Umshini Wokugaya Oqondile Ohlangothini Olubili we-SiC Sapphire Si wafer
Umdwebo Oningiliziwe
Isingeniso Semishini Yokugaya Eqondile Ezinhlangothini Ezimbili
Imishini yokugaya ngokunemba okuphindwe kabili iyithuluzi lomshini elithuthukisiwe elenzelwe ukucubungula ngokuhambisanayo kokubili ubuso bomsebenzi. Inikeza ukuthamba okuphezulu kanye nokushelela kobuso ngokugaya ubuso obuphezulu nobangaphansi ngasikhathi sinye. Lobu buchwepheshe bufaneleka kakhulu kwi-spectrum yezinto ezibanzi, ezimboza izinsimbi (insimbi engagqwali, i-titanium, ama-aluminium alloys), okungezona izinsimbi (i-ceramics yobuchwepheshe, ingilazi ebonakalayo), kanye nama-polymer obunjiniyela. Ngenxa yesenzo sayo sobuso obuphindwe kabili, uhlelo lufinyelela ukufana okuhle kakhulu (≤0.002 mm) kanye nokungaguquguquki kobuso obuhle kakhulu (Ra ≤0.1 μm), okwenza lube yinto ebalulekile kubunjiniyela bezimoto, kuma-microelectronics, kuma-precision bearings, e-aerospace, kanye nasekukhiqizeni okubonakalayo.
Uma kuqhathaniswa nama-grinder ahlangothi olulodwa, lolu hlelo olunezinhlangothi ezimbili lunikeza amandla aphezulu okusebenzisa kanye namaphutha okusetha ancishisiwe, njengoba ukunemba kokubopha kuqinisekiswa yinqubo yokugaya ngasikhathi sinye. Ngokuhambisana namamojula azenzakalelayo njengokulayisha/ukukhipha ilobhothi, ukulawulwa kwamandla okuvala, kanye nokuhlolwa kobukhulu be-inthanethi, imishini ihlangana kalula nezimboni ezihlakaniphile kanye nezindawo zokukhiqiza ezinkulu.
Idatha Yobuchwepheshe — Imishini Yokugaya Eqondile Ezinhlangothini Ezimbili
| Into | Imininingwane | Into | Imininingwane |
|---|---|---|---|
| Usayizi wepuleti lokugaya | φ700 × 50 mm | Ingcindezi ephezulu | 1000 kgf |
| Ubukhulu benkampani yenethiwekhi | φ238 mm | Isivinini sepuleti eliphezulu | ≤160 ngomzuzu |
| Inombolo yenkampani yenethiwekhi | 6 | Isivinini sepuleti esiphansi | ≤160 ngomzuzu |
| Ubukhulu bomsebenzi | ≤75 mm | Ukujikeleza kwesondo lelanga | ≤85 ngomzuzu |
| Ububanzi bomsebenzi | ≤φ180 mm | I-engeli yengalo yokujika | 55° |
| Ukushaya kwesilinda | 150 mm | Isilinganiso samandla | 18.75 kW |
| Ukukhiqiza (φ50 mm) | 42 ama-pcs | Intambo yamandla | 3×16+2×10 mm² |
| Ukukhiqiza (φ100 mm) | 12 ama-pcs | Isidingo somoya | ≥0.4 MPa |
| Unyawo lomshini | 2200×2160×2600 mm | Isisindo sengqikithi | 6000 kg |
Indlela Umshini Osebenza Ngayo
1. Ukucubungula Amasondo Amabili
Amasondo amabili okugaya aphikisanayo (idayimane noma i-CBN) ajikeleza ngezindlela ezihlukile, esebenzisa ingcindezi efanayo phezu komsebenzi obanjwe ezithwalini zamaplanethi. Isenzo esiphindwe kabili sivumela ukususwa okusheshayo ngokulingana okuvelele.
2. Ukubeka Nokulawula
Izikulufu zebhola eziqondile, ama-servo motor, kanye neziqondiso eziqondile ziqinisekisa ukunemba kokubeka okungu-±0.001 mm. Ama-laser noma ama-optical gauges ahlanganisiwe alandelela ubukhulu ngesikhathi sangempela, okwenza kube nokwenzeka ukunxephezela okuzenzakalelayo.
3. Ukupholisa Nokuhlunga
Uhlelo loketshezi olunomfutho ophezulu lunciphisa ukuphambuka kokushisa futhi lususe udoti kahle. I-coolant ijikeleziswa kabusha ngokusebenzisa ukuhlunga okunezitezi eziningi okune-magnetic kanye ne-centrifugal, okwandisa impilo yamasondo kanye nekhwalithi yenqubo yokuzinzisa.
4. Ipulatifomu Yokulawula Ehlakaniphile
Ifakwe ama-Siemens/Mitsubishi PLC kanye ne-HMI yesikrini sokuthinta, uhlelo lokulawula luvumela isitoreji seresiphi, ukuqapha inqubo ngesikhathi sangempela, kanye nokuxilongwa kwamaphutha. Ama-algorithms aguquguqukayo alawula ngokuhlakanipha ingcindezi, isivinini sokujikeleza, kanye namazinga okuphakelayo ngokusekelwe ebulukhunini bezinto.

Ukusetshenziswa Komshini Wokugaya Oqondile Ohlangothini Olubili
Ukukhiqiza Izimoto
Iziphetho ze-crankshaft zemishini, amasongo e-piston, amagiya okudlulisa, afinyelela ku-≤0.005 mm parallelism kanye nobulukhuni bomphezulu Ra ≤0.2 μm.
