Iwafa yephedi engasheleli ye-bionic ephethe i-vacuum sucker friction pad sucker

I-wafer yephedi engasheleli ye-bionic ephethe i-vacuum sucker friction pad sucker Isithombe Esifakiwe

Incazelo emfushane:

I-Bionic anti-slip mat iwumkhiqizo osebenza kahle kakhulu wokulwa nokushelela othuthukiswe ngokusekelwe kumgomo we-bionics. Ilungiswa ngokusebenzisa ubuchwepheshe obuthuthukisiwe bokukhiqiza obuncane kanye ne-nano ngokulingisa izici ezincane zezakhiwo zebhayoloji njengezinyawo zesigcilikisha kanye nama-octopus suckers. Lo mkhiqizo unqamula imikhawulo yobuchwepheshe yezinto ezivamile ezingasheleli, futhi ubona imisebenzi ephumelelayo njengokunamathela okunganamatheli, okusebenziseka kabusha, kanye nokuguquguquka kwemvelo. Njengesizukulwane esisha sezixazululo ezihlakaniphile zokulwa nokushelela, ihlanganisa kahle imiphumela emisha yesayensi yezinto ezibonakalayo, ubunjiniyela bomhlaba kanye nomklamo wemishini, futhi ikhombisa inani elihle kakhulu lesicelo ekukhiqizeni izimboni, imishini yezokwelapha, ugesi wabathengi neminye imikhakha.

Thumela i-imeyili kithi

Imininingwane Yomkhiqizo

Omaka bomkhiqizo

Izici ze-Bionic anti-slip pad:

• Ukusetshenziswa kobunjiniyela obukhethekile bezinto ezihlanganisiwe ze-elastomer, ukuze kungabi nazinsalela, umphumela ohlanzekile wokulwa nokushushuluza ongenakungcola, olungele izidingo zemvelo yokukhiqiza i-semiconductor.

• Ngokunemba kwe-micro-nano structure array design, ukulawula okuhlakaniphile kwezici zokungqubuzana kwendawo, kuyilapho kugcinwa i-coefficient ephezulu yokungqubuzana kuyilapho kuzuzwa ukunamathela okuphansi kakhulu.

• Idizayini yemishini yokusetshenziswa kubonwa inika amandla ukusebenza okuhle kakhulu kwakho kokubili ukungqubuzana okuphezulu kwe-tangential (μ>2.5) nokunamathela okujwayelekile okuphansi (<0.1N/cm²).

• Izinto ze-polymer ezithuthukiswe ngokukhethekile imboni ye-semiconductor, efinyelela ukusebenza okuzinzile ngaphandle kokuncishiswa kokuphinda kusetshenziswe okungu-100,000 ngobuchwepheshe bokukhiqiza obuncane kanye ne-nano.

Isicelo se-Bionic anti-slip pad:

(1) Imboni ye-semiconductor
1. Ukwenziwa kwe-wafer:
· Ukuma okungasheleli ngesikhathi sokudlulisa amawafa amancane kakhulu afika kumayintshi angu-12 (50-300μm)
· Ukulungiswa okunembile kwesithwali esilucwecwana somshini we-lithography
· I-wafer non-slip liner yemishini yokuhlola

2. Ukuhlolwa kwephakheji:
· Ukulungiswa okungabhubhisi kwamadivayisi wamandla we-silicon carbide/gallium nitride
· Isibavi se-anti-slip ngesikhathi sokufakwa kwe-chip
· Hlola ukushaqeka nokushelela kwetafula lokuhlola

(2) Imboni ye-Photovoltaic
1. I-Silicon wafer processing:
· Ukulungiswa okungasheleli ngesikhathi sokusika induku ye-silicon ye-monocrystalline
· Iwafa ye-silicon encane kakhulu (<150μm) engasheleli
· I-Silicon wafer positioning yomshini wokuphrinta isikrini

2. Ukuhlanganiswa kwengxenye:
· Indiza yangemuva yengilazi elaminethiwe ngokungasheleli
· Ukubekwa kozimele
· Ibhokisi lokubopha lilungisiwe

(3) imboni yezithombe zikagesi
1. Iphaneli yokubonisa:
· Inqubo engasheleli yengilazi ye-OLED/LCD
· Ukuma okunembile kokulingana kwe-polarizer
· Imishini yokuhlola i-Shock-proof kanye ne-skid-proof

2. Izingxenye ze-Optical:
· Ukuhlanganisa imojuli yelensi ngokungasheleli
· Ukulungiswa kweprism/isibuko
· Uhlelo lwe-laser optical olushaqisayo

(4) Amathuluzi anembile
1. Inkundla yokunemba yomshini we-lithography iphikisana nokushelela
2. Ithebula lokulinganisa lemishini yokuhlonza alikwazi ukushaqeka
3. Imishini ezenzakalelayo ingalo engasheleli

Idatha yobuchwepheshe:

Ukwakheka kwezinto:	C, O, Si
Ukuqina kogu (A) :	50 ~ 55
I-Elastic recovery coefficient:	1.28
Izinga lokushisa eliphezulu lokubekezelela:	260℃
I-friction coefficient:	1.8
Ukumelana ne-PLASMA:	Ukubekezelelana

Izinsizakalo ze-XKH:

I-XKH ihlinzeka ngezinsizakalo ezigcwele zenqubo yokwenza ngokwezifiso umata we-bionic anti-slip, okuhlanganisa ukuhlaziywa kwesidingo, ukwakheka kwesikimu, ukuqinisekisa okusheshayo nokusekelwa kokukhiqiza ngobuningi. Ithembele kubuchwepheshe bokukhiqiza i-micro kanye ne-nano, i-XKH inikeza izixazululo ezichwepheshile zokulwa nokushelela kwezimboni ze-semiconductor, photovoltaic kanye ne-photoelectric, futhi isize ngempumelelo amakhasimende ukuba afinyelele imiphumela ebalulekile efana nokwehliswa kwezinga lemfucumfucu ukuya ku-0.005% kanye nokwenyuka kwesivuno ngo-15%.