Umshini wokubhoboza i-laser yetafula elincane 1000W-6000W ubuncane bokuvula okungu-0.1MM ungasetshenziswa ezintweni ze-ceramic zengilazi yensimbi
Izinto ezisebenzayo
1. Izinto zensimbi: njenge-aluminium, ithusi, i-titanium alloy, insimbi engagqwali, njll.
2. Izinto ezingezona ezensimbi: njengepulasitiki (kufaka phakathi i-polyethylene PE, i-polypropylene PP, i-polyester PET namanye amafilimu epulasitiki), ingilazi (kufaka phakathi ingilazi evamile, ingilazi ekhethekile njengengilazi emhlophe kakhulu, ingilazi ye-K9, ingilazi ye-borosilicate ephezulu, ingilazi ye-quartz, njll., kodwa ingilazi eqinisiwe ngenxa yezakhiwo zayo ezikhethekile zomzimba ayisafanele ukubhobozwa), izinto zobumba, iphepha, isikhumba njalo njalo.
3. Izinto ezihlanganisiwe: ezakhiwe ngezinto ezimbili noma ngaphezulu ezinezakhiwo ezahlukene ngezindlela zomzimba noma zamakhemikhali, ezinezakhiwo ezinhle kakhulu eziphelele.
4. Izinto ezikhethekile: Ezindaweni ezithile, imishini yokubhoboza nge-laser ingasetshenziswa futhi ukucubungula ezinye izinto ezikhethekile.
Amapharamitha okucacisa
| Igama | Idatha |
| Amandla e-laser: | 1000W-6000W |
| Ukusika ukunemba: | ±0.03MM |
| Ukuvulwa kwenani eliphansi kakhulu: | 0.1MM |
| Ubude bokusika: | 650MM×800MM |
| Ukunemba kwesimo: | ≤±0.008MM |
| Ukunemba okuphindaphindiwe: | 0.008MM |
| Ukusika igesi: | Umoya |
| Imodeli elungisiwe: | Ukubopha komphetho womoya, ukwesekwa kwe-fixture |
| Uhlelo lokushayela: | Injini yomugqa wokumiswa kwe-magnetic |
| Ukusika ukujiya | 0.01MM-3MM |
Izinzuzo zobuchwepheshe
1. Ukubhoboza okusebenzayo: Ukusetshenziswa kogongolo lwe-laser olunamandla aphezulu ekucutshungulweni okungathintani, okusheshayo, umzuzwana owodwa ukuqedela ukucutshungulwa kwezimbobo ezincane.
2. Ukunemba okuphezulu: Ngokulawula ngokunembile amandla, imvamisa yokushaya kwenhliziyo kanye nendawo yokugxila kwe-laser, umsebenzi wokubhoboza ngokunemba kwe-micron ungafinyelelwa.
3. Kusebenza kabanzi: kungacutshungulwa izinto ezahlukahlukene ezibuthakathaka, okunzima ukuzicubungula kanye nezinto ezikhethekile, njengepulasitiki, irabha, insimbi (insimbi engagqwali, i-aluminium, ithusi, i-titanium alloy, njll.), ingilazi, izinto zobumba nokunye.
4. Ukusebenza okuhlakaniphile: Umshini wokubhoboza nge-laser ufakwe uhlelo lokulawula izinombolo oluthuthukisiwe, oluhlakaniphe kakhulu futhi olulula ukuluhlanganisa nomklamo osizwa yikhompyutha kanye nohlelo lokukhiqiza olusizwa yikhompyutha ukuze kufezwe uhlelo olusheshayo kanye nokwenza ngcono indlela yokudlula nokucubungula eyinkimbinkimbi.
Izimo zokusebenza
1. Ukuhlukahluka: kungenza ukucutshungulwa kwemigodi ehlukahlukene eyinkimbinkimbi, njengemigodi eyindilinga, imigodi eyisikwele, imigodi enxantathu kanye neminye imigodi enomumo okhethekile.
2. Ikhwalithi ephezulu: Ikhwalithi yembobo iphakeme, unqenqema lubushelelezi, alunawo umuzwa onzima, futhi ukuguquguquka kuncane.
3.Ukwenza okuzenzakalelayo: Kungaqedela ukucutshungulwa kwemigodi emincane ngosayizi ofanayo wokuvula kanye nokusatshalaliswa okufanayo ngesikhathi esisodwa, futhi kusekela ukucutshungulwa kwemigodi yeqembu ngaphandle kokungenelela ngesandla.
Izici zemishini
■ Usayizi omncane wemishini, ukuxazulula inkinga yendawo encane.
■ Ukunemba okuphezulu, umgodi omkhulu ungafinyelela ku-0.005mm.
■ Imishini kulula ukuyisebenzisa futhi kulula ukuyisebenzisa.
■ Umthombo wokukhanya ungashintshwa ngokwezinto ezahlukene, futhi ukuhambisana kunamandla.
■ Indawo encane ethintekile ekushiseni, i-oxidation encane ezungeze imigodi.
Inkambu yohlelo lokusebenza
1. Imboni ye-elekthronikhi
●Ukubhoboza iBhodi Yesekethe Ephrintiwe (i-PCB):
Umshini wokugaya imigodi emincane: Usetshenziselwa ukugaya imigodi emincane enobubanzi obungaphansi kuka-0.1mm kuma-PCBS ukuze kuhlangatshezwane nezidingo zamabhodi okuxhumana aphezulu (i-HDI).
