Ibhokisi le-FOSB wafer carrier box 25slots for 12inch wafer Ukunemba Isikhala semisebenzi ezenzakalelayo Izinto ezihlanzekile kakhulu

Incazelo emfushane:

Isithwali se-wafer esiwu-12-intshi (300mm) Front Opening Shipping Box (FOSB) siyisixazululo esithuthukisiwe semboni ye-semiconductor, eklanyelwe ukuhlinzeka ngokuphathwa okuphephile, ukuthutha, kanye nokugcinwa kwamawafa angama-intshi angu-12. Ngomthamo wezikhala ezingama-25, imbobo ngayinye iklanywe ngokucophelela ngesikhala esinembayo ukuze kuncishiswe ubungozi bokuthinta i-wafer, kuqinisekiswe ukuthi i-wafer ngayinye ihlala iphephile kuyo yonke inqubo yezokuthutha.

Lakhiwe ngezinto ezihlanzeke kakhulu, ezikhipha umoya omncane, leli bhokisi le-FOSB lihlangabezana namazinga aphezulu adingekayo ekukhiqizeni ama-semiconductor yesimanje, lapho ukuhlanzeka nobuqotho be-wafer kubaluleke kakhulu. Ilungiselelwe ukusebenza okuzenzakalelayo, inkampani yenethiwekhi ye-FOSB ihlanganisa ngaphandle komthungo kuma-automated material handling systems (AMHS), evumela ukuthuthwa kwewafa okuphumelelayo, okungangcolisi. Idizayini ethuthukisiwe ihlanganisa izindlela eziqinile zokugcina ama-wafer ukuze kuvikeleke amawafa ngesikhathi sokunyakaza, okuqinisekisa ukuthi afika lapho aya khona ephelele, ngaphandle kokuwohloka noma amaphutha.

Leli bhokisi le-wafer carrier liyingxenye ebalulekile yokuqondisa ukuphathwa kwe-wafer endaweni enemba kakhulu, linikeza inhlanganisela yokuvumelana okuzenzakalelayo, ukulawula ukungcola, nokwakhiwa okuhlala isikhathi eside, okulenza libe lilungele imigqa yokukhiqiza ye-semiconductor ephezulu.

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Imininingwane Yomkhiqizo

Omaka bomkhiqizo

Izici Eziyinhloko

Isici	Incazelo
Slot Umthamo	25 izikhalaokweAma-wafers angama-intshi angu-12, ukwandisa isikhala sokugcina ngenkathi uqinisekisa ukuthi ama-wafers agcinwe ngokuvikelekile.
Ukuphatha Okuzenzakalelayo	Idizayinelweukuphathwa kwe-wafer okuzenzakalelayo, ukunciphisa iphutha lomuntu nokwandisa ukusebenza kahle kwezindwangu ze-semiconductor.
Ukunemba Slot Isikhala	Isikhala se-slot esakhiwe ngokunemba kuvimbela ukuthintana kwe-wafer, kunciphisa ubungozi bokungcola kanye nokulimala komshini.
Izinto Ezihlanzekile Kakhulu	Kwenziwe kusukaizinto ezihlanzekile kakhulu, ezikhipha umoya omncaneukugcina ubuqotho bamawafa kanye nokunciphisa ukungcoliswa.
Isistimu yokugcinwa kwe-wafer	Ihlanganisa auhlelo lokugcinwa kwe-wafer olusebenza kahle kakhuluukugcina ama-wafers esendaweni ngokuphephile ngesikhathi sokuthutha.
I-SEMI/FIMS & AMHS Compliance	NgokugcweleI-SEMI/FIMSfuthiI-AMHSukuthobela, ukuqinisekisa ukuhlanganiswa okungenamthungo ezinhlelweni ezizenzakalelayo ze-semiconductor.
Ukulawula Izinhlayiya	Idizayinelwe ukunciphisaukukhiqizwa kwezinhlayiya, ukuhlinzeka ngendawo ehlanzekile yokuthutha i-wafer.
Umklamo Owenziwe ngokwezifiso	Yenza ngokwezifisoukuhlangabezana nezidingo ezithile zokukhiqiza, okuhlanganisa ukulungiswa kokuhlelwa kwesikhala noma ukukhetha kwezinto ezibonakalayo.
Ukuqina Okuphezulu	Yakhiwe ngezinto ezisezingeni eliphezulu ukuze imelane nobunzima bezokuthutha ngaphandle kokuphazamisa ukusebenza.

