Umshini Wokusika we-Diamond Wire Weziteshi Ezintathu Osebenzisa Intambo Eyodwa ye-Si Wafer/Optical Glass Cutting Material Cutting

Umshini Wokusika Wezintambo Ezintathu Weziteshi Ezintathu We-Si Wafer/Optical Glass Material Cutting Isithombe Esifakiwe

Incazelo emfushane:

Umshini Wokusika we-Diamond Wire we-Three-Station Single-Wire iyidivayisi yokucubungula enembayo eyakhelwe isikwele esisebenzayo sezinto eziphukayo njengesafire, i-jade, nezitsha zobumba. Isebenzisa izintambo zensimbi ezinamekwe ngedayimane eziqhubekayo njengendawo yokusika, enezindawo zokusebenza ezintathu ezihlukene ezizimele ezivumela ukusika okuvunyelanisiwe, ukuphakela izintambo/ukunyakazisa, nokulawula ukushuba. Ama-Servo motors ashayela ukunyakaza okuphindaphindayo kwentambo, kuyilapho isistimu yempendulo yeluphu evaliwe ilungisa ngokuguqukayo ukungezwani (±0.5N ukunemba), ukunciphisa ukusetshenziswa kwentambo (<0.1%) nokuqinisekisa ukuzinza kwenqubo. Indawo yokusika ihlukanisiwe ngokoqobo nendawo yokusebenza, ifaka isixhumi esibonakalayo esivulekile sokufinyelela ukuze kushintshwe izintambo ngokushesha (ubude obukhulu ≤150m) nokusevisa ingxenye (isb., amasondo omhlahlandlela, ama-pulleys adonsayo). Ukucaciswa okubalulekile kuhlanganisa usayizi wengcezu yokusebenza engu-600×600mm, isivinini sokusika esingu-400-1200mm/h, umthamo wogqinsi ongu-0-800mm, namandla esewonke ≤23kW, okuyenza ilungele ukusika okunemba okuphezulu kwama-semiconductor substrates, amakristalu okukhanya, nezinto ezintsha zamandla.

Thumela i-imeyili kithi

Izici

Isingeniso Somkhiqizo

Umshini wokusika we-diamond wire-three-station single-wire cutting umshini wokusika onembile futhi osebenza kahle kakhulu owenzelwe izinto eziqinile neziqinile. Isebenzisa intambo yedayimane njengendawo yokusika futhi ilungele ukucutshungulwa okunembayo kwezinto ezinobulukhuni obuphakeme njengama-silicon wafers, isafire, i-silicon carbide (SiC), i-ceramics, nengilazi yokubona. Ihambisana nomklamo weziteshi ezintathu, lo mshini uvumela ukusika ngesikhathi esisodwa kwezinto zokusebenza eziningi kudivayisi eyodwa, uthuthukise kakhulu ukusebenza kahle kokukhiqiza nokunciphisa izindleko zokukhiqiza.

Isimiso Sokusebenza

I-Diamond Wire Cutting: Isebenzisa intambo yedayimane ene-electroplated noma ene-resin ukwenza ukusika okusekelwe ekugayeni ngokunyakaza okuphindaphindayo kwesivinini esikhulu.
I-Three-Station Synchronous Cutting: Ifakwe izindawo zokusebenza ezintathu ezizimele, okuvumela ukusika ngesikhathi esisodwa kwezingcezu ezintathu ukuthuthukisa ukuphuma.
Ukulawula Ukuqina: Kuhlanganisa isistimu yokulawula ukungezwani okunembayo okuphezulu ukuze kugcinwe ukudonsa kwentambo yedayimane ezinzile ngesikhathi sokusika, iqinisekisa ukunemba.
Isistimu Yokupholisa Nokugcobisa: Iqasha amanzi enziwe i-deioned noma isipholisi esikhethekile ukuze kuncishiswe umonakalo oshisayo futhi kunwetshwe ukuphila kwezintambo zedayimane.

Izici zezisetshenziswa

Ukusika Okunembe Kakhulu: Kufeza ukunemba kokusika okungu-±0.02mm, kulungele ukucutshungulwa kwe-wafer encane kakhulu (isb., amawafa e-silicon e-photovoltaic, amawafa we-semiconductor).
Ukusebenza Okuphakeme Kakhulu: Idizayini yeziteshi ezintathu inyusa ukukhiqiza ngaphezulu kwama-200% uma kuqhathaniswa nemishini yesiteshi esisodwa.
Ukulahleka Kwezinto Eziphansi: Idizayini ye-kerf emincane (0.1–0.2mm) inciphisa ukumosheka kwezinto.
I-Automation Ephakeme: Ifaka phakathi ukulayishwa okuzenzakalelayo, ukuqondanisa, ukusika, nokuthulula amasistimu, ukunciphisa ukungenelela okwenziwa ngesandla.
Ukuguquguquka Okuphezulu: Iyakwazi ukusika izinto ezihlukahlukene eziqinile neziphukayo, okuhlanganisa i-silicon ye-monocrystalline, i-polycrystalline silicon, isafire, i-SiC, nezitsha zobumba.

