Ibhokisi Lokulethwa Lebhokisi Lesitoreji Eliyi-6 Inch / 8 Inch POD / FOSB Fiber Optic Splice Box Box Storage Box RSP Remote Service Platform FOUP Front Opening Unified Pod

Ibhokisi Lokulethwa Lebhokisi Lesitoreji Eliyi-6 Inch / 8 Inch POD / FOSB Fiber Optic Splice Box Box Storage Box RSP Remote Service Platform I-FOUP Front Opening Unified Pod Isithombe Esifakiwe

Incazelo emfushane:

II-FOSB (Ibhokisi Lokuthumela Elivula Ngaphambili)iyisitsha esiklanywe ngokunemba, esivula ngaphambili esenzelwe ngqo ukuthuthwa nokugcinwa okuphephile kwama-wafer angama-300mm semiconductor. Idlala indima ebalulekile ekuvikeleni ama-wafer ngesikhathi sokudluliselwa kwe-inter-fab kanye nokuthunyelwa ibanga elide ngenkathi iqinisekisa ukuthi amazinga aphezulu okuhlanzeka kanye nobuqotho bemishini kugcinwa.

Sithumelele i-imeyili

Izici

Umdwebo Oningiliziwe

Ukubuka konke kwe-FOSB

Yakhiwe ngezinto ezihlanzekile kakhulu, ezihlakazekayo futhi yaklanywa ngokwezindinganiso ze-SEMI, i-FOSB inikeza isivikelo esiyingqayizivele ekungcolisweni kwezinhlayiya, ukukhishwa kwe-static, kanye nokushaqeka ngokomzimba. Isetshenziswa kabanzi ekukhiqizweni kwe-semiconductor emhlabeni jikelele, ezokuthutha, kanye nobambiswano lwe-OEM/OSAT, ikakhulukazi emigqeni yokukhiqiza ezenzakalelayo ye-300mm wafer fabs.

Isakhiwo kanye nezinto zokwakha ze-FOSB

Ibhokisi le-FOSB elijwayelekile lakhiwe ngezingxenye eziningana ezinembile, zonke zenzelwe ukusebenza kahle ngokuzenzakalelayo kwefektri nokuqinisekisa ukuphepha kwe-wafer:

Umzimba Oyinhloko: Kubunjwe ngamapulasitiki obunjiniyela obuhlanzekile kakhulu njenge-PC (polycarbonate) noma i-PEEK, okunikeza amandla aphezulu okusebenza, ukukhiqizwa kwezinhlayiya eziphansi, kanye nokumelana namakhemikhali.
Umnyango Wokuvula Ongaphambili: Yakhelwe ukuhambisana okugcwele okuzenzakalelayo; inama-gasket okuvala aqinile aqinisekisa ukushintshana komoya okuncane ngesikhathi sokuthuthwa.
Ithreyi Yangaphakathi Ye-Reticle/Ye-Wafer: Ibamba ama-wafer afinyelela kwangu-25 ngokuphephile. Ithreyi ayiguquguquki futhi igoqekile ukuvimbela ukugudluka kwe-wafer, ukuqhekeka komphetho, noma ukuklwebheka.
Indlela Yokubopha: Uhlelo lokukhiya ukuphepha luqinisekisa ukuthi umnyango uhlala uvaliwe ngesikhathi sokuthutha nokuphatha.
Izici Zokulandelela: Amamodeli amaningi afaka amathegi e-RFID afakiwe, amabhakhodi, noma amakhodi e-QR ukuze kuhlanganiswe futhi kulandelwe i-MES ngokugcwele kulo lonke uchungechunge lwezokuthutha.
Ukulawulwa kwe-ESD: Izinto zokwakha azishintshi, ngokuvamile zinokuphikiswa kobuso okuphakathi kuka-10⁶ no-10⁹ ohms, okusiza ekuvikeleni ama-wafer ekukhishweni kwe-electrostatic.

Lezi zingxenye zakhiwe ezindaweni zokuhlanza futhi zihlangabezana noma zidlula amazinga e-SEMI aphesheya kwezilwandle njenge-E10, E47, E62, kanye ne-E83.

Izinzuzo Eziyinhloko

● Ukuvikelwa Kwesitsha Esiphezulu

Ama-FOSB akhelwe ukuvikela ama-wafer ekulimaleni ngokomzimba kanye nokungcola kwemvelo:

Uhlelo oluvalwe ngokuphelele, oluvaliwe kahle luvimba umswakama, umusi wamakhemikhali, kanye nezinhlayiya eziphuma emoyeni.
Ingaphakathi elilwa nokudlidliza linciphisa ingozi yokushaqeka noma imifantu emincane.
Igobolondo langaphandle eliqinile limelana nokuwa kanye nengcindezi yokufakwa ngesikhathi sokuthutha.

