I-12inch (300mm) Ibhokisi Lokuvula Elingaphambili Lokuvula Ibhokisi le-FOSB le-wafer carrier box 25pcs umthamo wokuphatha i-Wafer kanye nokuthumela Imisebenzi ezenzakalelayo

I-12inch (300mm) Ibhokisi Lokuvula Elingaphambili Lokuvula Ibhokisi le-FOSB le-wafer carrier box 25pcs umthamo wokuphatha nokuthumela i-Wafer Imisebenzi ezenzakalelayo Isithombe Esifakiwe

Incazelo emfushane:

I-12-inch (300mm) Front Opening Shipping Box (FOSB) iyisisombululo esithuthukisiwe senkampani ye-wafer eklanyelwe ukuhlangabezana namazinga aphezulu embonini yokukhiqiza i-semiconductor. Le FOSB yakhelwe ngokukhethekile ukuqinisekisa ukuphathwa okuphephile, ukugcinwa, kanye nokuthuthwa kwamawafa angama-300mm. Isakhiwo esiqinile, esihlanganiswe nokwakheka kwezinto ezihlanzekile kakhulu, ezikhipha umoya omncane, kunciphisa kakhulu ubungozi bokungcola kuyilapho kugcinwa ubuqotho be-wafer phakathi nezinyathelo zokucubungula ezibalulekile.

Amabhokisi e-FOSB abalulekile ezindaweni zesimanje ze-semiconductor lapho ukuphathwa kwe-wafer kumele kube okuzenzakalelayo, okunembayo, futhi kungangcoliswa. Leli bhokisi lenethiwekhi le-25-slot carrier lihlinzeka ngendawo ephumelelayo yokuthutha i-wafer, ukunciphisa ukucindezelwa komshini kanye nokuqinisekisa ukuma kwe-wafer okunembayo. Ngomklamo wokuvula wangaphambili, unikeza ukufinyelela okulula kukho kokubili ukusebenza okuzenzakalelayo nokubamba ngesandla uma kudingeka. Ibhokisi le-eFOSB lithobelana ngokugcwele namazinga embonini afana ne-SEMI/FIMS kanye ne-AMHS, okulenza lilungele ukusetshenziswa ezinhlelweni zokubamba izinto ezizenzakalelayo (AMHS) kuma-semiconductor nezindawo zokukhiqiza ezihlobene.

Thumela i-imeyili kithi

Imininingwane Yomkhiqizo

Omaka bomkhiqizo

Izici Eziyinhloko

Isici	Incazelo
Amandla we-wafer	25 izikhalaama-wafers angu-300mm, ahlinzeka ngesisombululo sokuminyana okuphezulu kwezokuthutha nokugcinwa kwe-wafer.
Ukuhambisana	NgokugcweleI-SEMI/FIMSfuthiI-AMHSukuthobela, ukuqinisekisa ukuhambisana nezinhlelo zokuphatha izinto ezizenzakalelayo ezindwangu ze-semiconductor.
Ukusebenza Okuzenzakalelayo	Idizayinelweukuphatha okuzenzakalelayo, ukunciphisa ukusebenzisana kwabantu kanye nokunciphisa izingozi zokungcola.
Inketho yokusingatha ngesandla	Inikeza ukuguquguquka kokufinyelela mathupha ezimweni ezidinga ukungenelela komuntu noma phakathi nezinqubo okungezona ezizenzakalelayo.
Ukubunjwa Kwezinto Ezibalulekile	Kwenziwe kusukaizinto ezihlanzekile kakhulu, ezikhipha umoya omncane, ukunciphisa ingozi yokukhiqizwa kwezinhlayiyana nokungcoliswa.
Isistimu yokugcinwa kwe-wafer	Okuthuthukileisistimu yokugcinwa kwe-waferinciphisa ubungozi bokunyakaza kwe-wafer ngesikhathi sokuthutha, iqinisekise ukuthi ama-wafers ahlala esendaweni evikelekile.
Inhlanzeko Design	Iklanyelwe ngokukhethekile ukunciphisa ubungozi bokukhiqizwa kwezinhlayiya nokungcoliswa, ukugcina amazinga aphezulu adingekayo ekukhiqizweni kwe-semiconductor.
Ukuqina namandla	Yakhiwe ngezinto eziqinile ukuze imelane nobunzima bezokuthutha ngenkathi igcina ubuqotho besakhiwo senkampani yenethiwekhi.
Ukwenza ngokwezifiso	Izipesheliizinketho ngokwezifisoosayizi abahlukahlukene be-wafer noma izidingo zokuthutha, okuvumela amaklayenti ukuthi alungise ibhokisi ngokwezidingo zawo.

Izici ezinemininingwane

25-Slot Umthamo 300mm Wafers
I-eFOSB wafer carrier yakhelwe ukuthwala ama-wafer afika ku-25 300mm, nendawo ngayinye ihlukaniswe ngokunembile ukuze kuqinisekiswe ukubekwa kwamawafa okuvikelekile. Idizayini ivumela ama-wafers ukuthi apakishwe kahle ngenkathi ivimbela ukuthintana phakathi kwama-wafer, ngaleyo ndlela kuncishiswe ubungozi bokuklwebheka, ukungcola, noma ukulimala komshini.

