Umshini wokuqamba we-laser ngokunemba ulungele iSapphire Ceramic Material Gem enezinto zokushayela ze-nozzle

Umshini wokuqondisa we-laser wokunemba we-laser ulungele iSapphire Ceramic Material Gem enezinto zokushayela ze-nozzle ezifakiwe

Incazelo emfushane:

Umshini ufinyelela ubuncane be-Spot ukugxila ngokunwebeka kwe-beam futhi ugxile, futhi usebenzisa uhlelo lokulawula ukubona ama-laser micro-maching, ukumba kwe-laser kanye nokusika kwe-laser. Umshini wonke uhlome ngekhompyutha yokulawula, isoftware ekhethekile yomshini wokubhoboza we-laser kanye nesoftware ekhethekile yokusika okunembayo kwe-laser. Isibonisi Esihle Software, singasetha i-aperture, ukumba ubukhulu kanye ne-angle, isivinini sokumba, kanye nemvamisa ye-laser namanye amapharamitha; Ngokubonisa ukuboniswa kwesithombe, umsebenzi wokulandela umkhondo; Uhlelo lwekhodi le-G olutholakalayo noma uhlelo lwe-CAD Graphic Ingramming oluzenzakalelayo, kulula ukusebenza khona. Izici eziyinhloko zomshini ziyi-High Drilling Precision, indawo encane ethinta ukushisa, umsebenzi onamandla wesoftware, engahlangana nokucutshungulwa kwe-laser microhole yezinto eziningi. Umshini wonke ufaka u-X, y, z, z Ithebula lokuhamba ngokunemba, usebenzisa i-Precision Ball Screw, Linear Guide Rail. X, y unhlangothi: 50mm, u-z uqonde stroke: 50mm, ukunemba okuphindaphindwayo <± 2 microns.

Thumela i-imeyili kithi

Imininingwane Yomkhiqizo

Amathegi Omkhiqizo

Isingeniso Somkhiqizo

Izinto ezisebenzayo: Ilungele insimbi yemvelo, i-polycrystalline yensimbi, i-ruby, i-ceramire, ithusi, i-ceranic, i-rhenium, i-arloy yensimbi nezinye izinto eziphikisayo, ama-alleter amelana nensimbi, ukujula kanye nokushayela taper.

Izimo Zokusebenza

1. Ilungele ukusebenza ngaphansi kokushisa okukhona kwe-18 ℃ -28 ℃ kanye nomswakama ohlobene ka-30% -60%.

2. Ilungele ukuhlinzekwa kwamandla ezigaba ezimbili / 220V / 50hz / 10a.

3. Lungiselela ama-plugs ahlangabezana nezidingo zamazinga afanele amaShayina. Uma kungekho plug, i-adaptha efanele kufanele inikezwe.

I-4. Kusetshenziswe kabanzi kumdwebo we-diamond wire umdwebo ufa, i-wire ehamba kancane iyafa, umgodi we-muffler, umgodi oneladi, i-gem ethwala, ama-nozzle kanye neminye imikhakha yokunye.

Amapharamitha Ezobuchwepheshe

Ibizo	Umbhalo	Sebenza
I-Optical Maser wavength	354.7nm noma 355nm	Inquma ukusatshalaliswa kwamandla kanye nokungena kwamandla we-laser beam, futhi kuthinta nezinga lokufakwa kwezinto ezibonakalayo kanye nomphumela wokucubungula.
Amandla okukhipha okuphakathi	10.0 / 12.0 / 15.0 W @ 40KHZ	Thinta ukusebenza kahle kwensiza kanye nesivinini sokubhoboza, amandla aphezulu, ngokushesha ijubane lokucubungula.
Ububanzi be-pulse	Ngaphansi kwama-20ns @ 40khz	Ububanzi be-pulse elifushane bunciphisa ukushisa kwendawo ethintekile, kuthuthukisa ukunemba kwemishini, futhi kugweme ukulimala okushisayo kwezinto ezibonakalayo.
Izinga lokuphindaphindeka kabusha	I-10 ~ 200khz	Nquma imvamisa yokudlulisela kanye nokukhanyisa kahle kwe-laser beam, kukhuphuka imvamisa, ngokushesha ijubane lokubhoboza.
Ikhwalithi ye-Optical Beam	M² <1.2	Imishayo esezingeni eliphakeme iqinisekisa ukunemba okunemba kanye nekhwalithi yomgwaqo, ukunciphisa ukulahleka kwamandla.
Ububanzi be-Spot	0.8 ± 0.1mm	Nquma i-aperture ephansi kanye nokunemba kwemishini, okuncane indawo, okuncane kakhulu, kukhuphuka ukunemba.
I-Beam-Divergence Angle	Mkhulu kune-90%	Ikhono eligxile kakhulu kanye nokubhoboza ukujula kogongolo lwe-laser kuyathinteka. I-angle evuthayo, amandla aqine kakhulu.
Beam Ellipticity	Ngaphansi kwama-3% RMS	Uma kuncane i-ellipticity, ukwakheka komgodi kumbuthano, kukhuphuka ukunemba kwemishini.

