6 Intshi / 8 Intshi POD / FOSB Fiber Optic Ibhokisi Lokuhlukanisa Ibhokisi Lokuletha Ibhokisi Lesitoreji Se-RSP Ipulatifomu Yesevisi Ekude FOUP Ukuvula Ngaphambili IPod Ehlanganisiwe

6 Intshi / 8 Intshi POD / FOSB Fiber Optic Splice Ibhokisi Lokulethwa Ibhokisi Lesitoreji Se-RSP Remote Service Platform FOUP Ukuvula Ngaphambili IPod Ehlanganisiwe Isithombe Esifakiwe

Incazelo emfushane:

II-FOSB (Ibhokisi Lokuthumela Elivula Ngaphambili)iyisitsha esinembayo esakhiwe ngobunjiniyela, esivula ngaphambili esiklanyelwe ukuthutha okuphephile nokugcinwa kwamawafa angama-semiconductor angu-300mm. Idlala indima ebalulekile ekuvikeleni ama-wafers ngesikhathi sokudluliselwa kwendwangu phakathi kwendwangu kanye nokuthunyelwa kwebanga elide ngenkathi iqinisekisa ukuthi amazinga aphezulu okuhlanzeka nobuqotho bemishini kuyagcinwa.

Thumela i-imeyili kithi

Izici

Umdwebo onemininingwane

Uhlolojikelele lwe-FOSB

Ikhiqizwe ngezinto ezihlanzeke kakhulu, ezisabalalisa izinto ezimile futhi zakhiwe kumazinga e-SEMI, i-FOSB inikeza isivikelo esikhethekile ekungcolisweni kwezinhlayiyana, ukukhishwa okumile, kanye nokushaqeka komzimba. Isetshenziswa kabanzi kuwo wonke ukukhiqizwa kwe-semiconductor yomhlaba wonke, okokusebenza, kanye nokusebenzisana kwe-OEM/OSAT, ikakhulukazi emigqeni yokukhiqiza ezenzakalelayo yama-wafer fabs angu-300mm.

Isakhiwo Nezinto Zokusebenza ze-FOSB

Ibhokisi elijwayelekile le-FOSB lakhiwe izingxenye ezimbalwa ezinembayo, zonke eziklanyelwe ukusebenza ngaphandle komthungo nge-automation yefekthri nokuqinisekisa ukuphepha kwe-wafer:

Umzimba Oyinhloko: Ibunjwe kusuka kumapulasitiki obunjiniyela ahlanzekile njenge-PC (i-polycarbonate) noma i-PEEK, ehlinzeka ngamandla amakhulu emishini, ukukhiqizwa kwezinhlayiya eziphansi, nokumelana namakhemikhali.
Umnyango Ovula Ngaphambili: Idizayinelwe ukuhambisana okugcwele kwe-automation; ifaka ama-gaskets aqinile aqinisekisa ukushintshaniswa komoya okuncane ngesikhathi sokuthutha.
Ithreyi ye-Reticle/Wafer yangaphakathi: Ibamba amawafa angama-25 ngokuvikelekile. Ithreyi liyi-anti-static futhi ligxishiwe ukuvimbela ukuguqulwa kwe-wafer, ukuphuka komphetho, noma ukunwaya.
I-Latch Mechanism: Uhlelo lokukhiya ukuphepha luqinisekisa ukuthi umnyango uhlala uvaliwe ngesikhathi sokuthutha nokuphatha.
Izici Zokulandeleka: Amamodeli amaningi afaka omaka abashumekiwe be-RFID, amabhakhodi, noma amakhodi e-QR okuhlanganiswa okugcwele kwe-MES nokulandelela kulo lonke uchungechunge lwezinto.
Ukulawulwa kwe-ESD: Izinto ezisetshenziswayo zi-static-dissipative, ngokuvamile zinokumelana kwendawo phakathi kuka-10⁶ no-10⁹ ohm, okusiza ukuvikela ama-wafers ekukhishweni kwe-electrostatic.

Lezi zingxenye zakhiwe ezindaweni ezihlanzekile futhi zihlangabezana noma zidlule izindinganiso zamazwe ngamazwe ze-SEMI ezifana ne-E10, E47, E62, ne-E83.

