Umshini wokubhoboza we-laser oqondile kakhulu we-sapphire ceramic material gem bearing nozzle drilling
Isingeniso Somkhiqizo
Izinto ezisebenzayo: Zifanele insimbi yemvelo, insimbi ye-polycrystalline, i-ruby, i-sapphire, ithusi, i-ceramics, i-rhenium, insimbi engagqwali, insimbi yekhabhoni, insimbi ye-alloy kanye nezinye izinto eziqinile, ezingamelana nokushisa okuphezulu zezimo ezahlukene, ububanzi, ukujula kanye nokubhoboza okuthambile.
Izimo zokusebenza
1. Ifaneleka ukusebenza ngaphansi kwezinga lokushisa elizungezile elingu-18℃-28℃ kanye nomswakama ohlobene ongu-30%-60%.
2. Kufanelekela ugesi wezigaba ezimbili /220V/50HZ/10A.
3. Lungiselela ama-plug ahlangabezana nezidingo zezindinganiso ezifanele zaseShayina. Uma kungekho i-plug enjalo, kufanele kuhlinzekwe i-adaptha efanele.
4. Kusetshenziswa kabanzi kudayimani lokudweba idayimani, idayisi le-wire elihamba kancane, imbobo ye-muffler, imbobo yenaliti, i-gem bearing, i-nozzle kanye neminye imboni yokubhoboza.
Amapharamitha obuchwepheshe
| Igama | Idatha | Umsebenzi |
| Ubude be-wavelength be-optical maser | 354.7nm noma 355nm | Inquma ukusatshalaliswa kwamandla kanye nomthamo wokungena we-laser beam, futhi ithinta izinga lokumuncwa kwezinto kanye nomphumela wokucubungula. |
| Amandla okukhipha aphakathi | 10.0 / 12.0/15.0 w@40khz | Kuthinta ukusebenza kahle kokucubungula kanye nesivinini sokubhoboza, amandla aphezulu, isivinini sokucubungula sishesha kakhulu. |
| Ububanzi be-pulse | Ngaphansi kwama-20ns@40KHz | Ububanzi be-pulse obufushane kunciphisa indawo ethintekile ekushiseni, kuthuthukisa ukunemba komshini, futhi kugwema ukulimala kokushisa kwezinto. |
| Izinga lokuphindaphinda kwe-pulse | 10~200KHz | Nquma imvamisa yokudlulisa kanye nokusebenza kahle kokubhoboza komsebe we-laser, lapho imvamisa iphakama, isivinini sokubhoboza sishesha kakhulu. |
| ikhwalithi yokukhanya kwe-optical | I-M² <1.2 | Imishayo esezingeni eliphezulu iqinisekisa ukunemba kokubhoboza kanye nekhwalithi yomphetho, okunciphisa ukulahleka kwamandla. |
| Ububanzi bendawo | 0.8±0.1mm | Nquma ukunemba okuncane kokuvula kanye nomshini, lapho indawo incane, ukunemba kwayo kuncane, kulapho ukunemba kwayo kuphakeme khona. |
| i-engeli yokuphambuka komsebe | Kungaphezu kuka-90% | Ikhono lokugxila kanye nokujula kokubhoboza kogongolo lwe-laser kuyathinteka. Uma i-engeli yokuhlukana incane, ikhono lokugxila liqina kakhulu. |
| Ukugoba kokukhanya kwe-beam | Ngaphansi kuka-3% we-RMS | Uma i-ellipticity incane, kulapho ukuma kwembobo kusondela khona esiyingini, kulapho ukunemba komshini kuphakama khona. |
Umthamo wokucubungula
Imishini yokubhoboza nge-laser enembile kakhulu inamakhono okucubungula anamandla futhi ingabhoboza imigodi kusukela kuma-micron ambalwa kuya kumamilimitha ambalwa ububanzi, futhi ukuma, usayizi, isikhundla kanye ne-engela yemigodi kungalawulwa ngokunembile. Ngesikhathi esifanayo, imishini isekela ukubhoboza okuzungezile okungu-360-degree, okungahlangabezana nezidingo zokubhoboza zezimo nezakhiwo ezahlukahlukene eziyinkimbinkimbi. Ngaphezu kwalokho, umshini wokubhoboza nge-laser onembile kakhulu nawo unekhwalithi ephezulu yomphetho kanye nokuphela komphezulu, imigodi ecutshunguliwe ayinayo i-burr, ayincibiliki emphethoni, futhi umphezulu wembobo ubushelelezi futhi uyisicaba.