Ukucubungula umthamo

Imishini yokushayela ye-laser ephezulu ye-laser inamakhono anamandla okucubungula futhi ingashayela izimbobo ezivela kuma-millons ambalwa kumamilimitha ambalwa ububanzi, nesimo, usayizi, isikhundla kanye ne-angle ye-Holos kungaba elawulwa ngokunembile. Ngasikhathi sinye, imishini isekela ukumba okungu-360-degree yonke indawo eyindilinga, engahlangabezana nezidingo zokumba izimo nezinhlaka ezahlukahlukene eziyinkimbinkimbi. Ngaphezu kwalokho, umshini wokuqondisa ophezulu we-laser punching we-laser ubuye ube nekhwalithi enhle kakhulu enqenqemeni futhi ukuqeda komhlaba, izimbobo ezicutshunguliwe zingama-burr mahhala, akukho mkhawulo oncibilikayo, futhi ingaphezulu lembobo libushelelezi futhi liyisicaba.
Ukusetshenziswa kokunemba okuphezulu komshini wokuphangwa kwe-laser punching:
1. Imboni ye-Electronics:
I-Pried Circuity Board (PCB): Isetshenziselwa ukucubungula ama-microhole ukufeza izidingo zokuxhumeka okuphezulu.

Ukupakishwa kwe-semicondector: punch izimbobo kuma-wafers nasezintweni zokupakisha ukuthuthukisa ukuqina kwephakeji nokusebenza.

2. I-Aerospace:
Izimbobo zenjini ezipholile zenjini

Ukucutshungulwa okuhlanganisiwe: Ukuqunjelwa okunembile okuphezulu kwe-carbon fiber composites ukuqinisekisa amandla ahlelekile.

3. Imishini yezokwelapha:
Izinsimbi zokuhlinza ezihlaselayo: ama-micining microholes ngamathuluzi okuhlinza ukuthuthukisa ukunemba nokuphepha.

Uhlelo Lokulethwa Kwezidakamizwa: Izimbobo ze-punch kudivayisi yokulethwa kwezidakamizwa ukulawula isilinganiso sokukhishwa kwezidakamizwa.

4. Ezokukhiqiza izimoto:
Uhlelo lokuphikisana kwamafutha

Ukukhiqiza inzwa: izimbobo zokumba entweni yezinzwa ukuthuthukisa ukuzwela kwayo kanye nesivinini sokuphendula.

5. Amadivayisi we-Optical:
Isixhumi se-Fibrical Fibrical: Imishini Microholes esixhumeni se-Fiber Optical ukuqinisekisa ikhwalithi yokudluliselwa kwesiginali.

Isihlungi se-Optical: punch izimbobo kusihlungi se-optical ukufezekisa ukukhethwa okuthile kwe-wavelthth.

6. Imishini yokucacisa:
I-Parcision Poarn: Imishini Microholes esibukwayo ukwenza ngcono ukusebenza kanye nempilo yenkonzo yesikhunta.

Izingxenye ezincane: Izimbobo ze-punch ezingxenyeni ezincane ukuze zihlangabezane nezidingo zomhlangano onobuhle obukhulu.

I-XKH ihlinzeka ngohlu oluphelele lokunakwa okuphezulu kwe-Laser Dringing Machine Services, kufaka phakathi ukuthengiswa kwemishini, ukusekelwa kwezobuchwepheshe, izixazululo ezenziwe ngezifiso, ukuqeqeshwa kokusebenza, ukuqiniseka ngokuthengisa, ukuqiniseka ukwesekwa okusebenzayo.