Ukuphatha Okuzenzakalelayo
Ibhokisi le-eFOSB lilungiselelwe ukusetshenziswa nezinhlelo zokubamba izinto ezizenzakalelayo (AMHS), ezisiza ukuqondisa ukunyakaza kwe-wafer nokwandisa ukuphuma ekukhiqizeni kwe-semiconductor. Ngokuzenzakalela inqubo, ubungozi obuhlobene nokuphathwa komuntu, njengokungcoliswa noma ukulimala, buncishiswa kakhulu. Idizayini yebhokisi le-eFOSB iqinisekisa ukuthi lingasingathwa ngokuzenzakalelayo kukho kokubili ukuma okuvundlile nokuma mpo, kube lula inqubo yokuthutha eshelelayo nethembekile.

Inketho yokusingatha ngesandla
Nakuba i-automation ibekwe phambili, ibhokisi le-eFOSB liphinde lihambisane nezinketho zokuphatha ngesandla. Lokhu kusebenza okumbaxambili kunenzuzo ezimeni lapho ukungenelela komuntu kuyadingeka, njengalapho uhambisa amawafa ezindaweni ezingenazo amasistimu azenzakalelayo noma ezimeni ezidinga ukunemba okwengeziwe noma ukunakekelwa.

Izinto Ezihlanzekile Kakhulu, Eziphuma Kancane Kancane
Izinto ezisetshenziswa ebhokisini le-eFOSB zikhethelwe ngokukhethekile izici zayo zokukhipha umoya eziphansi, ezivimbela ukukhishwa kwezinhlanganisela ezishintshashintshayo ezingase zingcolise amawafa. Ukwengeza, izinto ezisetshenziswayo zimelana kakhulu nezinhlayiya, okuyisici esibalulekile sokuvimbela ukungcola ngesikhathi sokuthuthwa kwe-wafer, ikakhulukazi ezindaweni lapho ukuhlanzeka kubaluleke kakhulu.

Ukuvimbela i-Particle Generation
Idizayini yebhokisi ihlanganisa izici ezihloselwe ngokukhethekile ukuvimbela ukukhiqizwa kwezinhlayiya ngesikhathi sokuphatha. Lokhu kuqinisekisa ukuthi ama-wafers ahlala engonakalisiwe, okubalulekile ekukhiqizeni ama-semiconductor lapho ngisho nezinhlayiya ezincane kakhulu zingabangela ukukhubazeka okukhulu.

Ukuqina Nokwethenjelwa
Ibhokisi le-eFOSB lenziwe ngezinto eziqinile ezingamelana nezingcindezi zezokuthutha, okuqinisekisa ukuthi ibhokisi ligcina ubuqotho balo besakhiwo ngokuhamba kwesikhathi. Lokhu kuqina kunciphisa isidingo sokushintshwa njalo, okwenza kube yisixazululo esingabizi kakhulu ngokuhamba kwesikhathi.

Izinketho zokwenza ngokwezifiso
Ukuqonda ukuthi wonke umugqa wokukhiqiza we-semiconductor ungase ube nezidingo ezihlukile, ibhokisi le-eFOSB wafer carrier linikeza izinketho zokwenza ngokwezifiso. Kungakhathaliseki ukuthi ilungisa inani lezikhala, ilungisa usayizi webhokisi, noma ihlanganisa izinto ezikhethekile, ibhokisi le-eFOSB lingenziwa ngendlela efanele ukuze lihlangabezane nezidingo ezithile zeklayenti.

Izinhlelo zokusebenza

I12-intshi (300mm) Ibhokisi Lokuvula Ngaphambili Lokuvula (eFOSB)yakhelwe ukusetshenziswa ezinhlobonhlobo zezinhlelo zokusebenza ngaphakathi kwemboni ye-semiconductor, okuhlanganisa:

Ukuphatha i-Semiconductor Wafer
Ibhokisi le-eFOSB lihlinzeka ngezindlela ezivikelekile nezisebenzayo zokuphatha amawafa angu-300mm phakathi nazo zonke izigaba zokukhiqiza, kusukela ekwenziweni kokuqala kuye ekuhlolweni nasekupakishweni. Inciphisa ubungozi bokungcola kanye nokulimala, okubalulekile ekwenziweni kwe-semiconductor lapho ukunemba nokuhlanzeka kubalulekile.

I-Wafer Storage
Ezindaweni zokukhiqiza ama-semiconductor, amawafa kufanele agcinwe ngaphansi kwezimo eziqinile ukuze agcine ubuqotho bawo. Inkampani yenethiwekhi ye-eFOSB iqinisekisa ukugcinwa okuphephile ngokunikeza indawo evikelekile, ehlanzekile, nezinzile, inciphisa ingozi yokuwohloka kwe-wafer ngesikhathi sokulondoloza.

