I-Bionic non-slip pad wafer ephethe i-vacuum sucker i-friction pad sucker
Izici zephedi ye-Bionic anti-slip:
• Ukusetshenziswa kwezinto ezikhethekile zobunjiniyela be-elastomer, ukuze kungabikho zinsalela, umphumela ohlanzekile wokulwa nokushwibeka ongenakungcola, ofanele izidingo zemvelo yokukhiqiza i-semiconductor.
• Ngokuklanywa kwe-array yesakhiwo se-micro-nano ngokunemba, ukulawula okuhlakaniphile kwezici zokungqubuzana kobuso, ngenkathi kugcinwa i-coefficient ephezulu yokungqubuzana ngenkathi kufinyelela ukunamathela okuphansi kakhulu.
• Umklamo oyingqayizivele we-interface mechanics wenza kube nokusebenza okuhle kakhulu kokubili ukungqubuzana okuphezulu kwe-tangential (μ>2.5) kanye nokunamathela okuphansi okujwayelekile (<0.1N/cm²).
• Izinto ze-polymer ezenzelwe imboni ye-semiconductor, ezifeza ukusebenza okuzinzile ngaphandle kokunciphisa ukusetshenziswa kabusha okungu-100,000 ngokusebenzisa ubuchwepheshe bokukhiqiza obuncane nobuncane.
Isicelo sephedi yokulwa nokushelela se-Bionic:
(1) Imboni yama-semiconductor
1. Ukukhiqiza i-wafer:
· Ukungasheleli ngesikhathi sokudluliselwa kwama-wafer amancane kakhulu angafika kuma-intshi angu-50-300 (50-300μm)
· Ukulungiswa okunembile kwesithwali se-wafer somshini we-lithography
· I-wafer engasheleli yemishini yokuhlola
2. Ukuhlolwa kwephakheji:
· Ukufakwa okungabhubhisi amadivayisi kagesi e-silicon carbide/gallium nitride
· I-bafa evimbela ukushelela ngesikhathi sokufakwa kwe-chip
· Hlola ukumelana kokushaqeka nokushelela kwetafula le-probe
(2) Imboni ye-Photovoltaic
1. Ukucutshungulwa kwe-silicon wafer:
· Ukungasheleli ngesikhathi sokusika induku ye-silicon e-monocrystalline
· I-wafer ye-silicon encane kakhulu (<150μm) engasheleli
· Ukubekwa kwe-silicon wafer yomshini wokuphrinta isikrini
2. Ukuhlanganiswa kwezingxenye:
· Ingilazi engemuva engasheleli ene-laminate
· Ukubekwa kohlaka endaweni efanele
· Ibhokisi lokubopha lilungisiwe
(3) imboni ye-photoelectric
1. Iphaneli yokubonisa:
· Inqubo ye-substrate yengilazi ye-OLED/LCD engasheleli
· Ukubekwa okunembile kokulingana kwe-polarizer
· Imishini yokuhlola engashaqeki futhi engashibiliki
2. Izingxenye ezibonakalayo:
· Ukuhlanganiswa kwemojula yelensi akusheleli
· Ukufakwa kwe-Prism/isibuko
· Uhlelo lwe-laser optical oluvikela ukushaqeka
(4) Amathuluzi okunemba
1. Ipulatifomu enembile yomshini we-lithography ayisheleli
2. Ithebula lokulinganisa lemishini yokuthola alikwazi ukushaqeka
3. Imishini ezenzakalelayo ingalo yomshini engasheleli
Idatha yobuchwepheshe:
| Ukwakheka kwezinto: | C, O, Si |
| Ukuqina kogu (A): | 50~55 |
| I-coefficient yokutakula enwebekayo: | 1.28 |
| Izinga lokushisa eliphezulu lokubekezelelana: | 260℃ |
| I-coefficient yokungqubuzana: | 1.8 |
| Ukumelana ne-PLASMA: | Ukubekezelelana |
Izinsizakalo ze-XKH:
I-XKH inikeza izinsizakalo zokwenza ngokwezifiso i-bionic anti-slip mat full process, okuhlanganisa ukuhlaziywa kwesidingo, ukwakheka kwesikimu, ukuqinisekiswa okusheshayo kanye nokusekelwa kokukhiqiza ngobuningi. Ithembele kubuchwepheshe bokukhiqiza obuncane nobuncane, i-XKH inikeza izixazululo zobungcweti zokulwa nokushelela zezimboni ze-semiconductor, i-photovoltaic kanye ne-photoelectric, futhi isize amakhasimende ngempumelelo ukufeza imiphumela ebalulekile njengokunciphisa izinga lemfucuza ku-0.005% kanye nokwanda kwesivuno ngo-15%.
Umdwebo Oningiliziwe









