Imishini Yokusika Izintambo Yezinto Ze-Sapphire/Ceramics/Marble Ekusikeni Okuqondile/Okuvundlile/Okwezintambo Eziningi

Imishini Yokusika Ngocingo Yezinto Ze-Sapphire/Ceramics/Marble Ekusikeni Okuqondile/Okuvundlile/Okwezintambo Eziningi Isithombe Esifakiwe

Incazelo emfushane:

Igama lepharamitha	Isikali sepharamitha
Amandla Emoto Eyinhloko	11KW – 75KW
Isivinini Sentambo	0 – 40(m/s)
Ubude Bentambo Ephakeme	20 – 150m
Ukunikezwa Kwamandla	Okujwayelekile: Isigaba Esithathu, 380V, 50Hz
Amandla Enjini Yokuhamba	0.75KW – 1.5KW
I-Angle Yokujikeleza	360°（Ukulawula Ugesi）
Ukulawula	Ukusebenza okuzenzakalelayo/ngesandla. Amanye amamodeli asebenzisa izinhlelo zokulawula ze-CNC noma ze-PLC.
Izinga Lokushisa Elisebenzayo Elivunyelwe	-15℃ ~ +40℃

Sithumelele i-imeyili

Izici

Umdwebo Oningiliziwe

Ukubuka Konke Kwemishini kanye Nenani Eliyinhloko

Umshini Wokusika Izintambo uwumshini wokusika ngokunemba osebenzisa ucingo lwedayimane oluhamba ngesivinini esikhulu. Wakha ithuluzi lokusika eliguquguqukayo ngokufaka ama-abrasives edayimane ocingweni lwensimbi ngokusebenzisa i-electroplating noma i-resin bonding, okuvumela ukucutshungulwa okuphumelelayo kwezinto zokuqina okuphezulu kanye nokuqhekeka okuphezulu. Inani lawo eliyinhloko lisekufinyeleleni ukusika okunembile kakhulu, okunomonakalo omncane, ngenkathi kuthuthukiswa kakhulu ukusetshenziswa kwezinto kanye nokusebenza kahle kokukhiqiza. Ufaneleka kakhulu ezintweni ezifana ne-sapphire, i-ceramics, kanye ne-marble, okuyinselele ezindleleni zokucubungula zendabuko.

Izici Zokucubungula Izinto Neziqondiso Zokusebenzisa

Ubukhulu Besici	I-Sapphire	Izinto zobumba	Imabula
Izici Eziyinhloko	Ubulukhuni obuphezulu kakhulu (Mohs 9), ukuphuka okuphezulu	Ubulukhuni obuphezulu, ukucasuka okuphezulu, i-modulus ephezulu yokunwebeka	Izinto ezingalingani, ziqukethe amaphuzu aqinile njenge-quartz
Izinselele Zokucubungula	Ithambekele ekuqhekekeni nasekuqhekekeni konqenqema	Indawo yokusika evame ukuba nemifantu emincane	Ithambekele ekusikeni okungalingani kanye nokuqhekeka komphetho
Amamethrikhi Abalulekile	Ubulukhuni bomphezulu bungalawulwa ku-Ra < 0.5μm	Ukuphishekela ukusika ubuqotho bomphezulu, ukunciphisa imifantu emincane	Ukusebenza kahle kokusika, indawo eyisicaba yeslab
Iziqondiso Zokusebenza Eziyinhloko	Izisekelo ze-LED, amapuleti efasitela abonakalayo, izisekelo zedivayisi ye-semiconductor	Izinto zokuhlobisa ze-ceramic ze-elekthronikhi, izinto zokupakisha, izinto zokuhlobisa ze-ceramic zesakhiwo	Ama-slab okuhlobisa okwakha, ama-countertop, imisebenzi yobuciko yokubaza

Gxila kuMgomo Wokusebenza

Isimiso esiyinhloko sokusebenza kwemishini yokusaha ucingo sihilela ukusebenzisa ucingo lwensimbi olujikelezayo olufakwe izinto zokuzisusa zedayimane ezigaya izinto ngokunyakaza kwesivinini esikhulu. Ukugxila kwalesi simiso kuyahlukahluka ezintweni ezahlukene:

.I-Sapphire:Isihluthulelo sisekulawuleni okunembile kwamapharamitha okusika (njengesivinini sentambo, izinga lokuphakela, ukucindezeleka) ukuze kugwenywe ukuphuka okubuthakathaka kwezinto. Isibonelo, ukusebenzisa ucingo lwedayimane olunobubanzi obuyi-core obungu-0.7mm, ngesivinini sentambo esingu-20m/s, izinga lokuphakela elingu-0.5mm/min, kanye namandla okucindezela angu-50N, kungafinyelela indawo esikiwe enobunzima obungaphansi kuka-0.5μm.