Izinzuzo Zobuchwepheshe

Inzuzo

Incazelo

I-Multi-Station Synchronous Cutting

Iziteshi ezintathu ezilawulwa ngokuzimela zinika amandla ukusika ama-workpiece anobukhulu obuhlukile noma izinto zokwakha, ukuthuthukisa ukusetshenziswa kwemishini.

Intelligent Tension Control

Ukulawulwa kwe-loop evaliwe ngama-servo motors kanye nezinzwa kuqinisekisa ukudonsa okungaguquki kwezintambo, ukuvimbela ukuphuka noma ukusika ukuchezuka.

High-Rigidity Isakhiwo

Imihlahlandlela yomugqa enembayo ephezulu nezinhlelo ezishayelwa yi-servo ziqinisekisa ukusika okuzinzile futhi kunciphise imiphumela yokudlidliza.

Ukusebenza kahle kwamandla kanye ne-Eco-Friendliness

Uma kuqhathaniswa nokusikwa kwe-slurry evamile, ukusika izintambo zedayimane akungcolisi, futhi into epholile ingagaywa kabusha, kwehlise izindleko zokuhlanza imfucuza.

Intelligent Monitoring

Ifakwe i-PLC kanye nezinhlelo zokulawula isikrini esithintwayo zokuqapha ngesikhathi sangempela isivinini sokusika, ukushuba, izinga lokushisa, nezinye izinhlaka, ezisekela ukulandelelwa kwedatha.

Ukucaciswa Kwezobuchwepheshe

Imodeli	Umshini wokusika umugqa owodwa wedayimane wesiteshi ezintathu
Ubukhulu bosayizi wocezu lokusebenza	600*600mm
Isivinini sokugijima kwentambo	1000 (MIX) m/min
Idayimane yentambo yedayimane	0.25-0.48mm
Umthamo wokugcina ulayini wesondo lokunikezela	20km
Ukusika ububanzi ububanzi	0-600mm
Ukusika ukunemba	0.01mm
I-stroke yokuphakamisa eqondile yendawo yokusebenza	800mm
Indlela yokusika	Impahla imile, futhi ucingo lwedayimane luyanyakaza lwehle
Ukusika isivinini sokuphakelayo	0.01-10mm/min (Ngokwezinto ezibonakalayo nokuqina)
Ithangi lamanzi	150L
Ukusika uketshezi	Uketshezi olunqamula ukugqwala olusebenza kahle kakhulu
Swing angle	±10°
Isivinini sokushwiba	25°/s
Ukucindezela okukhulu kokusika	88.0N (Setha ubuncane beyunithi0.1n)
Ukujula kokusika	200 ~ 600mm
Yenza amapuleti ahambisanayo ahambisanayo ngokwebanga lokusika lekhasimende	-
Indawo yokusebenza	3
Ukunikezwa kwamandla kagesi	Izigaba ezintathu zezintambo ze-AC380V/50Hz
Amandla aphelele wethuluzi lomshini	≤32kw
Injini eyinhloko	1*2kw
I-Wiring motor	1*2kw
I-workbench swing motor	0.4*6kw
I-tension control motor	4.4*2kw
Ukukhishwa kwentambo kanye nemoto yokuqoqa	5.5*2kw
Ubukhulu bangaphandle (ngaphandle kwebhokisi lengalo ye-rocker)	485921902184mm
Ubukhulu bangaphandle (kuhlanganise nebhokisi lengalo ye-rocker)	485921902184mm
Isisindo somshini	3600ka

Izinkambu Zokusebenza

Imboni ye-Photovoltaic: Ukusika ingots ye-silicon ye-monocrystalline ne-polycrystalline ukuze kuthuthukiswe isivuno se-wafer.
Imboni ye-Semiconductor: Ukusikwa ngokunemba kwama-wafers we-SiC ne-GaN.
Imboni ye-LED: Ukusika ama-sapphire substrates okukhiqiza ama-chip e-LED.
I-Ceramics Ethuthukisiwe: Ukwakha nokusika izitsha zobumba ezisebenza kahle njenge-alumina ne-silicon nitride.
I-Optical Glass: Ukucutshungulwa okunembayo kwengilazi ezacile kakhulu yamalensi ekhamera namafasitela e-infrared.