I-Silicon Carbide Ceramic Chuck ye-SiC Sapphire Si GAAs Wafer

I-Silicon Carbide Ceramic Chuck ye-SiC spapphire Si GAAs Wafer Isithombe Esifakiwe

Incazelo emfushane:

I-Silicon Carbide Ceramic Chuck iyipulatifomu esebenza kahle kakhulu eyenzelwe ukuhlolwa kwe-semiconductor, ukwenziwa kwe-wafer, kanye nezinhlelo zokusebenza zokubopha. Yakhiwe ngezinto zobumba ezithuthukisiwe—kufaka phakathi i-sintered SiC (SSiC), i-reaction-bonded SiC (RSiC), i-silicon nitride, kanye ne-aluminium nitride—inikeza ukuqina okuphezulu, ukwanda okuphansi kokushisa, ukumelana okuhle kakhulu nokuguguleka, kanye nokuphila isikhathi eside kwenkonzo.

Sithumelele i-imeyili

Izici

Umdwebo Oningiliziwe

Ukubuka konke kwe-Silicon Carbide (SiC) Ceramic Chuck

II-Silicon Carbide Ceramic Chuckiyipulatifomu esebenza kahle kakhulu eyenzelwe ukuhlolwa kwe-semiconductor, ukwenziwa kwe-wafer, kanye nezinhlelo zokusebenza zokubopha. Yakhiwe ngezinto zobumba ezithuthukisiwe—kufaka phakathii-SiC ehlanganisiwe (SSiC), i-SiC eboshiwe yi-reaction (RSiC), i-silicon nitride, futhii-aluminium nitride—iyanikezaukuqina okuphezulu, ukwanda okuphansi kokushisa, ukumelana okuhle kakhulu kokuguguleka, kanye nokuphila isikhathi eside kwenkonzo.

Ngobunjiniyela obunembile kanye nokupholisha kobuchwepheshe obusezingeni eliphezulu, i-chuck ilethaukuthamba kwe-sub-micron, izindawo ezisezingeni lesibuko, kanye nokuzinza kwesikhathi eside, okwenza kube yisisombululo esifanele sezinqubo ezibalulekile ze-semiconductor.

Izinzuzo Eziyinhloko

Ukunemba Okuphezulu
Ukuthamba kulawulwa ngaphakathi0.3–0.5 μm, ukuqinisekisa ukuzinza kwe-wafer kanye nokunemba kwenqubo okuqhubekayo.
Ukupholisha Izibuko
ImpumeleloI-Ra 0.02 μmukugoba kobuso, ukunciphisa imihuzuko ye-wafer kanye nokungcola—kufanele kakhulu ezindaweni ezihlanzekile kakhulu.
Ilula Kakhulu
Iqinile kodwa ilula kune-quartz noma i-metal substrates, ithuthukisa ukulawula ukunyakaza, ukuphendula, kanye nokunemba kokubeka.
Ukuqina Okuphezulu
I-Exceptional Young's modulus iqinisekisa ukuzinza kobukhulu ngaphansi kwemithwalo esindayo kanye nokusebenza ngesivinini esikhulu.
Ukwanda Okuphansi Kokushisa
I-CTE ifana kakhulu nama-wafer e-silicon, inciphisa ukucindezeleka kokushisa futhi ithuthukise ukuthembeka kwenqubo.
Ukumelana Okuvelele Kokugqoka
Ubulukhuni obukhulu bugcina ukuthamba nokunemba ngisho nangaphansi kokusetshenziswa isikhathi eside, okuvame kakhulu.

Inqubo Yokukhiqiza

Ukulungiselela Izinto Ezingavuthiwe
Ama-powder e-SiC ahlanzekile kakhulu anosayizi wezinhlayiya olawulwayo kanye nokungcola okuphansi kakhulu.
Ukwakha Nokuhlikihla
Amasu afana nalawaukuthulula okungenangcindezi (SSiC) or ukubopha kokusabela (RSiC)khiqiza izisekelo ze-ceramic eziminyene, ezifanayo.
Umshini Wokuchwephesha Oqondile
Ukugaya nge-CNC, ukusika nge-laser, kanye nomshini wokugaya onembile kakhulu kufinyelela ukubekezelelana okungu-±0.01 mm kanye nokulingana okungu-≤3 μm.
Ukwelashwa Okuphezulu
Ukugaya nokupholisha okunezigaba eziningi ku-Ra 0.02 μm; izembozo ezingakhethwa ziyatholakala ukuze zingagqwali noma zibe nezakhiwo zokungqubuzana ezenziwe ngokwezifiso.
Ukuhlolwa Nokulawulwa Kwekhwalithi
Ama-Interferometer kanye nabahloli bokuhluzeka baqinisekisa ukuhambisana nezincazelo zebanga le-semiconductor.