Imigodi engaboni futhi efihliwe: Umshini wokugaya imigodi engaboni futhi efihliwe kuma-PCBS anezingqimba eziningi ukuthuthukisa ukusebenza nokuhlanganiswa kwebhodi.
●Ukupakisha kwe-semiconductor:
Ukubhoboza uhlaka lwe-lead: Izimbobo eziqondile zifakwa ngomshini ohlakeni lwe-lead lwe-semiconductor ukuze kuxhunywe i-chip kusekethe yangaphandle.
Usizo lokusika i-wafer: Faka imigodi ku-wafer ukuze usize ezinqubweni ezilandelayo zokusika nokupakisha.
2. Imishini enembile
●Ukucubungula izingxenye ezincane:
Ukubhoboza imishini enembile: Ukubhoboza imigodi enembile kakhulu kumagiya amancane ukuze kusetshenziswe izinhlelo zokudlulisa imishini enembile.
Ukubhoboza izingxenye zenzwa: Umshini wokusika ama-microholes ezingxenyeni zenzwa ukuze kuthuthukiswe ukuzwela kanye nesivinini sokuphendula kwenzwa.
●Ukukhiqiza Isikhunta:
Umgodi wokupholisa isikhunta: Umshini wokupholisa isikhunta kumjovo noma isikhunta sokufaka isikhunta ukuze kusebenze kahle ukushabalalisa ukushisa kwesikhunta.
Ukucubungula imigodi yomoya: Ukulungisa imigodi emincane yomoya esikhumbeni ukuze kuncishiswe ukukhubazeka kokwakheka.
3. Amadivayisi ezokwelapha
●Izinto Zokuhlinza Ezingenasidingo:
Ukubhobozwa kwe-catheter: Ama-microholes acutshungulwa kuma-catheter okuhlinzwa angangeni kakhulu ukuze kuhanjiswe imithi noma kukhishwe amanzi.
Izingxenye ze-Endoscope: Izimbobo eziqondile zifakwa ngomshini ku-lens noma ekhanda lamathuluzi e-endoscope ukuze kuthuthukiswe ukusebenza kwethuluzi.
● Uhlelo Lokulethwa Kwemithi:
Ukubhoboza i-Microneedle array: Ukubhoboza i-microholes ku-patch yezidakamizwa noma i-microneedle array ukulawula izinga lokukhishwa kwezidakamizwa.
Ukubhoboza ama-biochip: Ama-Microhole acutshungulwa kuma-biochip ukuze kukhuliswe noma kutholakale amaseli.
4. Amadivayisi okukhanya
●Isixhumi se-fiber optic:
Ukubhoboza imigodi yokuphela kwefayibha yokukhanya: Ukufaka imigodi emincane ebusweni bokugcina besixhumi sokukhanya ukuze kuthuthukiswe ukusebenza kahle kokudlulisa isignali yokukhanya.
Umshini wokulungisa i-fiber array: Umshini wokulungisa imigodi enembile kakhulu epuletini le-fiber array ukuze kuxhunyaniswe i-optical yeziteshi eziningi.
●Isihlungi se-optical:
Ukubhoboza isihlungi: Umshini wokufaka imigoqo emincane kusihlungi se-optical ukuze kufezwe ukukhethwa kwamaza athile.
Umshini wokugaya izinto ezihlukanisayo: Umshini wokugaya izinto ezincane ezintweni ezihlukanisayo ukuze kuhlukaniswe noma kulolongwe imisebe ye-laser.
5. Ukukhiqizwa kwezimoto
●Uhlelo lokufaka uphethiloli:
Ukubhoboza umlomo womjovo: Ukucubungula imigodi emincane embotsheni yomjovo ukuze kuthuthukiswe umphumela we-atomization kaphethiloli futhi kuthuthukiswe ukusebenza kahle kokushisa.
●Ukukhiqiza inzwa:
Ukubhoboza inzwa yokucindezela: Umshini wokusika ama-microholes ku-diaphragm yenzwa yokucindezela ukuze kuthuthukiswe ukuzwela nokunemba kwenzwa.
●Ibhethri lamandla:
Ukubhoboza ama-chip e-pole yebhethri: Umshini wokugaya ama-microholes kuma-chip e-pole yebhethri ye-lithium ukuze kuthuthukiswe ukungena kwe-electrolyte kanye nokuthuthwa kwama-ion.
I-XKH inikeza uhla oluphelele lwezinsizakalo zokuma okukodwa zama-perforator amancane e-laser etafuleni, okuhlanganisa kodwa kungagcini lapho: Ukubonisana ngokuthengisa okuchwepheshile, ukwakheka kohlelo okwenziwe ngokwezifiso, ukuhlinzekwa kwemishini esezingeni eliphezulu, ukufakwa okuhle kanye nokuqaliswa, ukuqeqeshwa kokusebenza okuningiliziwe, ukuqinisekisa ukuthi amakhasimende athola ulwazi lwenkonzo olusebenza kahle kakhulu, olunembile nolungenankinga enqubweni yokubhoboza.
Umdwebo Oningiliziwe



