Kuyini Ukuqhekeka Kwe-Wafer Futhi Kungaxazululwa Kanjani?

Ukusikwa kwe-wafer kuyinqubo ebalulekile ekukhiqizweni kwe-semiconductor futhi kunomthelela oqondile kwikhwalithi yokugcina yama-chip kanye nokusebenza kwawo. Ekukhiqizweni kwangempela,ukuqhekeza i-wafer—ikakhulukaziukuqhekeza ohlangothini olungaphambilifuthiukuqhekeza ohlangothini lwangemuva— kuyiphutha elivamile nelingathi sína elinciphisa kakhulu ukusebenza kahle kokukhiqiza kanye nokukhiqiza. Ukuqhekeka akugcini nje ngokuthinta ukubukeka kwama-chip kodwa futhi kungabangela umonakalo ongenakulungiseka ekusebenzeni kwawo kagesi kanye nokuthembeka kwemishini.

Incazelo kanye nezinhlobo ze-Wafer Chipping

Ukuchofoza i-wafer kubhekisela ku-ukuqhekeka noma ukuphuka kwezinto emaphethelweni ama-chips ngesikhathi senqubo yokusikaNgokuvamile ihlukaniswa ngezigabaukuqhekeza ohlangothini olungaphambilifuthiukuqhekeza ohlangothini lwangemuva:

• Ukuqhekeka ohlangothini olungaphambilikwenzeka ebusweni obusebenzayo be-chip equkethe amaphethini wesekethe. Uma ukuqhekeka kudlulela endaweni yesekethe, kungalimaza kakhulu ukusebenza kukagesi kanye nokuthembeka kwesikhathi eside.

• Ukuqhekeka ohlangothini lwangemuvangokuvamile kwenzeka ngemva kokuncipha kwe-wafer, lapho kuvela khona ukuqhekeka emhlabathini noma ungqimba olulimele ngemuva.

Ngokombono wesakhiwo,ukuqhekeka kohlangothi lwangaphambili kuvame ukubangelwa ukuqhekeka kwezingqimba ze-epitaxial noma zobuso, ngenkathiukuqhekeka kwengxenye yangemuva kuvela ezingqimbeni zomonakalo ezakhiwe ngesikhathi sokunciphisa i-wafer nokususwa kwezinto ze-substrate.

Ukusika i-chip ohlangothini olungaphambili kungahlukaniswa ngezinhlobo ezintathu:

1. Ukuqhekeka kokuqala– ngokuvamile kwenzeka ngesikhathi sesigaba sangaphambi kokusikwa lapho kufakwa i-blade entsha, ebonakala ngomonakalo ongavamile womphetho.

2. Ukuqhekeka okuvamile (okujikelezayo)– kuvela ngokuphindaphindiwe futhi njalo ngesikhathi sokusika okuqhubekayo.

3. Ukuqhekeka okungavamile– okubangelwa ukuphuma kwe-blade, izinga lokuphakela elingafanele, ukujula kokusika ngokweqile, ukufuduka kwe-wafer, noma ukuguquka.

Izimbangela Eziyinhloko Zokuqhekeka Kwe-Wafer

1. Izimbangela Zokuqhekeka Kokuqala

• Ukunemba kokufakwa kwe-blade okunganele

• I-blade ayifakwanga kahle esimweni esiyindilinga esiphelele

• Ukuvezwa okungapheli kwezinhlamvu zedayimane

Uma i-blade ifakwa ngokuthambekela okuncane, kuvela amandla okusika angalingani. I-blade entsha engagqokwanga kahle izobonisa ukugxila okubi, okuholela ekuphambukeni kwendlela yokusika. Uma izinhlamvu zedayimane zingavezwanga ngokugcwele ngesikhathi sesigaba sokusika ngaphambi kokusika, izikhala ze-chip ezisebenzayo ziyahluleka ukwakheka, okwandisa amathuba okuqhekeka.

2. Izimbangela Zokuqhekeka Kwezikhathi Ezivamile

• Umonakalo womphezulu we-blade

• Izinhlayiya zedayimane ezinkulu kakhulu eziphumayo

• Ukunamathela kwezinhlayiya zangaphandle (i-resin, imfucumfucu yensimbi, njll.)

