I-HPSI SiC wafer dia:3inch ukujiya:350um± 25 µm ye-Power Electronics

Incazelo emfushane:

Iwafa ye-HPSI (High-Purity Silicon Carbide) SiC enobubanzi obungamayintshi angu-3 kanye nogqinsi lwama-350 µm ± 25 µm yakhelwe ngokuqondile izinhlelo zokusebenza zama-electronics adinga ama-substrate asebenza kahle kakhulu. Lesi sicwecwana se-SiC sinikeza ukuguquguquka okushisayo okuphakeme, ugesi wokuwohloka okuphezulu, nokusebenza kahle emazingeni okushisa aphezulu okusebenza, okuyenza ibe ukukhetha okuhle kwesidingo esikhulayo samadivayisi kagesi awonga amandla futhi aqinile. Ama-wafers e-SiC afaneleka kakhulu ukusetshenziswa kwamandla kagesi aphezulu, amanje, kanye namaza aphakeme, lapho ama-silicon substrates endabuko ehluleka ukuhlangabezana nezidingo zokusebenza.
Iwafa yethu ye-HPSI SiC, eyakhiwe kusetshenziswa amasu akamuva ahamba phambili embonini, itholakala ngamamaki ambalwa, ngalinye liklanyelwe ukuhlangabezana nezidingo ezithile zokukhiqiza. I-wafer ibonisa ubuqotho besakhiwo obuvelele, izakhiwo zikagesi, nekhwalithi yangaphezulu, iqinisekisa ukuthi ingaletha ukusebenza okuthembekile ezinhlelweni ezifunwayo, okuhlanganisa ama-semiconductors kagesi, izimoto zikagesi (EVs), izinhlelo zamandla avuselelekayo, nokuguqulwa kwamandla ezimboni.


Imininingwane Yomkhiqizo

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Isicelo

Ama-wafer e-HPSI SiC asetshenziswa ezinhlobonhlobo zezinhlelo zokusebenza zamandla kagesi, okuhlanganisa:

Ama-Semiconductors Amandla:Ama-wafers e-SiC avame ukusetshenziswa ekukhiqizeni amandla e-diode, ama-transistors (ama-MOSFET, ama-IGBT), nama-thyristors. Lawa ma-semiconductors asetshenziswa kakhulu ezinhlelweni zokuguqula amandla ezidinga ukusebenza kahle okuphezulu nokuthembeka, njengakumadrayivu ezimoto zezimboni, izinsiza zikagesi, nama-inverter wezinhlelo zamandla avuselelekayo.
Izimoto zikagesi (EVs):Kuma-powertrains emoto kagesi, amadivayisi kagesi asekelwe ku-SiC ahlinzeka ngesivinini sokushintsha ngokushesha, ukusebenza kahle kwamandla okuphezulu, kanye nokulahlekelwa okuncishisiwe kokushisa. Izingxenye ze-SiC zilungele izinhlelo zokusebenza ezinhlelweni zokuphatha ibhethri (i-BMS), ingqalasizinda yokushaja, namashaja angaphakathi ebhodini (ama-OBC), lapho ukunciphisa isisindo nokwandisa ukusebenza kahle kokuguqulwa kwamandla kubalulekile.

Amasistimu Amandla Avuselelekayo:Ama-wafer e-SiC asetshenziswa kakhulu kuma-solar inverters, amajeneretha enjini yomoya, nezinhlelo zokugcina amandla, lapho ukusebenza kahle okuphezulu nokuqina kubalulekile. Izingxenye ezisekelwe ku-SiC zinika amandla ukuminyana kwamandla aphezulu kanye nokusebenza okuthuthukisiwe kulezi zinhlelo zokusebenza, ukuthuthukisa ukusebenza kahle kokuguqulwa kwamandla.

I-Industrial Power Electronics:Ezinhlelweni zokusebenza zezimboni ezisebenza kahle kakhulu, ezinjengokushayela kwezimoto, amarobhothi, kanye nempahla yamandla amakhulu, ukusetshenziswa kwama-wafers e-SiC kuvumela ukusebenza okuthuthukisiwe mayelana nokusebenza kahle, ukwethembeka, nokuphatha okushisayo. Amadivayisi we-SiC angakwazi ukuphatha amaza okushintshashintsha aphezulu kanye namazinga okushisa aphezulu, awenze afanelekele izindawo ezifunayo.

