I-Copper substrate ikristalu eyodwa ye-Cu wafer 5x5x0.5/1mm 10x10x0.5/1mm 20x20x0.5/1mm

Incazelo emfushane:

Ama-substrates ethu ethusi nama-wafers enziwe ngethusi elihlanzekile kakhulu (99.99%) elinesakhiwo sekristalu esisodwa, esihlinzeka ngokusebenza okuhle kakhulu kukagesi nokushisayo. Lawa mawafa atholakala ku-cubic orientation ye-<100>, <110>, ne-<111>, okuwenza alungele izinhlelo zokusebenza ezisebenza kahle kakhulu ngogesi kanye nokukhiqizwa kwe-semiconductor. Ngobukhulu obungu-5×5×0.5 mm, 10×10×1 mm, kanye no-20×20×1 mm, ama-substrates ethu ethusi angenziwa ngokwezifiso ukuze ahlangabezane nezidingo zobuchwepheshe ezihlukahlukene. Ipharamitha ye-lattice yalawa mawafa ekristalu eyodwa ingu-3.607 Å, eqinisekisa ubuqotho obunembayo bokwakhiwa kwedivayisi ethuthukisiwe. Izinketho ezingaphezulu zifaka ukupholishwa kohlangothi olulodwa (SSP) kanye nokupholishwa okuphindwe kabili (i-DSP), okuhlinzeka ngokuguquguquka kwezinqubo ezihlukahlukene zokukhiqiza.

Thumela i-imeyili kithi

Imininingwane Yomkhiqizo

Omaka bomkhiqizo

Ukucaciswa

Ngenxa yokumelana nokushisa okuphezulu nokuqina kwemishini, ama-substrates ethusi asetshenziswa kabanzi kuma-microelectronics, izinhlelo zokuqothula ukushisa kanye nobuchwepheshe bokugcina amandla, lapho ukuphathwa okushisayo nokuthembeka kubaluleke kakhulu. Lezi zakhiwo zenza ama-copper substrates abe yinto esemqoka ezinhlelweni eziningi zobuchwepheshe obuphambili.
Lezi ezinye zezici ze-copper single crystal substrate:I-conductivity kagesi enhle kakhulu, i-conductivity yesibili kunesiliva. I-thermal conductivity inhle kakhulu, futhi i-thermal conductivity ihamba phambili phakathi kwezinsimbi ezivamile. Ukusebenza kahle kokucubungula, kungenza ubuchwepheshe obuhlukahlukene bokucutshungulwa kwe-metallurgical.Ukumelana nokubola kuhle, kodwa ezinye izinyathelo zokuzivikela zisadingeka.Izindleko ezilinganiselwe ziphansi, futhi intengo iyonga kakhulu ezintweni ze-metal substrate.
I-Copper substrate isetshenziswa kabanzi ezimbonini ezahlukahlukene ngenxa ye-conductivity yayo kagesi enhle kakhulu, ukuqhutshwa kwe-thermal namandla emishini. Okulandelayo yizicelo eziyinhloko ze-copper substrate:
1. Ibhodi lesifunda se-elekthronikhi: i-copper foil substrate material njengebhodi lesifunda eliphrintiwe (PCB). Isetshenziselwa ibhodi lesifunda le-high density interconnect, ibhodi lesifunda eliguquguqukayo, njll. Ine-conductivity enhle kanye nezindawo zokushisa ukushisa futhi ifaneleka kumadivayisi anamandla kagesi aphezulu.

2. Izinhlelo zokusebenza zokuphatha ezishisayo: isetshenziswa njenge-substrate yokupholisa izibani ze-LED, amandla kagesi, njll. Khiqiza ama-heaters ahlukahlukene, ama-radiator nezinye izingxenye zokulawula ukushisa. I-thermal conductivity enhle kakhulu yethusi isetshenziselwa ukuqhuba nokukhipha ukushisa ngokuphumelelayo.

3. Uhlelo lokusebenza lokuvikela i-electromagnetic: njengegobolondo ledivayisi ye-elekthronikhi kanye nongqimba oluvikelayo, ukuhlinzeka ngokuvikela okusebenzayo kozibuthe. Isetshenziselwa omakhalekhukhwini, amakhompyutha kanye neminye imikhiqizo ye-elekthronikhi yegobolondo lensimbi kanye nongqimba oluvikelayo lwangaphakathi. Ngokusebenza okuhle kokuvikela i-electromagnetic, kungavimba ukuphazamiseka kwe-electromagnetic.

4.Ezinye izinhlelo zokusebenza: njenge-conductive circuit material yokwakha amasistimu kagesi. Isetshenziswa ekwenzeni izinto zikagesi ezahlukahlukene, amamotho, ama-transformer nezinye izakhi zikagesi. Njengempahla yokuhlobisa, sebenzisa izakhiwo zayo ezinhle zokucubungula.

Singakwazi ukwenza ngokwezifiso ukucaciswa okuhlukahlukene, ubukhulu kanye nokwakheka kwe-Copper Single crystal substrate ngokuya ngezidingo ezithile zamakhasimende.

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