Umshini Wokusika Izintambo Ezinthathu Zedayimane Wokusika Izinto Zengilazi Eziyi-Si Wafer/Optical
Isingeniso Somkhiqizo
Umshini wokusika insimbi eyodwa oneziteshi ezintathu zensimbi yedayimane uyimishini yokusika enembile kakhulu futhi esebenza kahle kakhulu eyenzelwe izinto eziqinile neziphuka kalula. Usebenzisa insimbi yedayimane njengendlela yokusika futhi ufanelekela ukucutshungulwa ngokunembile kwezinto ezinobulukhuni obuphezulu njenge-silicon wafers, i-sapphire, i-silicon carbide (SiC), izinto zobumba, kanye nengilazi ebonakalayo. Lo mshini, oklanywe ngezinsimbi ezintathu, uvumela ukusika ngasikhathi sinye izinto eziningi zokusebenza kudivayisi eyodwa, okuthuthukisa kakhulu ukusebenza kahle kokukhiqiza futhi kunciphisa izindleko zokukhiqiza.
Isimiso Sokusebenza
- Ukusikwa Kwentambo Yedayimane: Kusebenzisa intambo yedayimane eboshwe ngogesi noma eboshwe nge-resin ukwenza ukusika okusekelwe ekugayweni ngokunyakaza okusheshayo okuphindaphindayo.
- Ukusika Okuvumelanayo Kweziteshi Ezintathu: Kuhlonyiswe ngezindawo zokusebenza ezintathu ezizimele, okuvumela ukusika izingcezu ezintathu ngasikhathi sinye ukuthuthukisa ukusebenza.
- Ukulawula Ukucindezeleka: Kuhlanganisa uhlelo lokulawula ukucindezeleka olunembe kakhulu ukuze kugcinwe ukucindezeleka kwentambo yedayimane okuzinzile ngesikhathi sokusika, okuqinisekisa ukunemba.
- Uhlelo Lokupholisa Nokugcoba: Lusebenzisa amanzi angenawo ama-ion noma i-coolant ekhethekile ukunciphisa umonakalo wokushisa nokwandisa isikhathi sokuphila kwentambo yedayimane.

Izici Zemishini
- Ukusika Okunembe Kakhulu: Kufinyelela ukunemba kokusika okungu-±0.02mm, okulungele kakhulu ukucutshungulwa kwe-wafer encane kakhulu (isb., ama-wafer e-silicon e-photovoltaic, ama-wafer e-semiconductor).
- Ukusebenza Kahle Kakhulu: Umklamo weziteshi ezintathu wandisa umkhiqizo ngamaphesenti angaphezu kuka-200 uma kuqhathaniswa nemishini yesiteshi esisodwa.
- Ukulahleka Okuphansi Kwezinto Ezibalulekile: Umklamo we-kerf encane (0.1–0.2mm) unciphisa imfucuza yezinto ezisetshenzisiwe.
- Ukuzenzakalela Okuphezulu: Kufaka izinhlelo zokulayisha, ukuqondisa, ukusika, kanye nokulayisha ngokuzenzakalelayo, okunciphisa ukungenelela ngesandla.
- Ukuzivumelanisa Nezimo Okuphezulu: Iyakwazi ukusika izinto ezahlukahlukene eziqinile neziphuka kalula, okuhlanganisa i-monocrystalline silicon, i-polycrystalline silicon, i-sapphire, i-SiC, kanye ne-ceramics.
Izinzuzo Zobuchwepheshe
| Inzuzo
| Incazelo
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| Ukusika Okuvumelanayo Kweziteshi Eziningi
| Iziteshi ezintathu ezilawulwa ngokuzimela zivumela ukusika izingxenye zokusebenza ezinobukhulu noma izinto ezahlukene, okuthuthukisa ukusetshenziswa kwemishini.
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| Ukulawula Ukucindezeleka Okuhlakaniphile
| Ukulawula okuvaliwe okunama-servo motors kanye nezinzwa kuqinisekisa ukucindezeleka kwentambo okuqhubekayo, okuvimbela ukuphuka noma ukuphambuka kokusika.