I-semiconductor kanye ne-Electronics
Ukuncishiswa kwama-wafer e-silicon ukuze kufakwe i-3D IC ethuthukisiwe; ama-substrate e-ceramic ayagaywa ngokubekezelela ubukhulu obungu-±0.001 mm.
Ubunjiniyela Bokucacisa
Ukucutshungulwa kwezingxenye ze-hydraulic, izakhi zokuthwala, kanye nama-shim lapho kudingeka khona ukubekezelelana okungu-≤0.002 mm.
Izingxenye Zokukhanya
Ukuqedwa kwengilazi yesembozo se-smartphone (Ra ≤0.05 μm), ama-blank lens e-sapphire, kanye nama-substrate e-optical anokucindezeleka okuncane kwangaphakathi.
Izicelo Zezindiza
Umshini wokusika ama-tenons e-turbine e-superalloy, izingxenye zokufaka izinto zobumba, kanye nezingxenye zesakhiwo ezilula ezisetshenziswa kuma-satellite.

Izinzuzo Eziyinhloko Zomshini Wokugaya Oqondile Ohlangothini Olubili
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Ukwakhiwa Okuqinile
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Uhlaka lwensimbi oluqinile olunendlela yokwelapha yokuqeda ukucindezeleka lunikeza ukudlidliza okuphansi kanye nokuqina kwesikhathi eside.
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Amabheringi asezingeni elifanele kanye nezikulufo zebhola eziqinile kakhulu zithola ukuphindeka ngaphakathi0.003 mm.
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I-Interface Yomsebenzisi Ehlakaniphile
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Impendulo esheshayo ye-PLC (<1 ms).
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I-HMI yezilimi eziningi isekela ukuphathwa kweresiphi kanye nokuboniswa kwenqubo yedijithali.
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Iguquguquka futhi iyanwebeka
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Ukuhambisana kwe-modular nezingalo zerobhothi kanye nezinhlelo zokuhambisa kwenza ukusebenza ngaphandle komuntu kube lula.
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Yamukela amabhondi ahlukahlukene amasondo (i-resin, idayimane, i-CBN) okucubungula izinsimbi, izinto zobumba, noma izingxenye ezihlanganisiwe.
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Amandla Okucacisa Okuphezulu
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Ukulawulwa kwengcindezi ye-Closed-loop kuqinisekisaukunemba okungu-±1%.
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Amathuluzi anikezelwe avumela ukucutshungulwa kwezingxenye ezingezona ezejwayelekile, njengezimpande ze-turbine kanye nezingxenye zokuvala ngokunemba.
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Imibuzo Evame Ukubuzwa - Umshini Wokugaya Oqondile Ohlangothini Olubili
Q1: Yiziphi izinto ezingacutshungulwa yi-Double-Side Precision Grinding Machine?
A1: Umshini Wokugaya Oqondile Ohlangothini Olubili uyakwazi ukuphatha izinto eziningi ezahlukene, okuhlanganisa izinsimbi (insimbi engagqwali, i-titanium, ama-aluminium alloys), izinto zobumba, amapulasitiki obunjiniyela, kanye nengilazi ebonakalayo. Amasondo okugaya akhethekile (idayimane, i-CBN, noma i-resin bond) angakhethwa ngokusekelwe ezintweni zokusebenza.
Q2: Liyini izinga lokuchaneka komshini wokugaya oqondile ozinhlangothi zombili?
A2: Umshini ufinyelela ukufana okungu-≤0.002 mm kanye nobulukhuni bomphezulu obungu-Ra ≤0.1 μm. Ukunemba kokubeka kugcinwa ngaphakathi kuka-±0.001 mm ngenxa yezikulufo zebhola eziqhutshwa yi-servo kanye nezinhlelo zokulinganisa eziku-inthanethi.
Q3: Umshini Wokugaya Oqondile Ohlangothini Olubili uwuthuthukisa kanjani umkhiqizo uma uqhathaniswa nama-grinder ahlangothi olulodwa?
A3: Ngokungafani nemishini enohlangothi olulodwa, i-Double-Sided Precision Grinding Machine igaya ubuso bobubili bento yokusebenza ngesikhathi esisodwa. Lokhu kunciphisa isikhathi sokujikeleza, kunciphisa amaphutha okubopha, futhi kuthuthukisa kakhulu ukusebenza kwayo—okufanelekela imigqa yokukhiqiza ngobuningi.
Q4: Ingabe uMshini Wokugaya Oqondile Ohlangothini Olubili ungahlanganiswa nezinhlelo zokukhiqiza ezenzakalelayo?
A4: Yebo. Umshini uklanywe ngezinketho zokwenza izinto ngokuzenzakalela eziguquguqukayo, njengokulayisha/ukukhipha imithwalo ngamarobhothi, ukulawula ingcindezi okuvaliwe, kanye nokuhlolwa kobukhulu obusemugqeni, okwenza uhambisane ngokugcwele nezimo zefektri ezihlakaniphile.
Mayelana NATHI
I-XKH igxile ekuthuthukisweni kobuchwepheshe obuphezulu, ekukhiqizweni, nasekuthengisweni kwengilazi ekhethekile ye-optical kanye nezinto ezintsha zekristalu. Imikhiqizo yethu ihlinzeka nge-optical electronics, i-consumer electronics, kanye nezempi. Sinikeza izingxenye ze-optical ze-Sapphire, izembozo zelensi yeselula, i-Ceramics, i-LT, i-Silicon Carbide SIC, i-Quartz, kanye nama-semiconductor crystal wafers. Ngobuchwepheshe obunekhono kanye nemishini esezingeni eliphezulu, sihamba phambili ekucutshungulweni komkhiqizo okungewona ojwayelekile, sihlose ukuba yibhizinisi elihamba phambili lezinto ze-optoelectronic tech.









