora angaphezu kuka-8000 wokuphila kwesevisi.
Izinkambu Zokusebenza Zomshini Wokusaha Idayimane Onezintambo Eziningi
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Ama-semiconductors: Ukusika i-SiC yamamojula wamandla we-EV, ama-GaN substrates amadivayisi e-5G.
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Ama-Photovoltaics: Ukusikwa kwe-silicon wafer enesivinini esikhulu ngokufana okungu-±10 μm.
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I-LED & Optics: Ama-substrates e-Sapphire e-epitaxy kanye nezici ze-optical ezinembayo ezine-<20 μm edge chipping.
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I-Ceramics Ethuthukisiwe: Ukucutshungulwa kwe-alumina, i-AlN, nezinto ezifanayo ze-aerospace nezingxenye zokuphatha ezishisayo.
I-FAQ – Umshini Wokusaha Idayimane Onezintambo Eziningi
Q1: Yiziphi izinzuzo zokusaha izintambo eziningi uma kuqhathaniswa nemishini yocingo olulodwa?
A: Amasistimu ezintambo eziningi angahlukanisa inqwaba kuya kumakhulu amawafa ngesikhathi esisodwa, akhulise ukusebenza kahle ngo-5–10×. Ukusetshenziswa kwempahla nakho kuphezulu ngokulahleka kwe-kerf ngaphansi kwe-100 μm, okuyenza ilungele ukukhiqizwa ngobuningi.
Q2: Yiziphi izinhlobo zezinto ezingase zicutshungulwe?
A: Umshini uklanyelwe izinto eziqinile neziphukayo, okuhlanganisa i-silicon carbide (SiC), isafire, i-gallium nitride (GaN), i-quartz, i-alumina (Al₂O₃), ne-aluminium nitride (AlN).
Q3: Kuyini ukunemba okufinyelelekayo kanye nekhwalithi ephezulu?
A: Ubulukhuni bobuso bungafinyelela ku-Ra <0.5 μm, ngokunemba kobukhulu obungu-±0.02 mm. Ukuchopha komphetho kungalawulwa kube <20 μm, ukuhlangabezana nezindinganiso ze-semiconductor kanye ne-optoelectronic industry.
Q4: Ingabe inqubo yokusika idala imifantu noma umonakalo?
IMPENDULO: Ngokulawulwa kokucindezela okuphezulu kwe-high-pressure kanye ne-close-loop, ubungozi bokuqhekeka okuncane kanye nokulimala kwengcindezi kuyancishiswa, okuqinisekisa ubuqotho obuhle kakhulu be-wafer.