.Izinto zobumba:Kuyadingeka ukunqoba ubulukhuni bazo obuphezulu kanye nokuqhekeka. Isenzo sokugaya sesaha lensimbi yedayimane singanciphisa ngempumelelo ukugxilisa ingqondo ngesikhathi sokusika, sinciphise ingozi yokukhiqizwa kwemifantu emincane. Indlela yaso yokucubungula ifana nokugaya, kodwa indlela yokunyakaza kwezinhlayiya eziklwebhayo iyahluka.

.Imabula:Ngenxa yokungalingani kwetshe, isaha lensimbi yedayimane kudingeka libe nekhono elihle lokuzivumelanisa nezimo kanye nekhono lokususa ama-chip. Amasaha ensimbi esivinini esiphezulu anamuhla angafinyelela isivinini sensimbi esifinyelela kumamitha angu-2000 ngomzuzu futhi angakwazi ukushintshanisa ngokuguquguqukayo amapharamitha okusika ematsheni anobunzima obuhlukahlukene ngezinhlelo ezihlakaniphile.

Izindlela Zokucubungula Eziningiliziwe Nemiphumela

Izinto	Ukusika/Ukusikwa Kwamabhulokhi	Ukusika/Ukucheba Okuphambene	Ukusika Ngezintambo Eziningi
.I-Sapphire	Umphumela:I-kerf encane (ingafinyelela ku-0.55mm), ukugoba kobuso kungalawuleka ngaphansi kwe-micrometer eyi-1, okunciphisa ngempumelelo ukulahleka kwezinto kanye nokucutshungulwa okulandelayo. .Indlela:Ukusika izingcezu zekristalu zibe yizicucu ezincane zokwenza izingcezu ze-LED, njll.	Umphumela:Isivinini sokusika esisheshayo; induku yesafire engu-2 intshi ububanzi inganqunywa emahoreni angu-0.5. Indlela:Isetshenziselwa ukunquma ama-ingot noma ukwakheka kokuqala.	.Umphumela:Ingasika izingcezu eziningi ezincane ngasikhathi sinye, ithuthukise kakhulu ukusebenza kahle kokucubungula izinto ezifana nama-wafer e-silicon; izindawo ezisikiwe zinekhwalithi enhle kanye nobukhulu obufanayo.
Izinto zobumba	.Umphumela:Indawo yokusika ecocekile, umonakalo omncane onqenqemeni, efanelekile ukulungiselela izisekelo ze-ceramic zikagesi ezinobukhulu obujwayelekile. .Indlela:Kusetshenziswa ukusika izikhala ze-ceramic zibe yizicucu ezinesimo nobukhulu obufunwayo.	.Umphumela:Ifanele ukusika izingxenye ze-ceramic ezimise okwehlukile, inikeza ukuguquguquka okuphezulu kokusika. Indlela:Ukuqedela ukukhanda noma ukusika iphrofayili yezingxenye ze-ceramic.	.Umphumela:Ifanele ukusika izingxenye ze-ceramic ezifanayo ngobuningi obukhulu, ukusebenza kahle kokukhiqiza okuphezulu. .Indlela:Ukusika ngezintambo eziningi ngesikhathi esisodwa, kufaneleka ukukhiqizwa okukhulu.
Imabula	.Umphumela:Ukusebenza kahle kokusika, indawo eyisicaba yeslabhu, ibeka isisekelo esihle sokugaya nokupholisha okulandelayo. .Indlela:Ukusika izinto ezinkulu zamabhulokhi zibe yizingcezu.	.Umphumela:Ingasetshenziswa ekwakheni amabhlogo, ukuhlukanisa amaslabhu amakhulu, ukuzivumelanisa nezidingo ezahlukene zokucubungula. .Indlela:Ukunquma noma ukunquma amatshe aqoshiwe.	.Umphumela:Ukusikwa okukodwa kungakhiqiza ama-slab amaningi amakhulu, ukusebenza kahle kokukhiqiza okuphezulu, ukufana okuhle kwe-slab, okulungele izidingo zephrojekthi enkulu.