Ukusetshenziswa komshini wokubhoboza nge-laser onembile kakhulu:
1. Imboni ye-elekthronikhi:
Ibhodi lesifunda eliphrintiwe (i-PCB): lisetshenziselwa ukucubungula imigodi emincane ukuze kuhlangatshezwane nezidingo zokuxhumanisa okuphezulu.
Ukupakishwa kwe-semiconductor: Faka imigodi kuma-wafer nezinto zokupakisha ukuze uthuthukise ubuningi bephakheji nokusebenza kwayo.
2. Izindiza:
Izimbobo zokupholisa zensingo yenjini: Izimbobo zokupholisa ezincane zifakwa ngomshini ezinsingo ze-superalloy ukuze kuthuthukiswe ukusebenza kahle kwenjini.
Ukucutshungulwa kwenhlanganisela: Ukubhoboza ngokunemba okuphezulu kwenhlanganisela ye-carbon fiber ukuqinisekisa ukuqina kwesakhiwo.
3. Imishini Yezokwelapha:
Amathuluzi okuhlinza angangeni kakhulu: Ukufaka imigodi emincane emathuluzini okuhlinza ukuze kuthuthukiswe ukunemba nokuphepha.
Uhlelo lokulethwa kwezidakamizwa: Hlaba izimbobo kudivayisi yokulethwa kwezidakamizwa ukuze ulawule izinga lokukhishwa kwezidakamizwa.
4. Ukukhiqizwa Kwezimoto:
Uhlelo lokujova uphethiloli: Ukufaka imigodi emincane embotsheni yokujova uphethiloli ukuze kuthuthukiswe umphumela we-atomization kaphethiloli.
Ukukhiqizwa kwezinzwa: Ukubhoboza imigodi engxenyeni yezinzwa ukuze kuthuthukiswe ukuzwela kwayo kanye nesivinini sokuphendula.
5. Amadivayisi okubona:
Isixhumi sefayibha yokubona: Ukufaka ama-microholes ku-connector yefayibha yokubona ukuqinisekisa ikhwalithi yokudluliselwa kwesignali.
Isihlungi se-Optical: Hlaba izimbobo kusihlungi se-optical ukuze uthole ukukhetha okuthile kwe-wavelength.
6. Imishini yokunemba:
Isikhunta esinembile: Umshini wokusika imingxunya emincane esikhunta ukuze kuthuthukiswe ukusebenza kanye nokuphila kwesikhunta.
Izingxenye ezincane: Hlaba imigodi ezingxenyeni ezincane ukuze uhlangabezane nezidingo zokuhlanganiswa okunembe kakhulu.
I-XKH inikeza uhla oluphelele lwezinsizakalo zomshini wokubhoboza nge-laser onembile kakhulu, okuhlanganisa ukuthengiswa kwemishini, ukwesekwa kobuchwepheshe, izixazululo ezenziwe ngokwezifiso, ukufakwa kanye nokuqaliswa, ukuqeqeshwa kokusebenza kanye nokugcinwa ngemuva kokuthengisa, njll., ukuqinisekisa ukuthi amakhasimende asebenzisa ukwesekwa kobungcweti, okusebenzayo nokuphelele.
Umdwebo Oningiliziwe



