I-Infrared Nanosecond Laser Drilling imishini yokuqina kwe-Glass Drilling≤20mm

I-Infrared Nanosecond Laser Drilling okokusebenza kokuqina kwe-Glass Drilling≤20mm Isithombe Esifakiwe

Incazelo emfushane:

Isifinyezo Sobuchwepheshe:
I-Infrared Nanosecond Laser Glass Drilling System iyisisombululo sezinga lezimboni esenzelwe ukumba ngokunemba kwezinto zengilazi. Isebenzisa umthombo we-laser ye-infrared nanosecond engu-1064nm (ububanzi be-pulse: 10-300ns), lolu hlelo luzuza ukubhola okunemba okuphezulu kuma-substrates engilazi ahlukahlukene anogqinsi ≤20mm ngokulawula amandla okunembayo kanye nobuchwepheshe bokubumba ugongolo.
Kuzinhlelo zokusebenza ezisebenzayo zomugqa wokukhiqiza, I-Infrared Nanosecond Laser Glass Drilling System ibonisa izinzuzo zenqubo ehlukile. Uma kuqhathaniswa nokubhola okujwayelekile komshini noma ukucutshungulwa kwe-laser ye-CO₂, indlela yokulawula umthelela oshisayo wesistimu ivumela ukumba okunembayo okunobubanzi bembobo ukusuka ku-Φ0.1-5mm engilazini evamile ye-soda-lime, kuyilapho kugcinwa imbobo ye-taper ngaphakathi ±0.5°. Ikakhulukazi ekucutshungulweni kwelensi yekhava yesafire yekhamera ye-smartphone, isistimu ingahlala ikhiqiza ama-micro-hole array angu-Φ0.3mm ngokunemba kokuma okungu-±10μm, ehlangabezana nezidingo eziqinile ze-miniaturization ku-elekthronikhi yabathengi. Uhlelo luza olujwayelekile nokulayisha/ukulayishwa okuzenzakalelayo kokuxhumana ukuze kuhlanganiswe okungenazihibe nemigqa yokukhiqiza ekhona.

Thumela i-imeyili kithi

Imininingwane Yomkhiqizo

Omaka bomkhiqizo

Ipharamitha eyinhloko

Uhlobo lwe-laser	I-infrared nanosecond
Usayizi wenkundla	*800600(mm)**
	*20001200(mm)**
Ukujiya kokuqina	≤20(mm)
Isivinini sokubhoboza	0-5000(mm/s)
Ukuqhekeka konqenqema lokugaya	<0.5(mm)
Qaphela: Usayizi wenkundla ungenziwa ngokwezifiso.

Laser Drilling Isimiso

I-laser beam igxile endaweni efanele uma kuqhathaniswa nogqinsi locezu lokusebenza, bese iskena ezindleleni ezichazwe ngaphambilini ngesivinini esikhulu. Ngokusebenzisana ne-laser enamandla amakhulu, okokusebenza okuqondiwe kukhishwa ungqimba nongqimba ukuze kwakheke amashaneli okusika, kuzuzwe ukubhobozwa okunembile (amajiyometri ayindilinga, ayisikwele, noma ayinkimbinkimbi) ngokuhlukaniswa kwezinto ezilawulwayo.

I-Laser Drilling Izinzuzo

· Ukuhlanganiswa okuzenzakalelayo okuphezulu nokusetshenziswa kwamandla okuncane nokusebenza okulula;

· Ukucutshungulwa okungekona othintana naye kuvumela iphethini yejometri engakhawulelwe ngaphezu kwezindlela ezijwayelekile;

· Ukusebenza kwamahhala okuthengayo kunciphisa izindleko zokusebenza futhi kuthuthukise ukusimama kwemvelo;

· Ukunemba okuphezulu ngokuchotshozwa okuncane konqenqema kanye nokuqedwa komonakalo wengxenye yesibili yokusebenza;

Imishini yokumba ingilazi ye-infrared nanosecond laser 2

Isibonisi sesampula

Lungiselela Izicelo

Isistimu yakhelwe ukucutshungulwa okunembayo kwezinto ezi-brittle/eziqinile ezihlanganisa ukubhoboza, ukugoba, ukususwa kwefilimu, nokuthumela umbhalo ngaphezulu. Izinhlelo zokusebenza ezijwayelekile zifaka:

1. Ukubhoboza kanye nokubhala izingxenye zeminyango yeshawa

2. Ukubhobozwa ngokunemba kwamaphaneli engilazi kagesi

3. Iphaneli yelanga ngokubhoboza

4. Ukubhobozwa kwepuleti lekhava yesokhethi/sokhethi

5. Ukukhishwa kwe-Mirror enamathela ngokubhoboza

6. Umbhalo owenziwe ngokwezifiso wangaphezulu kanye nokugxusha emikhiqizweni ekhethekile

Ukucubungula Izinzuzo

1. Inkundla yefomethi enkulu ithatha ubukhulu bemikhiqizo ehlukahlukene kuzo zonke izimboni

2. I-complex contour drilling efinyelelwe ekusebenzeni kwe-single-pass

3. Ukucupha unqenqema oluncane ngokuqedwa kwengaphezulu (Ra <0.8μm)

4. Ushintsho olungenamthungo phakathi kokucaciswa komkhiqizo ngokusebenza okunembile

5. Ukusebenza ngendlela eyongayo okufaka:

· Amazinga esivuno esiphezulu (>99.2%)