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| Isakhiwo Esiqinile Kakhulu
| Iziqondiso eziqondile eziqondile kanye nezinhlelo eziqhutshwa yi-servo ziqinisekisa ukusika okuzinzile futhi zinciphisa imiphumela yokudlidliza.
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| Ukusebenza Kahle Kwamandla Nobungani Nemvelo
| Uma kuqhathaniswa nokusika udaka kwendabuko, ukusika ucingo lwedayimane akungcolisi, futhi isibandisi singaphinde sisetshenziswe, kunciphisa izindleko zokwelashwa kwemfucuza.
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| Ukuqapha Okuhlakaniphile
| Ifakwe i-PLC kanye nezinhlelo zokulawula isikrini sokuthinta ukuze kuqashwe isivinini sokusika ngesikhathi sangempela, ukucindezeleka, izinga lokushisa, kanye nezinye izinhlaka, okusekela ukulandelelwa kwedatha. |
Ukucaciswa Kobuchwepheshe
| Imodeli | Umshini wokusika idayimane elilodwa lesiteshi ezintathu |
| Usayizi omkhulu womsebenzi | 600*600mm |
| Isivinini sokusebenza kwezintambo | 1000 (UMXUBE) m/min |
| Ububanzi bentambo yedayimane | 0.25-0.48mm |
| Umthamo wokugcina umugqa wesondo lokuhambisa | 20km |
| Ububanzi bokujiya kokusika | 0-600mm |
| Ukunemba kokusika | 0.01mm |
| Ukuphakama okuqondile kwesiteshi sokusebenza | 800mm |
| Indlela yokusika | Izinto zokwakha aziguquki, futhi ucingo lwedayimane luyanyakaza futhi lwehle |
| Isivinini sokuphakelwa kokusika | 0.01-10mm/min (Ngokusho kwezinto kanye nobukhulu) |
| Ithangi lamanzi | 150L |
| Uketshezi lokusika | Uketshezi lokusika olusebenza kahle kakhulu olulwa nokugqwala |
| I-engeli yokujika | ±10° |
| Isivinini sokujika | 25°/s |
| Ukucindezeleka okukhulu kokusika | 88.0N (Setha ubuncane beyunithi0.1n) |
| Ukujula kokusika | 200~600mm |
| Yenza amapuleti okuxhuma ahambisanayo ngokwebanga lokusika lekhasimende | - |
| Indawo yokusebenza | 3 |
| Ukunikezwa kwamandla kagesi | Intambo yesigaba sesihlanu ye-AC380V/50Hz |
| Amandla aphelele ethuluzi lomshini | ≤32kw |
| Injini eyinhloko | 1*2kw |
| Injini yokuxhuma izintambo | 1*2kw |
| Injini yokushintshashintsha yebhentshi lomsebenzi | 0.4*6kw |
| Injini yokulawula ukucindezeleka | 4.4*2kw |
| Injini yokukhulula nokuqoqa izintambo | 5.5*2kw |
| Ubukhulu bangaphandle (ngaphandle kwebhokisi lengalo ye-rocker) | 4859*2190*2184mm |
| Ubukhulu bangaphandle (kufaka phakathi ibhokisi lengalo ye-rocker) | 4859*2190*2184mm |
| Isisindo somshini | 3600ka |
Izinkambu Zohlelo Lokusebenza
- Imboni ye-Photovoltaic: Ukusikwa kwezingodo ze-silicon ze-monocrystalline kanye ne-polycrystalline ukuze kuthuthukiswe isivuno se-wafer.
- Imboni Yezikhombisi-ndlela: Ukusikwa okunembile kwama-wafer e-SiC ne-GaN.
- Imboni ye-LED: Ukusika izisekelo ze-sapphire zokukhiqiza ama-chip e-LED.
- I-Ceramics Ethuthukisiwe: Ukwakha nokusika i-ceramics esebenza kahle njenge-alumina ne-silicon nitride.
- Ingilazi Ebonakalayo: Ukucubungula kahle ingilazi encane kakhulu yamalensi ekhamera namafasitela e-infrared.











