I-Infrared Picosecond Dual-Platform Laser Cutting imishini yokusika i-Optical Glass/Quartz/Sapphire Processing

I-Infrared Picosecond Dual-Platform Laser Cutting imishini ye-Optical Glass/Quartz/Sapphire Processing Isithombe Esifakiwe

Incazelo emfushane:

Isifinyezo Sobuchwepheshe:
I-Infrared Picosecond Dual-Station Dual-Station Laser Cutting System iyisixazululo sezinga lezimboni esiklanyelwe ukwenziwa ngokunemba komshini wezinto ezingabonakali kalula. Ifakwe umthombo we-laser ye-infrared picosecond engu-1064nm (ububanzi be-pulse <15ps) kanye nomklamo weplathifomu yeziteshi ezimbili, le sistimu iletha ukusebenza kahle kokucubungula okuphindwe kabili, ivumela ukwenziwa kwemishini engenasici yezingilazi ezibonakalayo (isb., i-BK7, i-silica ehlanganisiwe), amakristalu equartz, nokuqina kwesafire (α-up kuya ku-Al₃s)
Uma kuqhathaniswa namalaser avamile we-nanosecond noma izindlela zokusika ngomshini, i-Infrared Picosecond Dual-Station Laser Cutting System ifinyelela ububanzi be-kerf bezinga elincane (ububanzi obujwayelekile: 20–50μm) ngendlela “yokukhipha okubandayo”, ngendawo ethinteke ukushisa ekhawulelwe ku-<5μm. Imodi yokusebenza yeziteshi ezimbili ezishintshayo inyusa ukusetshenziswa kwemishini ngo-70%, kuyilapho uhlelo lokuqondanisa umbono lobunikazi (ukunemba kokuma kwe-CCD: ±2μm) luyenza ilungele ukukhiqizwa ngobuningi bezingxenye zengilazi ezigobile ze-3D (isb., ingilazi yekhava ye-smartphone, amalensi e-smartwatch) embonini yezogesi zabathengi. Uhlelo luhlanganisa amamojula okulayisha/ukukhipha okuzenzakalelayo, asekela ukukhiqizwa okuqhubekayo okungu-24/7.

Thumela i-imeyili kithi

Imininingwane Yomkhiqizo

Omaka bomkhiqizo

Ipharamitha eyinhloko

Uhlobo lweLaser	I-Infrared Picosecond
Usayizi Wenkundla	700×1200 (mm)
	900×1400 (mm)
Ukusika Ukujiya	0.03-80 (mm)
Isivinini sokusika	0-1000 (mm/s)
Cutting Edge Breakage	<0.01 (mm)
Qaphela: Usayizi wenkundla ungenziwa ngokwezifiso.

Izici Eziyinhloko

1.I-Ultrafast Laser Technology:
· Ama-pulses amafushane eleveli ye-Picosecond (10⁻¹²s) ahlanganiswe nobuchwepheshe bokushuna be-MOPA afinyelela ukuminyana kwamandla aphezulu >10¹² W/cm².
· Ubude beza be-infrared (1064nm) bungena ezintweni ezibonisa ngale ngokumuncwa okungeyona umugqa, kuvimbele ukuphuphuma kwendawo.
· Isistimu ye-optical ye-Proprietary multi-focus ikhiqiza izindawo ezine ezizimele zokucubungula ngesikhathi esisodwa.

2.Isistimu Yokuvumelanisa Yeziteshi Ezimbili:
· Granite-base dual linear motor izigaba (ukunemba kokuma: ±1μm).
· Isikhathi sokushintsha isiteshi <0.8s, esivumela imisebenzi ehambisanayo "yokucubungula-ukulayisha/ukukhipha".
· Ukulawula izinga lokushisa okuzimele (23±0.5°C) esiteshini ngasinye kuqinisekisa ukuzinza kwemishini yesikhathi eside.

3.I-Intelligent Process Control:
· Isizindalwazi esihlanganisiwe sezinto ezibonakalayo (amapharamitha angama-200+) wokufanisa ipharamitha okuzenzakalelayo.
· Ukuqapha kwe-plasma kwesikhathi sangempela kulungisa amandla e-laser (ukulungiswa kokulungiswa: 0.1mJ).
· Ukuvikela amakhethini omoya kunciphisa imifantu emincane (<3μm).
Esimeni sohlelo lokusebenza esivamile esihlanganisa ukudayela kwe-sapphire wafer obukhulu obungu-0.5mm, isistimu ifinyelela isivinini sokusika esingu-300mm/s ngokusika ubukhulu obungu-<10μm, okubonisa ukuthuthukiswa kokusebenza kahle okungu-5x kunezindlela ezivamile.

