Ukucubungula izinto ze-SiC ngemishini ye-Microjet laser

Ukusika kwe-wafer yemishini ye-laser ye-Microjet Ukucubungula izinto ze-SiC Isithombe Esivelele

Incazelo emfushane:

Imishini yobuchwepheshe be-laser ye-Microjet uhlobo lohlelo lokugaya ngokunemba oluhlanganisa i-laser enamandla aphezulu kanye ne-micron-level liquid jet. Ngokuhlanganisa ugongolo lwe-laser ne-liquid jet enesivinini esikhulu (amanzi ahlanjululwe noma uketshezi olukhethekile), ukucutshungulwa kwezinto ngokunemba okuphezulu kanye nomonakalo ophansi wokushisa kungabonakala. Lobu buchwepheshe bufanelekela kakhulu ukusika, ukubhoboza kanye nokucutshungulwa kwesakhiwo esincane sezinto eziqinile neziphukayo (njenge-SiC, i-sapphire, ingilazi), futhi busetshenziswa kabanzi kuma-semiconductor, isibonisi se-photoelectric, amadivayisi ezokwelapha kanye neminye imikhakha.

Sithumelele i-imeyili

Izici

Isimiso sokusebenza:

1. Ukuhlanganiswa kwe-laser: i-laser evuvukile (i-UV/eluhlaza/e-infrared) igxile ngaphakathi kwejethi yoketshezi ukuze yakhe isiteshi sokudlulisa amandla esizinzile.

2. Isiqondiso soketshezi: indiza yesivinini esikhulu (izinga lokugeleza elingu-50-200m/s) epholisa indawo yokucubungula futhi isuse udoti ukuze kugwenywe ukunqwabelana kokushisa nokungcola.

3. Ukususwa kwezinto: Amandla e-laser abangela umphumela we-cavitation oketshezini ukuze kufezwe ukucutshungulwa okubandayo kwezinto (indawo ethintekile ekushiseni <1μm).

4. Ukulawula okunamandla: ukulungiswa kwesikhathi sangempela kwamapharamitha e-laser (amandla, imvamisa) kanye nokucindezela kwejethi ukuze kuhlangatshezwane nezidingo zezinto ezahlukene kanye nezakhiwo.

Amapharamitha ayisihluthulelo:

1. Amandla e-laser: 10-500W (angalungiseka)

2. Ububanzi bejethi: 50-300μm

3. Ukunemba komshini: ± 0.5μm (ukusika), isilinganiso sokujula nobubanzi 10:1 (ukubhoboza)

Izinzuzo zobuchwepheshe:

(1) Cishe akukho monakalo wokushisa
- Ukupholisa i-jet yoketshezi kulawula indawo ethintekile ekushiseni (i-HAZ) ibe yi-**<1μm**, kugwema ukuqhekeka okuncane okubangelwa ukucutshungulwa kwe-laser okuvamile (i-HAZ ngokuvamile ingaphezu kwe-10μm).

(2) Umshini wokulungisa ngokunemba okuphezulu kakhulu
- Ukunemba kokusika/ukubhoboza kufika ku-**±0.5μm**, ubulukhuni bomphetho Ra<0.2μm, kunciphisa isidingo sokupholisha okulandelayo.

- Sekela ukucutshungulwa kwesakhiwo se-3D okuyinkimbinkimbi (njengezimbobo ezigobile, izikhala ezimise okwesimo).

(3) Ukuhambisana kwezinto ezibanzi
- Izinto eziqinile neziphuka kalula: i-SiC, i-sapphire, ingilazi, izinto zobumba (izindlela zendabuko kulula ukuziphula).

- Izinto ezizwela ukushisa: ama-polymer, izicubu zezinto eziphilayo (akukho bungozi bokuwohloka kokushisa).

(4) Ukuvikelwa kwemvelo kanye nokusebenza kahle kwayo
- Akukho ukungcola kothuli, uketshezi lungaphinde lusetshenziswe futhi luhlungwe.

- Ukwenyuka kwesivinini sokucubungula ngo-30%-50% (uma kuqhathaniswa nomshini wokugaya).