Ezokuthutha
Ukuthutha ama-wafer we-semiconductor phakathi kwezindawo ezahlukene noma ngaphakathi kwendwangu kudinga ukupakishwa okuvikelekile ukuze kuvikelwe amawafa athambile. Ibhokisi le-eFOSB linikeza ukuvikeleka okuphelele ngesikhathi sokuthutha, liqinisekisa ukuthi ama-wafers afika alimale, agcina isivuno esiphezulu semikhiqizo.

Ukuhlanganiswa ne-AMHS
Ibhokisi le-eFOSB lilungele ukusetshenziswa ezindwangu zesimanje, ezizenzakalelayo ze-semiconductor, lapho ukuphathwa kwempahla kubalulekile. Ukuhambisana kwebhokisi ne-AMHS kusiza ukuhamba ngokushesha kwama-wafers ngaphakathi kwemigqa yokukhiqiza, kuthuthukisa ukukhiqiza nokunciphisa amaphutha okuphatha.

Amagama angukhiye e-FOSB Q&A

Q1: Yini eyenza ibhokisi le-eFOSB lilungele ukuphathwa kwe-wafer ekukhiqizeni ama-semiconductor?

A1:Ibhokisi le-eFOSB lenzelwe ngokukhethekile amawafa ama-semiconductor, ahlinzeka ngendawo evikelekile nezinzile yokuphatha, ukugcinwa, kanye nokuthutha. Ukuhambisana kwayo nezindinganiso ze-SEMI/FIMS kanye ne-AMHS kuqinisekisa ukuthi ihlanganisa ngaphandle komthungo nezinhlelo ezizenzakalelayo. Izinto zebhokisi ezihlanzeke kakhulu, ezikhipha umoya omncane kanye nesistimu yokugcinwa kwe-wafer inciphisa ubungozi bokungcola futhi iqinisekise ubuqotho be-wafer kuyo yonke inqubo.

Q2: Ibhokisi le-eFOSB likuvimba kanjani ukungcoliswa ngesikhathi sokuthutha nge-wafer?

A2:Ibhokisi le-eFOSB lenziwe ngezinto ezimelana nokukhipha umoya, elivimbela ukukhishwa kwezinhlanganisela ezishintshashintshayo ezingase zingcolise amawafa. Ukwakheka kwayo futhi kunciphisa ukukhiqizwa kwezinhlayiya, futhi uhlelo lokugcinwa kwe-wafer luvikela ama-wafers endaweni, lunciphise ubungozi bokulimala kwemishini kanye nokungcoliswa ngesikhathi sokuthutha.

I-Q3: Ingabe ibhokisi le-eFOSB lingasetshenziswa kuzo zombili izinhlelo ezenziwa ngesandla nezizenzakalelayo?

A3:Yebo, ibhokisi le-eFOSB linezinto eziningi futhi lingasetshenziswa kukho kokubiliamasistimu azenzakalelayokanye nezimo zokuphatha mathupha. Idizayinelwe ukuphatha okuzenzakalelayo ukunciphisa ukungenelela komuntu, kodwa futhi ivumela ukufinyelela mathupha uma kunesidingo.

Q4: Ingabe ibhokisi le-eFOSB lingenziwa ngendlela oyifisayo kumasayizi ama-wafer ahlukene?

A4:Yebo, ibhokisi le-eFOSB linikezaizinketho ngokwezifisoukwamukela osayizi abahlukene be-wafer, ukulungiselelwa kwesikhala, noma izidingo ezithile zokubamba, ukuqinisekisa ukuthi ihlangabezana nezidingo ezihlukile zemigqa yokukhiqiza ehlukahlukene ye-semiconductor.

Q5: Ibhokisi le-eFOSB likuthuthukisa kanjani ukuphatha kahle kwe-wafer?

A5:Ibhokisi le-eFOSB lithuthukisa ukusebenza kahle ngokunika amandlaimisebenzi ezenzakalelayo, ukunciphisa isidingo sokungenelela okwenziwa mathupha kanye nokwenza lula ukuthutha kwe-wafer ngaphakathi kwendwangu ye-semiconductor. Idizayini yayo iphinde iqinisekise ukuthi ama-wafers ahlala evikelekile, anciphisa amaphutha okuphatha futhi athuthukise ukusebenza kwawo wonke.

Isiphetho

I-12-inch (300mm) Front Opening Shipping Box (eFOSB) iyisixazululo esinokwethenjelwa nesisebenza kahle kakhulu sokuphatha iwafa, ukugcinwa, kanye nokuthutha ekukhiqizeni ama-semiconductor. Ngezici zayo ezithuthukisiwe, ukuthobela izindinganiso zomkhakha, kanye nokuguquguquka, ihlinzeka abakhiqizi be-semiconductor ngendlela ephumelelayo yokuvikela ubuqotho be-wafer nokwandisa ukusebenza kahle kokukhiqiza. Noma ngabe elokuphatha okuzenzakalelayo noma okuzenzela, ibhokisi le-eFOSB lihlangabezana nezidingo ezinzima zemboni ye-semiconductor, iqinisekisa ukuthuthwa kwe-wafer okungangcoli futhi okungenamonakalo kuzo zonke izigaba zenqubo yokukhiqiza.