Imininingwane Yobuchwepheshe

Ipharamitha	Inani	Iyunithi
Ukuthamba	≤0.5	μm
Usayizi we-wafer	6'', 8'', 12'' (kuyatholakala ngokwezifiso)	—
Uhlobo lobuso	Uhlobo lwephinikhodi / Uhlobo lwendandatho	—
Ukuphakama kwephinikhodi	0.05–0.2	mm
Ububanzi obuncane bephini	ϕ0.2	mm
Isikhala esincane sephini	3	mm
Ububanzi obuncane bendandatho yesivalo	0.7	mm
Ubulukhuni bomphezulu	I-Ra 0.02	μm
Ukubekezelela ukujiya	±0.01	mm
Ukubekezelelana kobubanzi	±0.01	mm
Ukubekezelelana kokuhambisana	≤3	μm

Izinhlelo Eziyinhloko

Imishini yokuhlola i-wafer ye-semiconductor
Izinhlelo zokukhiqiza nokudlulisa ama-wafer
Amathuluzi okubopha nokupakisha i-wafer
Ukukhiqizwa kwamadivayisi e-optoelectronic okuthuthukisiwe
Amathuluzi okunemba adinga izindawo ezisicaba kakhulu nezihlanzekile kakhulu

Imibuzo Nezimpendulo – I-Silicon Carbide Ceramic Chuck

Q1: Ama-chuck e-SiC ceramic aqhathaniswa kanjani nama-chuck e-quartz noma ensimbi?
A1: Ama-SiC chuck alula, aqinile, futhi ane-CTE eseduze nama-silicon wafers, okunciphisa ukuguquguquka kokushisa. Aphinde anikeze ukumelana nokuguguleka okuphezulu kanye nokuphila isikhathi eside.

UMBUZO 2: Yikuphi ukuthamba okungafinyelelwa?
A2: Kulawulwa ngaphakathi0.3–0.5 μm, ukuhlangabezana nezidingo eziqinile zokukhiqizwa kwe-semiconductor.

Umbuzo 3: Ingabe ubuso buzoklwebha ama-wafer?
A3: Cha—kupholishwe ngesibuko ukuzeI-Ra 0.02 μm, ukuqinisekisa ukuphathwa okungenamiklwebhe kanye nokukhiqizwa kwezinhlayiya okuncishisiwe.

Q4: Yimaphi amasayizi e-wafer asekelwayo?
A4: Osayizi abajwayelekile be6'', 8'', kanye no-12'', kanye nokwenza ngokwezifiso okutholakalayo.

Q5: Kunjani ukumelana nokushisa?
A5: Izitsha zobumba ze-SiC zinikeza ukusebenza okuhle kakhulu kwezinga lokushisa eliphezulu kanye nokuguquguquka okuncane ngaphansi kokujikeleza kokushisa.

Mayelana NATHI

I-XKH igxile ekuthuthukisweni kobuchwepheshe obuphezulu, ekukhiqizweni, nasekuthengisweni kwengilazi ekhethekile ye-optical kanye nezinto ezintsha zekristalu. Imikhiqizo yethu ihlinzeka nge-optical electronics, i-consumer electronics, kanye nezempi. Sinikeza izingxenye ze-optical ze-Sapphire, izembozo zelensi yeselula, i-Ceramics, i-LT, i-Silicon Carbide SIC, i-Quartz, kanye nama-semiconductor crystal wafers. Ngobuchwepheshe obunekhono kanye nemishini esezingeni eliphezulu, sihamba phambili ekucutshungulweni komkhiqizo okungewona ojwayelekile, sihlose ukuba yibhizinisi elihamba phambili lezinto ze-optoelectronic tech.