Izici ezinemininingwane

1.25-Slot Umthamo 12-intshi Wafers
I-FOSB enezikhala ezingama-25 iklanyelwe ukubamba ngokuvikelekile amawafa angama-intshi angu-12, okuvumela ukuthutha okuphephile nokusebenza kahle. I-slot ngayinye iklanywe ngokucophelela ukuze kuqinisekiswe ukuqondana kahle kwe-wafer nokuzinza, kunciphisa ubungozi bokuphuka kwe-wafer noma ukuwohloka. Idizayini ikhulisa isikhala ngenkathi igcina amabanga aphephile phakathi kwamawafa, abalulekile ekuvimbeleni ukulimala ngesikhathi sokuthutha noma ukuphatha.

2.Isikhala Esiqondile Sokuvimbela Ukulimala
Isikhala esinembayo phakathi kwezikhala sibalwa ngokucophelela ukuze kuvinjelwe ukuthintana okuqondile phakathi kwamawafa. Lesi sici sibalulekile ekuphathweni kwe-wafer ye-semiconductor, njengoba ngisho nokuklwebheka okuncane noma ukungcoliswa kungabangela ukonakala okukhulu. Ngokuqinisekisa isikhala esanele phakathi kwamawafer, ibhokisi le-FOSB linciphisa amathuba okulimala ngokomzimba kanye nokungcoliswa ngesikhathi sokuthutha, ukugcinwa, kanye nokuphatha.

3.Idizayinelwe Ukusebenza Okuzenzakalelayo
Ibhokisi le-FOSB wafer carrier lilungiselelwe ukusebenza okuzenzakalelayo, lehlisa isidingo sokungenelela komuntu enqubweni yokuthutha eyilucwecwana. Ngokuhlanganisa ngaphandle komthungo nezinhlelo zokubamba izinto ezizenzakalelayo (AMHS), ibhokisi lithuthukisa ukusebenza kahle, lehlisa ingcuphe yokungcola okuvela ekuthinteni abantu, futhi lisheshisa ukuthuthwa kwe-wafer phakathi kwezindawo zokucubungula. Lokhu kuhambisana kuqinisekisa ukuphathwa kwe-wafer okushelelayo nokusheshayo ezindaweni zesimanje zokukhiqiza i-semiconductor.

4.Izisetshenziswa Ezihlanzekile Kakhulu, Ezikhipha Kancane Kancane
Ukuqinisekisa amazinga aphezulu okuhlanzeka, ibhokisi le-FOSB le-wafer carrier lenziwe ngezinto ezihlanzekile kakhulu, ezikhipha umoya omncane. Lokhu kwakhiwa kuvimbela ukukhululwa kwezinhlanganisela eziguquguqukayo ezingaphazamisa ubuqotho be-wafer, ukuqinisekisa ukuthi ama-wafers ahlala engcolile ngesikhathi sokuthutha nokugcinwa. Lesi sici sibaluleke kakhulu kundwangu ye-semiconductor lapho ngisho nezinhlayiya ezincane kakhulu noma ukungcola kwamakhemikhali kungaholela ekulimaleni okumba eqolo.

5.Isistimu Yokugcina I-Wafer Eqinile
Isistimu yokugcinwa kwe-wafer ngaphakathi kwebhokisi le-FOSB iqinisekisa ukuthi ama-wafers agcinwe endaweni ngokuvikelekile ngesikhathi sokuthutha, avimbele noma yikuphi ukunyakaza okungase kubangele ukungahambi kahle kwe-wafer, imihuzuko, noma ezinye izinhlobo zomonakalo. Lolu hlelo lwenzelwe ukugcina isimo se-wafer ngisho nasezindaweni ezizenzakalelayo ezinesivinini esikhulu, esinikeza ukuvikeleka okuphezulu kwamawafa athambile.