Ithebula Lezinto Zokusika Izinsimbi Zensimbi Eziyinhloko

Igama lepharamitha	Isikali sepharamitha
Amandla Emoto Eyinhloko	11KW - 75KW
Isivinini Sentambo	0 - 40(m/s)
Ubude Bentambo Ephakeme	20 - 150m
Ukunikezwa Kwamandla	Okujwayelekile: Isigaba Esithathu, 380V, 50Hz
Amandla Enjini Yokuhamba	0.75KW - 1.5KW
I-Angle Yokujikeleza	360°（Ukulawula Ugesi）
Ukulawula	Ukusebenza okuzenzakalelayo/ngesandla. Amanye amamodeli asebenzisa izinhlelo zokulawula ze-CNC noma ze-PLC.
Izinga Lokushisa Elisebenzayo Elivunyelwe	-15℃ ~ +40℃

Ukuzibophezela Kwesevisi ye-XKH

Sizibophezele ekuhlinzekeni amakhasimende ngezixazululo ezibanzi zemishini yokusika insimbi kanye nokusekelwa kobuchwepheshe, sisebenzisa inzuzo yemboni kanye nokuhweba okuhlanganisiwe:

Imishini Eyenziwe Ngokwezifiso:Nikeza iziphakamiso zokukhetha imishini yesaha lensimbi eqondiwe kanye nokucushwa ngokusekelwe ezintweni ezithile ezicutshungulwa amakhasimende kanye nezidingo zomkhiqizo.
Usekelo Lokuthuthukisa Inqubo:Yabelana ngolwazi lwepharamitha yokusika yezinto ezahlukene ukusiza amakhasimende ekwenzeni ngcono izinqubo zokusika, ukuthuthukisa ukusebenza kahle kokusika kanye nekhwalithi yomkhiqizo.
.Ukusekelwa Kobuchwepheshe Nokuqeqeshwa:Nikeza ukuqeqeshwa kokusebenza kwemishini, ukugcinwa kwayo, kanye nokunye ukuqinisekisa ukuthi amakhasimende angayisebenzisa ngokugcwele ukusebenza kwayo.
Isiqinisekiso Esithembekile Ngemva Kokuthengisa:Misa uhlelo oluphelele lwesevisi yangemva kokuthengisa ukuze luphendule ngokushesha ezidingweni zamakhasimende, lunikeze ukwesekwa kwezingxenye ezisele kanye nezinsizakalo zokulungisa.

Imibuzo Evame Ukubuzwa Ngemishini Yokusika Insimbi

Umbuzo 1: Iyini imishini yesaha yocingo?
A1: I-wire saw iyithuluzi lokusika ngokunemba elisebenzisa i-wire eboshwe ngedayimane ehamba ngesivinini esikhulu ukuze inqume izinto eziqinile neziqhekekile njenge-sapphire, i-ceramics, kanye ne-marble ngaphandle kokulahla imfucuza.

Umbuzo 2: Yiziphi izinto ezingasikwa kahle ngesaha yocingo?
A2: Ama-wire saw afaneleka kakhulu ekucubunguleni i-sapphire, i-quartz, i-ceramics, imabula, i-silicon carbide, nezinye izinto eziqinile neziphuka kalula ngenxa yokunemba kwazo okuphezulu kanye nengozi encishisiwe yokuqhekeka.

Umbuzo 3: Uyini umehluko phakathi kokusika ngezintambo eziningi kanye nokusika ngezintambo eyodwa?
A3: Ukusika ngezintambo eziningi kusebenzisa izintambo eziningi ukusika amabhlogo amakhulu abe yizicucu eziningi ngesikhathi esisodwa, okwandisa ukusebenza kahle kokukhiqiza ngobuningi, kuyilapho ukusika ngentambo eyodwa kufaneleka ekusikeni okuncane, okwenziwe ngokwezifiso..

Umbuzo 4: Yiliphi izinga lokunemba kokusika elingafinyelelwa yi-wire saw?
A4: Ama-wire saw asebenza kahle kakhulu angafinyelela ukunemba kokusika ngaphakathi kuka-±10μm, okwenza afaneleke ekukhiqizeni ama-semiconductor wafers kanye nezingxenye ze-optical.

Umbuzo 5: Ngingayikhetha kanjani i-wire saw efanele iphrojekthi yami?
A5: Khetha ngokusekelwe ebulukhunini bezinto ezibonakalayo, ubukhulu bephrojekthi (isb., izintambo eziningi zokukhiqiza i-slab enkulu), kanye nokunemba okudingekayo, ngenkathi futhi kuqinisekiswa ukuthi umshini unikeza ukuzinza kanye nesistimu yokulawula ukucindezeleka.

Okwedlule: I-HPSI SiC Wafer ≥90% Ibanga Lokukhanya Lokudlulisa Ama-AI/AR

Olandelayo: I-sapphire boule ekhulile