Umugqa Wokuzilawula Ozenzakalelayo Wokupholisha Oxhumene Nezigaba Ezine we-Silicon / Silicon Carbide (SiC) (Umugqa Wokuphatha Ohlanganisiwe We-Post-Polish)

Umugqa Wokuzenzakalela Oxhumene Nokupholisha We-Silicon / Silicon Carbide (SiC) Wafer (Umugqa Wokuphatha Ohlanganisiwe We-Post-Polish) Isithombe Esifakiwe

Incazelo emfushane:

Lo Mgqa Wokupolisha Oxhumene Nezigaba Ezine uyisisombululo esihlanganisiwe, esisemugqeni esenzelwei-post-polish / post-CMPimisebenzi yei-siliconfuthii-silicon carbide (i-SiC)ama-wafer. Akhiwe nxazonkeizithwali ze-ceramic (amapuleti e-ceramic), uhlelo luhlanganisa imisebenzi eminingi engezansi ibe umugqa owodwa ohlelekile—okusiza izinto ezincane ukunciphisa ukuphathwa ngesandla, ukuzinzisa isikhathi sokuthatha, nokuqinisa ukulawulwa kokungcola.

Sithumelele i-imeyili

Izici

Umdwebo Oningiliziwe

Umugqa Wokuzilawula Ozenzakalelayo Wokupholisha Oxhumene Nezigaba Ezine we-Silicon / Silicon Carbide (SiC) (Umugqa Wokuphatha Ohlanganisiwe We-Post-Polish)4

Ukubuka konke

Ekwenziweni kwe-semiconductor,ukuhlanzwa okuphumelelayo ngemva kwe-CMPyaziwa kabanzi njengesinyathelo esibalulekile sokunciphisa amaphutha ngaphambi kwenqubo elandelayo, kanye nezindlela ezithuthukisiwe (kufaka phakathiukuhlanza kwe-megasonic) zivame ukuxoxwa ngazo ukuthuthukisa ukusebenza kokususwa kwezinhlayiya.

Ngokuqondene ne-SiC, ikakhulukaziubulukhuni obuphezulu kanye nokungasebenzi kahle kwamakhemikhalikwenza ukupholisha kube nzima (ngokuvamile kuhlotshaniswa nesilinganiso esiphansi sokususwa kwezinto kanye nengozi ephezulu yomonakalo womphezulu/wangaphansi), okwenza ukuzenzekela okuzinzile ngemuva kokupholisha kanye nokuhlanza/ukuphatha okulawulwayo kube yigugu kakhulu.

Izinzuzo Eziyinhloko

Umugqa owodwa ohlanganisiwe osekela:

Ukuhlukaniswa nokuqoqwa kwe-wafer(ngemuva kokupholisha)
Ukugcinwa kwe-ceramic carrier buffer / isitoreji
Ukuhlanzwa kwenkampani yokuthwala izinto ze-ceramic
Ukufakwa kwe-wafer (ukunamathisela) ezithwalweni ze-ceramic
Ukusebenza okuhlanganisiwe, komugqa owodwa weAma-wafer angu-6–8 intshi

Imininingwane Yobuchwepheshe (Kusukela Kushidi Ledatha Elinikeziwe)

Ubukhulu Bemishini (L×W×H):13643 × 5030 × 2300 mm
Ukunikezwa kwamandla kagesi:I-AC 380 V, 50 Hz
Amandla Aphelele:119 kW
Ukuhlanzeka Kokufaka:0.5 μm < 50 ngayinye; 5 μm < 1 ngayinye
Ukubeka I-Flatness:≤ 2 μm

Ireferensi Yokugeleza (Kusukela Kushidi Ledatha Elinikeziwe)

Ubukhulu Bemishini (L×W×H):13643 × 5030 × 2300 mm
Ukunikezwa kwamandla kagesi:I-AC 380 V, 50 Hz
Amandla Aphelele:119 kW
Ukuhlanzeka Kokufaka:0.5 μm < 50 ngayinye; 5 μm < 1 ngayinye
Ukubeka I-Flatness:≤ 2 μm

Ukugeleza Komugqa Okuvamile

Okuphakelayo/isikhombimsebenzisi esivela endaweni yokupholisha ephezulu
Ukuhlukaniswa nokuqoqwa kwe-wafer
Ukubopha/ukugcina isithwali se-ceramic (ukuhlukanisa isikhathi sokuphatha)
Ukuhlanzwa kwenkampani yokuthwala izinto ze-ceramic
Ukufakwa kwe-wafer ezithwalweni (ngokuhlanzeka nokulawula ukuthamba)
Idluliselwe enkambisweni engezansi noma ekuphathweni kwempahla

Imibuzo Evame Ukubuzwa

UMBUZO 1: Yiziphi izinkinga ezixazululwa yilo mugqa ngokuyinhloko?
A: Kwenza kube lula ukusebenza kwe-post-polish ngokuhlanganisa ukuhlukaniswa/ukuqoqwa kwe-wafer, ukubhafa kwe-ceramic carrier, ukuhlanza i-carrier, kanye nokufakwa kwe-wafer emgqeni owodwa ohlangene wokuzenzakalelayo—kunciphisa izindawo zokuthinta ngesandla kanye nokuzinzisa isigqi sokukhiqiza.

Q2: Yiziphi izinto ze-wafer nosayizi ezisekelwayo?
A:I-Silicon ne-SiC,Amasentimitha angu-6–8ama-wafer (ngokwencazelo enikeziwe).

Umbuzo 3: Kungani ukuhlanzwa kwangemva kwe-CMP kugcizelelwa embonini?
A: Izincwadi zemboni ziqokomisa ukuthi isidingo sokuhlanza okuphumelelayo ngemva kwe-CMP sikhule saze sanciphisa ubuningi beziphambeko ngaphambi kwesinyathelo esilandelayo; izindlela ezisekelwe ku-megasonic zivame ukufundwa zokuthuthukisa ukususwa kwezinhlayiya.

Mayelana NATHI

I-XKH igxile ekuthuthukisweni kobuchwepheshe obuphezulu, ekukhiqizweni, nasekuthengisweni kwengilazi ekhethekile ye-optical kanye nezinto ezintsha zekristalu. Imikhiqizo yethu ihlinzeka nge-optical electronics, i-consumer electronics, kanye nezempi. Sinikeza izingxenye ze-optical ze-Sapphire, izembozo zelensi yeselula, i-Ceramics, i-LT, i-Silicon Carbide SIC, i-Quartz, kanye nama-semiconductor crystal wafers. Ngobuchwepheshe obunekhono kanye nemishini esezingeni eliphezulu, sihamba phambili ekucutshungulweni komkhiqizo okungewona ojwayelekile, sihlose ukuba yibhizinisi elihamba phambili lezinto ze-optoelectronic tech.