Izikhungo Zezokuxhumana Nedatha:I-SiC isetshenziswa ezintweni zikagesi kumishini yezokuxhumana kanye nezikhungo zedatha, lapho ukuthembeka okuphezulu nokuguqulwa kwamandla okusebenzayo kubalulekile. Amadivayisi kagesi asekelwe ku-SiC anika amandla ukusebenza kahle okuphezulu kumasayizi amancane, okuhumushela ekusetshenzisweni kwamandla okuncishisiwe kanye nokusebenza kahle kokupholisa okungcono kungqalasizinda yezinga elikhulu.

I-voltage ephezulu yokuphuka, ukumelana okuphansi, kanye nokuhamba kahle kokushisayo kwamawafa e-SiC kuwenza abe i-substrate efanelekile yalezi zinhlelo zokusebenza ezithuthukisiwe, okuvumela ukuthuthukiswa kwesizukulwane esilandelayo sama-electronics awonga amandla.

Izakhiwo

Impahla

Inani

I-Wafer Diameter 3 amayintshi (76.2 mm)
Ubukhulu be-Wafer 350 µm ± 25 µm
I-Wafer Orientation <0001> ku-eksisi ± 0.5°
I-Micropipe Density (MPD) ≤ 1 cm⁻²
Ukungazweli Kagesi ≥ 1E7 Ω·cm
I-Dopant Kuhlehlisiwe
Isisekelo se-Flat Orientation {11-20} ± 5.0°
Ubude Befulethi obuyisisekelo 32.5 mm ± 3.0 mm
Ubude Befulethi besibili 18.0 mm ± 2.0 mm
I-Flat Orientation yesibili Ubheke phezulu: 90° CW ukusuka efulethini lokuqala ± 5.0°
Ukukhishwa komkhawulo 3 mm
LTV/TTV/Bow/Warp 3 µm / 10 µm / ±30 µm / 40 µm
Ukuqina Kobuso Ubuso buka-C: bupholishiwe, ubuso be-Si: CMP
Imifantu (ihlolwe ngokukhanya okukhulu) Lutho
I-Hex Plates (ihlolwe ngokukhanya okuphezulu) Lutho
Izindawo ze-Polytype (zihlolwe ngokukhanya okukhulu) Indawo ehlanganisiwe 5%
Ama-scratches (ahlolwe ngokukhanya okukhulu) ≤ 5 imihuzuko, ubude obukhulayo ≤ 150 mm
I-Edge Chipping Akukho okuvunyelwe ≥ 0.5 mm ububanzi nokujula
I-Surface Contamination (ihlolwe ngokukhanya okukhulu) Lutho

Izinzuzo Eziyinhloko

High Thermal Conductivity:Ama-wafer e-SiC aziwa ngekhono lawo eliyingqayizivele lokuqeda ukushisa, okuvumela amadivayisi kagesi ukuthi asebenze ngendlela esezingeni eliphezulu futhi aphathe imisinga ephakeme ngaphandle kokushisisa ngokweqile. Lesi sici sibalulekile kuma-electronics wamandla lapho ukuphathwa kokushisa kuyinselele enkulu.
I-Voltage Yokuhlukaniswa Okuphezulu:I-bandgap ebanzi ye-SiC yenza amadivaysi akwazi ukubekezelela amazinga kagesi aphezulu, okuwenza alungele ukusetshenziswa kwamandla kagesi aphezulu njengamagridi kagesi, izimoto zikagesi, nemishini yezimboni.
Ukusebenza Okuphezulu:Inhlanganisela yamafrikhwensi okushintsha okuphezulu kanye nokumelana okuphansi kuholela emishinini elahlekelwa amandla aphansi, ithuthukisa ukusebenza kahle kukonke kokuguqulwa kwamandla kanye nokunciphisa isidingo samasistimu okupholisa ayinkimbinkimbi.
Ukwethembeka Ezimweni Ezinzima:I-SiC iyakwazi ukusebenza emazingeni okushisa aphezulu (kufika ku-600°C), okuyenza ifanelekele ukusetshenziswa ezindaweni ezingalimaza izinto zendabuko ezisekelwe ku-silicon.
Ukonga Amandla:Amadivayisi kagesi e-SiC athuthukisa ukusebenza kahle kokuguqulwa kwamandla, okubalulekile ekwehliseni ukusetshenziswa kwamandla, ikakhulukazi ezinhlelweni ezinkulu ezifana neziguquli zamandla ezimboni, izimoto zikagesi, nengqalasizinda yamandla avuselelekayo.

Umdwebo onemininingwane

3INCH HPSI SIC WAFER 04
3INCH HPSI SIC WAFER 10
3INCH HPSI SIC WAFER 08
3INCH HPSI SIC WAFER 09

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