6.Ukulawula Izinhlayiya kanye Nenhlanzeko
Idizayini yebhokisi le-FOSB wafer carrier igxile ekwehliseni ukukhiqizwa kwezinhlayiyana, okungenye yezimbangela eziphambili zokulimala kwe-wafer ekukhiqizeni kwe-semiconductor. Ngokusebenzisa izinto ezihlanzekile kakhulu kanye nesistimu yokugcina eqinile, ibhokisi le-FOSB lisiza ukugcina amazinga okungcola abe mancane, kugcinwe ukuhlanzeka okudingekayo ekukhiqizeni kwe-semiconductor.

7.SEMI/FIMS kanye Nokuthobelana kwe-AMHS
Ibhokisi lenkampani yenethiwekhi ye-FOSB lihlangabezana nezindinganiso ze-SEMI/FIMS kanye ne-AMHS, liqinisekisa ukuthi lihambisana ngokugcwele nezinhlelo zokubamba izinto ezizenzakalelayo ezisezingeni lomkhakha. Lokhu kuthobelana kuqinisekisa ukuthi ibhokisi liyahambisana nezidingo eziqinile zezindawo zokukhiqiza ze-semiconductor, okusiza ukuhlanganiswa okushelelayo ekugelezeni komsebenzi wokukhiqiza nokuthuthukisa ukusebenza kahle kokusebenza.

8.Ukuqina Nokuphila Isikhathi Eside
Lenziwe ngezinto ezisezingeni eliphezulu, ibhokisi le-FOSB le-wafer carrier lidizayinelwe ukuthi limelane nezidingo zomzimba ze-wafer transport ngenkathi ligcina ubuqotho balo besakhiwo. Lokhu kuqina kuqinisekisa ukuthi ibhokisi lingasetshenziswa ngokuphindaphindiwe ezindaweni eziphezulu ngaphandle kwesidingo sokushintshwa njalo, elinikeza isisombululo esingabizi kakhulu esikhathini eside.

9.Ukwenza ngokwezifiso Izidingo Eziyingqayizivele
Ibhokisi lenkampani yenethiwekhi ye-FOSB linikeza izinketho zokwenza ngokwezifiso ukuhlangabezana nezidingo ezithile zokusebenza. Kungakhathaliseki ukuthi ilungisa inani lezikhala, ukushintsha ubukhulu bebhokisi, noma ukukhetha izinto ezikhethekile zezinhlelo zokusebenza ezithile, ibhokisi lenkampani yenethiwekhi lingenziwa ngendlela efanele ukuze livumelane nenani elibanzi lezidingo zokukhiqiza ze-semiconductor.

Izinhlelo zokusebenza

Ibhokisi le-FOSB le-wafer carrier elingu-12-intshi (300mm) lilungele ukusetshenziswa okuhlukahlukene ngaphakathi kokukhiqizwa kwe-semiconductor nezinkambu ezihlobene:

Ukuphatha i-Semiconductor Wafer
Ibhokisi liqinisekisa ukuphathwa okuphephile nokusebenza kahle kwamawafa angu-12-intshi phakathi kwazo zonke izigaba zokukhiqiza, kusukela ekwenziweni kokuqala kuya ekuhlolweni kokugcina nokupakishwa. Ukubamba kwayo okuzenzakalelayo kanye nesikhala esinembayo se-slot kuvikela amawafa ekungcoleni nasekulimaleni komshini, okuqinisekisa isivuno esikhulu ekukhiqizeni ama-semiconductor.

I-Wafer Storage
Ezindwangu ze-semiconductor, ukugcinwa kwe-wafer kufanele kuphathwe ngokucophelela ukugwema ukuwohloka noma ukungcoliswa. Ibhokisi lenkampani yenethiwekhi ye-FOSB lihlinzeka ngendawo ezinzile nehlanzekile, livikela ama-wafers ngesikhathi sokugcinwa futhi lisize ukugcina ubuqotho bawo kuze kube yilapho selilungele ukucutshungulwa okwengeziwe.

Ukuthutha ama-Wafers Phakathi Kwezigaba Zokukhiqiza
Ibhokisi le-FOSB wafer carrier liklanyelwe ukuthutha ngokuphepha amawafa phakathi kwezigaba ezihlukene zokukhiqiza, ukunciphisa ubungozi bokulimala kwewafer ngesikhathi sokuthutha. Kungakhathaliseki ukuthi ama-wafers ahambayo ngaphakathi kwendwangu efanayo noma phakathi kwezinsiza ezahlukene, ibhokisi lenethiwekhi liqinisekisa ukuthi ama-wafer ahanjiswa ngokuphepha nangempumelelo.