(5) Ukulawula okuhlakaniphile
- Ukubekwa okuhlanganisiwe kokubona kanye nokwenza ngcono amapharamitha e-AI, ukujiya kwezinto eziguquguqukayo kanye namaphutha.

Imininingwane yobuchwepheshe:

Ivolumu yekhawuntara	300300150	400400200
I-axis eqondile i-XY	Injini eqondile. Injini eqondile	Injini eqondile. Injini eqondile
I-axis eqondile Z	150	200
Ukunemba kokubeka i-μm	+/-5	+/-5
Ukunemba kokubekwa okuphindaphindiwe kwe-μm	+/-2	+/-2
Ukusheshisa G	1	0.29
Ukulawula izinombolo	I-axis engu-3 / i-axis engu-3+1 / i-axis engu-3+2	I-axis engu-3 / i-axis engu-3+1 / i-axis engu-3+2
Uhlobo lokulawula izinombolo	I-DPSS Nd:YAG	I-DPSS Nd:YAG
Ubude begagasi nm	532/1064	532/1064
Amandla alinganisiwe W	50/100/200	50/100/200
Indiza yamanzi	40-100	40-100
Ibha yokucindezela kwe-nozzle	50-100	50-600
Ubukhulu (ithuluzi lomshini) (ububanzi * ubude * ukuphakama) mm	144519442260	170015002120
Usayizi (ikhabhinethi yokulawula) (W * L * H)	70025001600	70025001600
Isisindo (imishini) T	2.5	3
Isisindo (ikhabhinethi yokulawula) KG	800	800
Ikhono lokucubungula	Ubulukhuni bomphezulu i-Ra≤1.6um Isivinini sokuvula ≥1.25mm/s Ukusika okuzungezayo ≥6mm/s Isivinini sokusika esiqondile ≥50mm/s	Ubulukhuni bomphezulu i-Ra≤1.2um Isivinini sokuvula ≥1.25mm/s Ukusika okuzungezayo ≥6mm/s Isivinini sokusika esiqondile ≥50mm/s
	Kwekristalu ye-gallium nitride, izinto ze-semiconductor ze-band gap ezibanzi kakhulu (idayimane/i-Gallium oxide), izinto ezikhethekile ze-aerospace, i-LTCC carbon ceramic substrate, i-photovoltaic, ikristalu ye-scintillator kanye nezinye izinto zokucubungula. Qaphela: Umthamo wokucubungula uyahlukahluka kuye ngezici zezinto ezibonakalayo

Icala lokucubungula:

Izinsizakalo ze-XKH:

I-XKH inikeza uhla oluphelele lwezinsizakalo zokusekela impilo yonke yemishini yobuchwepheshe be-laser ye-microjet, kusukela ekuthuthukisweni kwenqubo yokuqala kanye nokubonisana ngokukhetha imishini, kuya ekuhlanganisweni kwesistimu eyenziwe ngokwezifiso yesikhathi esiphakathi (kufaka phakathi ukufaniswa okukhethekile komthombo we-laser, uhlelo lwe-jet kanye ne-automation module), kuya ekuqeqeshweni kokusebenza nokugcinwa kwakamuva kanye nokwenza ngcono inqubo okuqhubekayo, yonke inqubo ifakwe ukwesekwa kwethimba lobuchwepheshe lochwepheshe; Ngokusekelwe eminyakeni engama-20 yesipiliyoni sokulungisa ngokunemba, singanikeza izixazululo zokuma okukodwa okuhlanganisa ukuqinisekiswa kwemishini, ukwethulwa kokukhiqizwa ngobuningi kanye nokuphendula okusheshayo ngemuva kokuthengisa (amahora angama-24 okusekelwa kobuchwepheshe + ukubhukha izingxenye ezibalulekile) zezimboni ezahlukene ezifana ne-semiconductor kanye nezokwelapha, futhi sithembisa iwaranti yezinyanga eziyi-12 kanye nensizakalo yokugcinwa nokuthuthukiswa impilo yonke. Qinisekisa ukuthi imishini yamakhasimende ihlala igcina ukusebenza kokucubungula okuhamba phambili embonini kanye nokuzinza.