● Ukuhambisana Okugcwele Kokuzenzakalelayo

Ama-FOSB aklanywe ukuze asetshenziswe ku-AMHS (Izinhlelo Zokuphatha Izinto Ezizenzakalelayo):

Iyahambisana nezingalo zerobhothi ezihambisana ne-SEMI, ama-load port, ama-stocker, kanye nama-openers.
Indlela yokuvula ngaphambili ihambisana nezinhlelo ezijwayelekile ze-FOUP kanye nezinhlelo ze-load port zokwenza izinto ngokuzenzakalelayo kwefektri ngaphandle kokuphazamiseka.

● Umklamo Olungele Igumbi Lokuhlanza

Kwenziwe ngezinto ezihlanzekile kakhulu, ezingakhiphi igesi kakhulu.
Kulula ukuyihlanza nokusebenzisa kabusha; ifanelekela izindawo zokuhlanza zeKlasi 1 noma ngaphezulu.
Ayinazo i-ion zensimbi ezisindayo, iqinisekisa ukuthi akukho ukungcola ngesikhathi sokudluliselwa kwe-wafer.

● Ukulandelela Okuhlakaniphile Nokuhlanganiswa kwe-MES

Izinhlelo ze-RFID/NFC/barcode ezingakhethwa zivumela ukulandeleka okuphelele kusuka ku-fab kuya ku-fab.
I-FOSB ngayinye ingahlonzwa futhi ilandelwe ngendlela ehlukile ngaphakathi kohlelo lwe-MES noma lwe-WMS.
Isekela ukucaca kwenqubo, ukuhlonza inqwaba, kanye nokulawula isitokwe.

Ibhokisi le-FOSB - Ithebula Lemininingwane Ehlanganisiwe

Isigaba	Into	Inani
Izinto zokwakha	Xhumana ne-Wafer	I-Polycarbonate
Izinto zokwakha	Igobolondo, Umnyango, Umcamelo Womnyango	I-Polycarbonate
Izinto zokwakha	Isibambi Sangemuva	I-Polybutylene Terephthalate
Izinto zokwakha	Izibambo, I-Auto Flange, Ama-Info Pads	I-Polycarbonate
Izinto zokwakha	I-Gasket	I-Thermoplastic Elastomer
Izinto zokwakha	Ipuleti le-KC	I-Polycarbonate
Imininingwane	Umthamo	Ama-wafer angu-25
Imininingwane	Ukujula	332.77 mm ±0.1 mm (13.10" ±0.005")
Imininingwane	Ububanzi	389.52 mm ±0.1 mm (15.33" ±0.005")
Imininingwane	Ukuphakama	336.93 mm ±0.1 mm (13.26" ±0.005")
Imininingwane	Ubude bePakethi Ezimbili	680 mm (26.77")
Imininingwane	Ububanzi Bephakethe Eli-2	415 mm (16.34")
Imininingwane	Ukuphakama Okunezingqwembe Ezimbili	365 mm (14.37")
Imininingwane	Isisindo (Akunalutho)	4.6 kg (10.1 lb)
Imininingwane	Isisindo (Esigcwele)	7.8 kg (17.2 lb)
Ukuhambisana kwe-Wafer	Usayizi we-Wafer	300 mm
Ukuhambisana kwe-Wafer	Iphimbo	10.0 mm (0.39")
Ukuhambisana kwe-Wafer	Izindiza	±0.5 mm (0.02") kusukela ku-nominal

Izimo Zohlelo Lokusebenza

Ama-FOSB angamathuluzi abalulekile ekuthuthweni nasekugcinweni kwe-wafer engu-300mm. Asetshenziswa kabanzi kulezi zimo ezilandelayo:

Ukudluliselwa kwe-Fab-to-Fab: Ukuhambisa ama-wafer phakathi kwezindawo ezahlukene zokukhiqiza ama-semiconductor.
Ukulethwa Kwezinto Zokubumba: Ukuthutha ama-wafer aqediwe kusuka kufekethi kuya kumakhasimende noma endaweni yokupakisha.
I-OEM/OSAT Logistics: Ezinqubweni zokupakisha nokuhlola ezinikezwa ngaphandle.
Indawo Yokugcina Nokugcina Izinto Yenkampani Yesithathu: Vikela isitoreji sesikhathi eside noma sesikhashana sama-wafer abalulekile.
Ukudluliselwa Kwama-Wafer Angaphakathi: Emakhampasi amakhulu amahle lapho amamojula okukhiqiza akude exhunywe khona nge-AMHS noma ezokuthutha ngesandla.

