Uhlelo Lokusika Lwe-Laser Oluqondiswa Ngamanzi lwe-Microjet Lwezinto Ezithuthukisiwe

Incazelo emfushane:

Ukubuka konke:

Njengoba izimboni ziqhubekela phambili kuma-semiconductor athuthukile kanye nezinto eziningi ezisebenzayo, izixazululo zomshini ezinembile kodwa ezithambile ziba zibalulekile. Lolu hlelo lokucubungula i-laser oluqondiswa ngamanzi lwe-microjet lwenzelwe ngqo imisebenzi enjalo, luhlanganisa ubuchwepheshe be-laser ye-Nd:YAG yesimo esiqinile nomsele wamanzi we-microjet wengcindezi ephezulu, olunikeza amandla ngokunemba okukhulu kanye nokucindezeleka okuncane kokushisa.

Isekela amaza obubanzi obungu-532nm no-1064nm ngokulungiswa kwamandla angu-50W, 100W, noma 200W, lolu hlelo luyisisombululo esiphumelelayo sabakhiqizi abasebenza ngezinto ezifana ne-SiC, i-GaN, idayimane, kanye nezinhlanganisela ze-ceramic. Lufaneleka kakhulu imisebenzi yokukhiqiza emikhakheni ye-elekthronikhi, yezindiza, ye-optoelectronics, kanye neyamandla ahlanzekile.

Sithumelele i-imeyili

Izici

Izinzuzo Eziphezulu

1. Ukugxila Kwamandla Okungenakuqhathaniswa Ngesiqondiso Samanzi
Ngokusebenzisa i-water jet ecindezelwe kahle njengesiqondiso se-laser waveguide, uhlelo luqeda ukuphazamiseka komoya futhi luqinisekisa ukugxila okugcwele kwe-laser. Umphumela uba ububanzi obuncane kakhulu bokusika—obuncane njengo-20μm—obunemiphetho ebukhali nehlanzekile.

2. I-Fireprint Encane Yokushisa
Ukulawulwa kokushisa kwesikhathi sangempela kwesistimu kuqinisekisa ukuthi indawo ethintekile ukushisa ayidluli ku-5μm, okubalulekile ekulondolozeni ukusebenza kwezinto nokugwema imifantu emincane.

3. Ukuhambisana Okubanzi Kwezinto Ezibonakalayo
Ukukhishwa kwamagagasi amabili (532nm/1064nm) kunikeza ukulungiswa okuthuthukisiwe kokumuncwa, okwenza umshini ukwazi ukuzivumelanisa nezimo ezahlukahlukene, kusukela kumakristalu abonakala ngokusobala kuya kuma-ceramics angacacile.

4. Ukulawula Ukunyakaza Okusheshayo Nokunemba Okuphezulu
Ngezinketho zama-motor aqondile nashayela ngqo, uhlelo lusekela izidingo zokusebenzisa amandla aphezulu ngaphandle kokuphazamisa ukunemba. Ukunyakaza kwama-axis amahlanu kuvumela futhi ukwenziwa kwamaphethini ayinkimbinkimbi kanye nokusikwa okuqondiswe ngezindlela eziningi.

5. Umklamo Oguquguqukayo Nongakhula
Abasebenzisi bangakwazi ukulungisa ukucushwa kwesistimu ngokusekelwe ezidingweni zohlelo lokusebenza—kusukela ekusetshenzisweni kweprototype okusekelwe elebhu kuya ekusetshenzisweni kwesilinganiso sokukhiqiza—okwenza kube kufanelekile kuzo zonke izizinda ze-R&D kanye nezezimboni.

Izindawo Zokufaka Isicelo

Ama-Semiconductor esizukulwane sesithathu:
Ilungele ama-wafer e-SiC ne-GaN, uhlelo lusika, luhlikihla, futhi lusika ngobuqotho obumangalisayo bomphetho.

Umshini Wokwenza I-Diamond kanye ne-Oxide Semiconductor:
Isetshenziselwa ukusika nokubhoboza izinto zokuqina okuphezulu njengedayimane yekristalu elilodwa kanye neGa₂O₃, ngaphandle kokushintshashintsha kwe-carbonization noma ukuguquguquka kokushisa.

Izingxenye Ezithuthukisiwe Zezindiza:
Isekela ukwakheka kwesakhiwo sezinto ezihlanganisiwe ze-ceramic eziqinile kakhulu kanye nama-superalloy enjini yejethi kanye nezingxenye zesathelayithi.

Izingxenye ze-Photovoltaic neze-Ceramic:
Ivumela ukusika ama-wafer amancane kanye ne-LTCC substrates ngaphandle kwe-burr, okuhlanganisa imigodi edlulayo kanye nokugaya izikhala ukuze kuxhunyaniswe.

Izakhi ze-Scintillators kanye ne-Optical:
Igcina ukushelela kobuso kanye nokudluliselwa kwezinto ezibonakalayo ezibuthakathaka njenge-Ce:YAG, LSO, nezinye.

Imininingwane

Isici	Imininingwane
Umthombo We-Laser	I-DPSS Nd:YAG
Izinketho Zobude Begagasi	532nm / 1064nm
Amazinga Amandla	Ama-Watt angu-50/100/200
Ukunemba	±5μm
Ububanzi Bokusika	Kuncane njengo-20μm
Indawo Ethintekile Ekushiseni	≤5μm
Uhlobo Lokunyakaza	Idrayivu Eqondile / Eqondile
Izinto Ezisekelwayo	I-SiC, i-GaN, i-Diamond, i-Ga₂O₃, njll.

Kungani Kufanele Ukhethe Lolu Hlelo?

● Iqeda izinkinga ezivamile zomshini we-laser njengokuqhekeka kokushisa kanye nokuqhekeka komphetho
● Kuthuthukisa isivuno kanye nokungaguquguquki kwezinto ezibiza kakhulu
● Ingaguquguquka kokubili ekusetshenzisweni kwesilinganiso sokuhlola kanye nesezimboni
● Ipulatifomu evikela ikusasa lesayensi yezinto ezishintshayo

Imibuzo Nezimpendulo

Q1: Yiziphi izinto ezingacutshungulwa yilolu hlelo?
A: Uhlelo luklanyelwe ngokukhethekile izinto eziqinile nezithambile zenani eliphezulu. Lungacubungula ngempumelelo i-silicon carbide (SiC), i-gallium nitride (GaN), idayimane, i-gallium oxide (Ga₂O₃), ama-substrate e-LTCC, ama-aerospace composites, ama-wafer e-photovoltaic, namakristalu e-scintillator njenge-Ce:YAG noma i-LSO.

Umbuzo 2: Ubuchwepheshe be-laser obuqondiswa ngamanzi busebenza kanjani?
A: Isebenzisa i-microjet yamanzi enomfutho ophezulu ukuqondisa umsebe we-laser ngokukhanya kwangaphakathi okuphelele, ihambisa ngempumelelo amandla e-laser ngokusabalala okuncane. Lokhu kuqinisekisa ukugxila okuhle kakhulu, umthwalo ophansi wokushisa, kanye nokusikwa okunembile ngobubanzi bemigqa obufinyelela ku-20μm.

Q3: Yiziphi izilungiselelo zamandla e-laser ezitholakalayo?
A: Amakhasimende angakhetha kusuka kuzinketho zamandla e-laser angu-50W, 100W, kanye no-200W kuye ngesivinini sabo sokucubungula kanye nezidingo zokuxazulula. Zonke izinketho zigcina ukuzinza okuphezulu kokukhanya kanye nokuphindaphindwa.