Izinzuzo Eziyinhloko

● I-High-Level Wafer Protection

Ama-FOSB akhelwe ukuvikela ama-wafers ekulimaleni ngokomzimba kanye nokungcola kwemvelo:

Isistimu evalwe ngokugcwele, evalwe nge-hermetically ivimba umswakama, isisi samakhemikhali, nezinhlayiya ezihamba emoyeni.
Ingaphakathi le-anti-vibration linciphisa ubungozi bokushaqeka kwemishini noma ama-microcracks.
Igobolondo langaphandle eliqinile limelana nemithelela yokuwa kanye nokucindezela kokunqwabelanisa ngesikhathi sokuhamba.

● Ukuhambelana Okuzenzakalelayo Okugcwele

Ama-FOSB aklanyelwe ukusetshenziswa ku-AMHS (Izinhlelo Zokuphatha Izinto Ezizenzakalelayo):

Ihambisana nezingalo zerobhothi ezithobela i-SEMI, izimbobo zokulayisha, izitoko, nezivula.
Umshini wokuvula ngaphambili uhambisana ne-FOUP ejwayelekile kanye namasistimu embobo yokulayisha wokuzenzakalela kwefekthri okungenamthungo.

● I-Cleanroom-Ready Design

Kwenziwe ngezinto ezihlanzeke kakhulu, ezikhipha umoya omncane.
Kulula ukuhlanza nokusebenzisa kabusha; ilungele Ikilasi 1 noma izindawo zegumbi elihlanzekile.
Ikhululekile kuma-ion ensimbi esindayo, iqinisekisa ukuthi akukho ukungcoliswa ngesikhathi sokudlulisa i-wafer.

● Intelligent Tracking & MES Integration

Amasistimu e-RFID/NFC/ibhakhodi angakhethwa avumela ukulandeleka okuphelele kusuka kundwangu kuya kwendwangu.
I-FOSB ngayinye ingakhonjwa ngokuhlukile futhi ilandelelwe ngaphakathi kohlelo lwe-MES noma lwe-WMS.
Isekela inqubo yokubonisa izinto, ukuhlonza inqwaba, nokulawulwa kokusungula.

Ibhokisi le-FOSB - Ithebula Lemininingwane Ehlanganisiwe

Isigaba	Into	Inani
Izinto zokwakha	Oxhumana naye we-Wafer	I-Polycarbonate
Izinto zokwakha	Igobolondo, Umnyango, Ikhushini Lomnyango	I-Polycarbonate
Izinto zokwakha	Umgcini wangemuva	I-Polybutylene Terephthalate
Izinto zokwakha	Izibambo, Auto Flange, Info Pads	I-Polycarbonate
Izinto zokwakha	I-Gasket	I-Thermoplastic Elastomer
Izinto zokwakha	I-KC Plate	I-Polycarbonate
Imininingwane	Amandla	25 ama-wafers
Imininingwane	Ukujula	332.77 mm ±0.1 mm (13.10" ±0.005")
Imininingwane	Ububanzi	389.52 mm ±0.1 mm (15.33" ±0.005")
Imininingwane	Ubude	336.93 mm ±0.1 mm (13.26" ±0.005")
Imininingwane	2-Iphakethe Ubude	680 mm (26.77")
Imininingwane	2-Iphakethe Ububanzi	415 mm (16.34")
Imininingwane	2-Pack Ubude	365 mm (14.37")
Imininingwane	Isisindo (Akunalutho)	4.6 kg (10.1 lb)
Imininingwane	Isisindo (Sigcwele)	7.8 kg (17.2 lb)
I-Wafer Compatibility	Usayizi we-Wafer	300 mm
I-Wafer Compatibility	Iphimbo	10.0 mm (0.39")
I-Wafer Compatibility	Izindiza	±0.5 mm (0.02") ukusuka kwegama

Izimo zohlelo lokusebenza

Ama-FOSB angamathuluzi abalulekile ku-300mm wafer logistics kanye nesitoreji. Zamukelwa kabanzi kulezi zimo ezilandelayo:

Ukudluliswa kwe-Fab-to-Fab: Okwamawafa ahambayo phakathi kwezindawo ezihlukene zokwenza ama-semiconductor.
Ukulethwa kwe-Foundry: Ukuthutha ama-wafers aqediwe kusuka ku-fab kuya kumakhasimende noma indawo yokupakisha.
I-OEM/OSAT Logistics: Ezinqubweni zokupakisha nokuhlola ezinikezwa ngaphandle.
Isitoreji ne-Warehousing yenkampani yangaphandle: Vikela isitoreji sesikhathi eside noma sesikhashana samawafa abalulekile.
Ukudluliswa Kwe-Wafer Yangaphakathi: Kumakhampasi amakhulu lapho amamojula okukhiqiza akude axhunywe khona nge-AMHS noma ngezokuthutha mathupha.