Ngesikhathi sokusika, ama-notch amancane angavela ngenxa yokushayisana kwe-chip. Izinhlamvu ezinkulu zedayimane eziphumayo zigxila ekucindezelekeni kwendawo, kuyilapho izinsalela noma ukungcola kwangaphandle ebusweni be-blade kungaphazamisa ukuzinza kokusika.

3. Izimbangela Zokuqhekeka Okungavamile

• Ukugijima kwe-blade kusuka ku-dynamic balance embi ngesivinini esikhulu

• Izinga lokuphakelwa elingalungile noma ukujula okukhulu kokusika

• Ukufuduka kwe-wafer noma ukuguqulwa ngesikhathi sokusika

Lezi zici ziholela emandleni okusika angazinzile kanye nokuphambuka endleleni yokusika esethiwe, okubangela ngqo ukuphuka komphetho.

4. Izimbangela Zokuqhekeka Kwangemuva

Ukuqhekeka ngemuva kuvela kakhuluukunqwabelana kokucindezeleka ngesikhathi sokuncipha kwe-wafer kanye ne-wafer warpage.

Ngesikhathi sokuncipha, kwakheka ungqimba olulimele ngemuva, oluphazamisa isakhiwo sekristalu futhi ludale ukucindezeleka kwangaphakathi. Ngesikhathi sokusika, ukukhululwa kokucindezeleka kuholela ekuqalisweni kokuqhekeka okuncane, okusakazeka kancane kancane kube ukuqhekeka okukhulu ngemuva. Njengoba ubukhulu be-wafer buncipha, ukumelana kwayo nokucindezeleka kuyancipha, futhi i-warpage iyanda—okwenza ukuqhekeka ngemuva kube nokwenzeka kakhulu.

Umthelela Wokuchipha Kuma-Chips Nakuma-Counter Measurements

Umthelela ekusebenzeni kwe-Chip

Ukucheba kunciphisa kakhuluamandla omshiniNgisho nemifantu emincane yomphetho ingaqhubeka nokwanda ngesikhathi sokupakisha noma ukusetshenziswa kwangempela, okuholela ekuqhekekeni kwama-chip kanye nokwehluleka kukagesi. Uma ukuqhekeka kohlangothi lwangaphambili kungena ezindaweni zesekethe, kulimaza ngqo ukusebenza kukagesi kanye nokuthembeka kwedivayisi isikhathi eside.

Izixazululo Ezisebenzayo Zokuqhekeza I-Wafer

1. Ukuthuthukisa Ipharamitha Yenqubo

Isivinini sokusika, izinga lokuphakelayo, kanye nokujula kokusika kufanele kulungiswe ngokuguquguqukayo ngokusekelwe endaweni ye-wafer, uhlobo lwezinto ezibonakalayo, ukujiya, kanye nenqubekela phambili yokusika ukuze kuncishiswe ukugxilisa ingqondo.
Ngokuhlanganisaumbono womshini kanye nokuqapha okusekelwe ku-AI, isimo se-blade yesikhathi sangempela kanye nokuziphatha kokuqhekeka kungatholakala futhi kucutshungulwe amapharamitha ngokuzenzakalelayo ukuze kulawulwe ngokunembile.

2. Ukugcinwa Nokuphathwa Kwemishini

Ukugcinwa njalo komshini wokudaya kubalulekile ukuqinisekisa ukuthi:

• Ukunemba kwe-Spindle

• Ukuqina kohlelo lokudlulisa

• Ukusebenza kahle kohlelo lokupholisa

Kufanele kuqaliswe uhlelo lokuqapha impilo yonke ye-blade ukuqinisekisa ukuthi ama-blade agugile kakhulu ayashintshwa ngaphambi kokuba ukwehla kokusebenza kubangele ukuqhekeka.