Ukuhlanganiswa ne-AMHS
Ibhokisi le-FOSB wafer carrier lihlanganisa ngaphandle komthungo nezinhlelo zokubamba izinto ezizenzakalelayo (AMHS), elivumela ukunyakaza kwe-wafer enesivinini esikhulu ngaphakathi kwendwangu yesimanje ye-semiconductor. I-automation ehlinzekwe yi-AMHS ithuthukisa ukusebenza kahle, inciphisa amaphutha abantu, futhi ikhuphule umthamo ophelele emigqeni yokukhiqiza ye-semiconductor.

Amagama angukhiye e-FOSB Q&A

Q1: Mangaki ama-wafers ibhokisi lenkampani yenethiwekhi ye-FOSB elingabamba?

A1:IIbhokisi lenkampani yenethiwekhi ye-FOSBunayo a25-slot umthamo, eklanyelwe ngokukhethekile ukubambaAma-wafers angu-12-intshi (300mm).ngokuphephile ngesikhathi sokuphatha, ukugcinwa, kanye nokuthutha.

Q2: Yiziphi izinzuzo zesikhala esinembayo ebhokisini lenkampani yenethiwekhi ye-FOSB?

A2: Isikhala esinembayoiqinisekisa ukuthi ama-wafers agcinwa ebangeni eliphephile ukusuka kwelinye, ukuvimbela ukuthintana okungaholela ekuklwebeni, emifantwini, noma ekungcoleni. Lesi sici sibalulekile ekugcineni ubuqotho bamawafa kuyo yonke inqubo yokuthutha nokuphatha.

Q3: Ingabe ibhokisi le-FOSB lingasetshenziswa nezinhlelo ezizenzakalelayo?

A3:Yebo, iIbhokisi lenkampani yenethiwekhi ye-FOSBilungiselelweimisebenzi ezenzakalelayofuthi iyahambisana ngokugcweleI-AMHS, okuyenza ilungele imigqa yokukhiqiza ye-semiconductor enesivinini esikhulu.

I-Q4: Yiziphi izinto ezisetshenziswa ebhokisini lenkampani ye-FOSB ukuvimbela ukungcola?

A4:IIbhokisi lenethiwekhi le-FOSByenziwe kusukaizinto ezihlanzekile kakhulu, ezikhipha umoya omncane, ezikhethwe ngokucophelela ukuvimbela ukungcola nokuqinisekisa ubuqotho be-wafer ngesikhathi sokuthutha nokugcinwa.

Q5: Lusebenza kanjani uhlelo lokugcinwa kwe-wafer ebhokisini le-FOSB?

A5:Iisistimu yokugcinwa kwe-waferivikela ama-wafers endaweni, ivimbele noma yikuphi ukunyakaza ngesikhathi sokuthutha, ngisho nasezinhlelweni ezizenzakalelayo ezisebenza ngesivinini esikhulu. Lolu hlelo lunciphisa ubungozi bokungahleleki kahle kwe-wafer noma ukulimala ngenxa yokudlidliza noma amandla angaphandle.

Q6: Ingabe ibhokisi le-FOSB wafer carrier lingenziwa ngezifiso izidingo ezithile?

A6:Yebo, iIbhokisi lenkampani yenethiwekhi ye-FOSBizipesheliizinketho ngokwezifiso, okuvumela ukulungiswa kokucushwa kwesikhala, izinto zokwakha, kanye nobukhulu ukuze kuhlangatshezwane nezidingo eziyingqayizivele zendwangu ye-semiconductor.

Isiphetho

Ibhokisi le-FOSB le-wafer carrier elingu-12-intshi (300mm) linikeza isixazululo esivikeleke kakhulu nesisebenza kahle sokuthutha nokugcinwa kwe-semiconductor wafer. Inezikhala ezingama-25, ukunemba kwezikhala, izinto ezihlanzeke kakhulu, nokuhambisana nazo