Emisebenzini yochungechunge lokuphakelwa komhlaba wonke, ama-FOSB abe yindinganiso yokuthuthwa kwe-wafer enenani eliphezulu, eqinisekisa ukulethwa okungenakungcola kuwo wonke amazwekazi.

I-FOSB vs. I-FOUP – Uyini Umehluko?

Isici	I-FOSB (Ibhokisi Lokuthumela Elivula Ngaphambili)	I-FOUP (I-Pod Ehlanganisiwe Engaphambili)
Ukusetshenziswa Okuyinhloko	Ukuthunyelwa kwe-wafer ye-inter-fab kanye ne-logistics	Ukudluliselwa kwe-wafer ngaphakathi kwendwangu kanye nokucubungula okuzenzakalelayo
Isakhiwo	Isitsha esiqinile, esivaliwe nesivikelo esengeziwe	I-pod engasetshenziswa kabusha elungiselelwe ukuzenzekela kwangaphakathi
Ukuqina komoya	Ukusebenza okuphezulu kokuvala	Yakhelwe ukufinyelela kalula, ingangenisi moya kakhulu
Imvamisa Yokusetshenziswa	Okuphakathi nendawo (kugxile ekuthuthweni okuphephile kwebanga elide)	Imvamisa ephezulu emigqeni yokukhiqiza ezenzakalelayo
Amandla e-Wafer	Ngokuvamile ama-wafer angu-25 ngebhokisi	Ngokuvamile ama-wafer angu-25 nge-pod ngayinye
Usekelo Lokuzenzakalela	Iyahambisana nezivuli ze-FOSB	Kuhlanganiswe namachweba okulayisha e-FOUP
Ukuthobela imithetho	I-SEMI E47, E62	I-SEMI E47, E62, E84, nokuningi

Nakuba womabili enza imisebenzi ebalulekile ekuthuthweni kwe-wafer, ama-FOSB akhelwe ngenhloso yokuthunyelwa okuqinile phakathi kwezimpahla noma kumakhasimende angaphandle, kanti ama-FOUP agxile kakhulu ekusebenzeni kahle komugqa wokukhiqiza okuzenzakalelayo.

Imibuzo Evame Ukubuzwa (Imibuzo Evame Ukubuzwa)

Umbuzo 1: Ingabe ama-FOSB angasetshenziswa kabusha?
Yebo. Ama-FOSB asezingeni eliphezulu aklanyelwe ukusetshenziswa okuphindaphindiwe futhi angamelana nemijikelezo eminingi yokuhlanza nokuphatha uma egcinwa kahle. Kunconywa ukuhlanza njalo ngamathuluzi aqinisekisiwe.

Umbuzo 2: Ingabe ama-FOSB angenziwa ngokwezifiso ukuze akhiqizwe noma alandelwe?
Impela. Ama-FOSB angenziwa ngezifiso ngama-logo amaklayenti, amathegi athile e-RFID, ukuvalwa kokumelana nomswakama, kanye nokufaka ikhodi yemibala ehlukene ukuze kube lula ukuphatha izinto.

Umbuzo 3: Ingabe ama-FOSB afanelekela izindawo zokuhlanza?
Yebo. Ama-FOSB akhiqizwa ngamapulasitiki ahlanzekile futhi avalwe ukuze kuvinjelwe ukukhiqizwa kwezinhlayiya. Afaneleka ezindaweni zokuhlanza zeKlasi 1 kuya kweKlasi 1000 kanye nezindawo ezibalulekile ze-semiconductor.

Umbuzo 4: Ama-FOSB avulwa kanjani ngesikhathi sokuzenzakalela?
Ama-FOSB ahambisana nezivuli ze-FOSB ezikhethekile ezisusa umnyango wangaphambili ngaphandle kokuthintana ngesandla, zigcina ubuqotho bezimo zegumbi elihlanzekile.

Mayelana NATHI

I-XKH igxile ekuthuthukisweni kobuchwepheshe obuphezulu, ekukhiqizweni, nasekuthengisweni kwengilazi ekhethekile ye-optical kanye nezinto ezintsha zekristalu. Imikhiqizo yethu ihlinzeka nge-optical electronics, i-consumer electronics, kanye nezempi. Sinikeza izingxenye ze-optical ze-Sapphire, izembozo zelensi yeselula, i-Ceramics, i-LT, i-Silicon Carbide SIC, i-Quartz, kanye nama-semiconductor crystal wafers. Ngobuchwepheshe obunekhono kanye nemishini esezingeni eliphezulu, sihamba phambili ekucutshungulweni komkhiqizo okungewona ojwayelekile, sihlose ukuba yibhizinisi elihamba phambili lezinto ze-optoelectronic tech.