Emisebenzini ye-global supply chain, ama-FOSB asephenduke indinganiso yezokuthutha ze-wafer enenani eliphezulu, okuqinisekisa ukulethwa ngaphandle kokungcola kuwo wonke amazwekazi.

I-FOSB vs. FOUP – Uyini Umehluko?

Isici	I-FOSB (Ibhokisi Lokuthumela Elivula Ngaphambili)	I-FOUP (I-Front Opening Unified Pod)
Ukusetshenziswa Okuyinhloko	I-Inter-fab wafer shipping kanye nempahla	Ukudluliswa kwe-wafer ye-in-fab kanye nokucubungula okuzenzakalelayo
Isakhiwo	Isitsha esiqinile, esivalekile esinesivikelo esengeziwe	I-pod esebenziseka kabusha elungiselelwe ukuzenzekelayo kwangaphakathi
Ukungangenisi umoya	Ukusebenza kokubeka uphawu okuphezulu	Idizayinelwe ukufinyelela kalula, ukungena komoya kancane
Ukusebenzisa Imvamisa	Okumaphakathi (kugxile kwezokuthutha eziphephile zebanga elide)	Imvamisa ephezulu emigqeni yokukhiqiza ezenzakalelayo
Amandla we-wafer	Ngokuvamile ama-wafer angama-25 ebhokisini ngalinye	Ngokuvamile ama-wafers angama-25 nge-pod ngayinye
Ukusekela okuzenzakalelayo	Ihambisana nezivuli ze-FOSB	Kuhlanganiswe nezimbobo zokulayisha ze-FOUP
Ukuhambisana	I-SEMI E47, E62	I-SEMI E47, E62, E84, nokuningi

Yize zombili zisebenza izindima ezibalulekile ku-wafer logistics, ama-FOSB akhelwe inhloso yokuthutha okuqinile phakathi kwezingubo noma kumakhasimende angaphandle, kanti ama-FOUP agxile kakhulu ekusebenzeni kahle komugqa wokukhiqiza okuzenzakalelayo.

Imibuzo Evame Ukubuzwa (FAQ)

Q1: Ingabe ama-FOSB angasetshenziswa kabusha?
Yebo. Ama-FOSB ekhwalithi ephezulu adizayinelwe ukusetshenziswa ngokuphindaphindiwe futhi angamelana nenqwaba yemijikelezo yokuhlanza nokuphatha uma egcinwa kahle. Ukuhlanza njalo ngamathuluzi aqinisekisiwe kuyanconywa.

I-Q2: Ingabe ama-FOSB angenziwa ngokwezifiso ukuze afakwe uphawu noma ukulandelela?
Nakanjani. Ama-FOSB angenziwa ngendlela oyifisayo ngamalogo eklayenti, amathegi athile e-RFID, ukuvala uphawu okuvimbela umswakama, ngisho nokufakwa ikhodi kwemibala ehlukene ukuze kube lula ukuphatha izinto.

Q3: Ingabe ama-FOSB alungele izindawo ezihlanzekile?
Yebo. Ama-FOSB akhiqizwa ngamapulasitiki asezingeni elihlanzekile futhi avalwe ukuvimbela ukukhiqizwa kwezinhlayiyana. Afanele izindawo ezihlanzekile ze-Class 1 kuya ku-Class 1000 kanye nezindawo ezibalulekile ze-semiconductor.

Q4: Avulwa kanjani ama-FOSB ngesikhathi sokuzenzakalela?
Ama-FOSB ahambisana nezivuli ezikhethekile ze-FOSB ezisusa umnyango wangaphambili ngaphandle kokuthintana ngezandla, okugcina ubuqotho bezimo zegumbi elihlanzekile.

Mayelana NATHI

I-XKH igxile ekuthuthukisweni kobuchwepheshe obuphezulu, ukukhiqiza, nokudayiswa kwengilazi ekhethekile yokubona nezinto ezintsha zekristalu. Imikhiqizo yethu isebenza ngogesi obonakalayo, ugesi wabathengi, kanye nezempi. Sinikezela ngezinto ezibonakalayo ze-Sapphire, izembozo zamalensi omakhalekhukhwini, i-Ceramics, i-LT, i-Silicon Carbide SIC, i-Quartz, namawafa ekristalu e-semiconductor. Ngobungcweti abanamakhono nemishini esezingeni eliphezulu, sihamba phambili ekucutshungulweni komkhiqizo okungajwayelekile, sihlose ukuba yibhizinisi elihamba phambili le-optoelectronic materials high-tech.