· Ukucubungula okungasebenzisekiyo

· Ukukhishwa okungcolile kwe-Zero

I-6.Ukucubungula okungathintana naye kuqinisekisa ukulondolozwa kobuqotho obungaphezulu

Izici Eziyinhloko

1. I-Precision Thermal Management Technology:

· Isebenzisa inqubo yokumba ephindaphinda ama-pulse enamandla ashintshwayo we-single-pulse energy (0.1–50 mJ)

· Uhlelo olusha lokuvikela ikhethini lomoya lwangemuva luhlanganisa indawo ethinteke ukushisa ibe phakathi kuka-10% wobubanzi bembobo

· Imoduli yokuqapha izinga lokushisa le-infrared yesikhathi sangempela inxephezela ngokuzenzakalelayo amapharamitha wamandla (±2% ukuzinza)

2. I-Intelligent Processing Platform:

· Ifakwe isigaba senjini esinembayo esiphezulu (phinda ukunemba kokuma: ±2 μm)

· Isistimu yokuqondanisa umbono ehlanganisiwe (5-megapixel CCD, ukunemba kokuqaphela: ±5 μm)

· Isizindalwazi senqubo esilayishwe ngaphambili esinamapharamitha alungiselelwe wezinhlobo ezingama-50+ zezinto zengilazi

3. Idizayini Yokukhiqiza Esebenza Kakhulu:

· Imodi yokusebenza eshintshashintshayo yeziteshi ezimbili enesikhathi sokushintsha kwezinto ≤3 amasekhondi

· Umjikelezo wokucubungula ojwayelekile wembobo engu-1/0.5 isekhondi (Φ0.5 mm ngokusebenzisa imbobo)

· Idizayini ye-modular inika amandla ukushintshana okusheshayo kokuhlanganisa amalensi okugxilisa ingqondo (ububanzi bokucubungula: Φ0.1–10 mm)

Izicelo Zokucubungula Okuqinile Kwe-Brittle

Uhlobo Lwezinto	Isicelo Scenario	Icubungula Okuqukethwe
Ingilazi ye-soda-lime	Iminyango yeshawa	Ukukhweza izimbobo namashaneli okudonsa amanzi
Ingilazi ye-soda-lime	Amaphaneli okulawula izinto zikagesi	Izimbobo zokudonsa amanzi
Ingilazi Epholile	Amawindi wokubuka i-oven	Izimbobo zokungenisa umoya
Ingilazi Epholile	Iziqalo zokupheka zokungeniswa	Iziteshi zokupholisa ezinama-engeli
Ingilazi ye-Borosilicate	Amaphaneli elanga	Izimbobo ezifakwayo
Ingilazi ye-Borosilicate	I-glassware yelabhorethri	Iziteshi zokukhipha amanzi ngokwezifiso
Ingilazi-ceramic	Indawo yokupheka	Izimbobo zokubeka i-Burner
Ingilazi-ceramic	Ama-induction cookers	Amalungu afanayo embobo yenzwa yokukhweza
Isafire	Amakhava edivayisi ehlakaniphile	Izimbobo zokungenisa umoya
Isafire	Izikhumulo zokubuka zezimboni	Izimbobo eziqinisiwe
Ingilazi Ehlanganisiwe	Izibuko zasendlini yokugezela	Izimbobo ezifakwayo (ukususwa kwe-coating + ukubhoboza)
Ingilazi Ehlanganisiwe	Izindonga zamakhethini	Ingilazi ye-Low-E efihle izimbobo zokudonsa amanzi
Ingilazi yeCeramicized	Shintsha/amakhava esokhethi	Izikhala zokuphepha + izimbobo zezintambo
Ingilazi yeCeramicized	Imigoqo yomlilo	Izimbobo zokukhulula ingcindezi yesimo esiphuthumayo

I-XKH ihlinzeka ngosekelo oluphelele lobuchwepheshe kanye nezinsizakalo ezingeziwe ze-value yemishini yokumba ingilazi ye-infrared nanosecond ukuze kuqinisekiswe ukusebenza okuphelele kuwo wonke umjikelezo wempilo wemishini. Sihlinzeka ngezinsizakalo zokuthuthukisa inqubo engokwezifiso lapho ithimba lethu lonjiniyela lisebenzisana eduze namakhasimende ukuze lisungule imitapo yolwazi yepharamitha ethize, okuhlanganisa nezinhlelo ezikhethekile zokumba izinto eziyinselele ezifana nesafire nengilazi epholile enokwehluka kogqinsi ukusuka ku-0.1mm kuye ku-20mm. Ukuze kuthuthukiswe ukukhiqiza, senza ukulinganisa kwemishini ekusayithi kanye nokuhlolwa kokuqinisekisa ukusebenza, siqinisekisa amamethrikhi abalulekile njengokubekezelela kobubanzi bembobo (±5μm) nekhwalithi yomphetho (Ra<0.5μm) ahlangabezana namazinga omkhakha.

Okwedlule: Imishini ye-Microjet laser technology wafer yokusika i-SiC material processing

Olandelayo: I-6 Inch Conductive SiC Composite Substrate 4H Ububanzi 150mm Ra≤0.2nm Warp≤35μm

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