Ukucubungula Izinzuzo

1.Isistimu ehlanganisiwe yokusika nokuhlukanisa iziteshi ezimbili ukuze kusebenze okuguquguqukayo;
2.Isivinini esikhulu somshini wejometri eyinkimbinkimbi kuthuthukisa ukuguqulwa kwenqubo ukusebenza kahle;
3.Amaphethelo wokusika angenawo ama-taper ane-chipping encane (<50μm) kanye nokubamba okuphephile ko-opharetha;
4.Ushintsho olungenamthungo phakathi kokucaciswa komkhiqizo ngokusebenza okunembile;
5.Izindleko zokusebenza eziphansi, amanani entengo aphezulu, inqubo engathengeki futhi engangcolisi;
6.Ukukhiqizwa okungazero kwe-slag, uketshezi olulahlwayo noma amanzi angcolile anobuqotho obungaphezulu obuqinisekisiwe;

Isibonisi sesampula

Imishini yokusika ingilazi ye-infrared ye-dual-platform laser 5

Izicelo Ezijwayelekile

1.Ukwenziwa Kwezinto Zogesi Zabathengi:
· Ukusikwa kwekhonta okunembayo kwengilazi yekhava ye-3D ye-smartphone (ukunemba kwe-engeli engu-R: ±0.01mm).
· Ukubhoboza izimbobo ezincane kumalensi wewashi lesafire (ubuncane bembobo: Ø0.3mm).
· Ukuqedwa kwezindawo ezidlulisa ingilazi ezibonakalayo zamakhamera angabonisi kahle.

2.Optical Component Production:
· Ukwenza imishini ye-Microstructure ye-AR/VR lens yamalungu afanayo (usayizi wesici ≥20μm).
· Ukusika okune-angle kwama-quartz prism ama-laser collimators (ukubekezelelana kwe-angular: ±15").
· Ukwakheka kwephrofayili yezihlungi ze-infrared (i-taper yokusika <0.5°).

3.Ukupakishwa kweSemiconductor:
· I-Glass through-via (TGV) icutshungulwa ezingeni le-wafer (i-aspect ratio 1:10).
· Ukufakwa kwe-Microchannel kuma-substrates engilazi ama-microfluidic chips (Ra <0.1μm).
· Ukusikwa kokucushwa kwemvamisa kwamaresonatha equartz e-MEMS.

Ngokwenziwa kwewindi le-LiDAR optical yezimoto, isistimu inika amandla ukusika i-contour yengilazi yequartz engu-2mm enogqinsi olusikiwe lwe-89.5±0.3°, ehlangabezana nezidingo zokuhlolwa kokudlidliza kwebanga lezimoto.

Lungiselela Izicelo

Iklanyelwe ngokukhethekile ukusikwa okunembayo/okuqinile okuhlanganisa:
1.Ingilazi ejwayelekile & izibuko zamehlo (BK7, silica ehlanganisiwe);
2. Amakristalu e-quartz nama-sapphire substrates;
3. Ingilazi eshisayo nezihlungi zamehlo
4. I-Mirror substrates
Iyakwazi kokubili ukusika i-contour kanye nokunemba kokumba imbobo yangaphakathi (ubuncane be-Ø0.3mm)

Laser Cutting Isimiso

I-laser ikhiqiza ama-ultrashort pulses anamandla aphezulu kakhulu asebenzisana nesiqeshana somsebenzi phakathi kwezilinganiso zezikhathi ze-femtosecond-to-picosecond. Ngesikhathi sokusakazwa ngempahla, i-beam iphazamisa isakhiwo sayo sokucindezeleka ukuze yenze izimbobo ze-micron-scale filamentation. Isikhala sezimbobo esithuthukisiwe sidala imifantu emincane elawulwayo, ehlangana nobuchwepheshe bokuhlukanisa ukuze kutholakale ukuhlukana okunembayo.

Laser Cutting Izinzuzo

I-1.Ukuhlanganiswa okuzenzakalelayo okuphezulu (ukusebenza okuhlanganisiwe kokusika / ukusika) nokusetshenziswa kwamandla okuphansi nokusebenza okulula;
2.Ukucubungula okungekona othintana naye kwenza amakhono ayingqayizivele angafinyeleleki ngezindlela ezijwayelekile;
3.Ukusebenza kwamahhala okuthengayo kunciphisa izindleko zokusebenza futhi kuthuthukisa ukusimama kwemvelo;
4.Ukunemba okuphezulu nge-engeli ye-taper eyiziro kanye nokuqedwa komonakalo wengxenye yokusebenza yesibili;
I-XKH ihlinzeka ngezinsizakalo eziphelele zokwenza ngokwezifiso zezinhlelo zethu zokusika i-laser, okuhlanganisa ukucushwa kweplathifomu eyenzelwe wena, ukuthuthukiswa kwepharamitha yenqubo ekhethekile, nezixazululo eziqondene nohlelo lokusebenza ukuze kuhlangatshezwane nezidingo ezihlukile zokukhiqiza kuzo zonke izimboni ezihlukahlukene.