3. Ukukhethwa Kwe-Blade Nokwenza Kahle

Izakhiwo ze-blade ezifana ne-usayizi wezinhlamvu zedayimane, ubulukhuni besibopho, kanye nobuningi bezinhlamvubanethonya elinamandla ekuziphatheni kwe-chipping:

• Izinhlamvu ezinkulu zedayimane zandisa ukuqhekeka kwezinhlangothi zangaphambili.

• Izinhlamvu ezincane zinciphisa ukuqhekeka kodwa zinciphisa ukusebenza kahle kokusika.

• Ubuningi obuphansi bezinhlamvu kunciphisa ukuqhekeka kodwa kunciphisa isikhathi sokuphila kwamathuluzi.

• Izinto zokubopha ezithambile zinciphisa ukuqhekeka kodwa zisheshisa ukuguguleka.

Kumadivayisi asekelwe ku-silicon,usayizi wezinhlamvu zedayimane uyisici esibaluleke kakhuluUkukhetha ama-blade asezingeni eliphezulu anokuqukethwe okuncane kwezinhlamvu ezinkulu kanye nokulawula usayizi wezinhlamvu eziqinile kuvimbela ngempumelelo ukuqhekeka kwezinhlangothi zangaphambili ngenkathi kulawulwa izindleko.

4. Izindlela Zokulawula Ukuqhekeka Kwangemuva

Amasu abalulekile afaka:

• Ukuthuthukisa isivinini se-spindle

• Ukukhetha ama-abrasives edayimane acwebezelayo

• Ukusebenzisa izinto ezithambile zokubopha kanye nokuhlushwa okuphansi kokuklwebheka

• Ukuqinisekisa ukufakwa kwe-blade okunembile kanye nokudlidliza kwe-spindle okuzinzile

Isivinini sokujikeleza esiphezulu noma esiphansi kakhulu sokwandisa ingozi yokuphuka kwengemuva. Ukuthambekela kwe-blade noma ukudlidliza kwe-spindle kungabangela ukuqhekeka kwengemuva endaweni enkulu. Kuma-wafers amancane kakhulu,ukwelashwa kwangemva kokwelashwa okufana ne-CMP (Chemical Mechanical Polishing), ukugcaba okomile, kanye nokugcaba kwamakhemikhali amanzikusiza ukususa izingqimba zomonakalo ezisele, ukukhulula ukucindezeleka kwangaphakathi, ukunciphisa i-warpage, nokuthuthukisa kakhulu amandla e-chip.

5. Ubuchwepheshe Bokusika Obuthuthukisiwe

Izindlela ezintsha zokusika ngaphandle kokuthintana kanye nokunciphisa ukucindezeleka zinikeza ukuthuthukiswa okwengeziwe:

• Ukusikwa nge-laserkunciphisa ukuthintana kwemishini futhi kunciphisa ukuqhekeka ngokusebenzisa ukucubungula okunamandla aphezulu.

• Ukusika ngejethi yamanziisebenzisa amanzi anomfutho ophezulu axutshwe nezinto ezincane ezisusa umswakama, okunciphisa kakhulu ukucindezeleka kokushisa nokomshini.

Ukuqinisa Ukulawulwa Kwekhwalithi Nokuhlolwa

Kufanele kusungulwe uhlelo lokulawula ikhwalithi oluqinile kulo lonke uchungechunge lokukhiqiza—kusukela ekuhlolweni kwezinto zokusetshenziswa kuya ekuqinisekisweni komkhiqizo kokugcina. Imishini yokuhlola enembile kakhulu efanaama-microscopes optical kanye nama-microscopes e-scanning electron (SEM)kufanele isetshenziswe ukuhlola kahle ama-wafer ngemva kokuwasika, okuvumela ukutholakala kusenesikhathi nokulungiswa kwamaphutha okuqhekeka.

Isiphetho

Ukuqhekeka kwe-wafer kuyiphutha eliyinkimbinkimbi, elinezici eziningi elihilelaamapharamitha enqubo, isimo semishini, izakhiwo ze-blade, ukucindezeleka kwe-wafer, kanye nokuphathwa kwekhwalithiKuphela ngokusebenzisa ukulungiswa okuhlelekile kuzo zonke lezi zindawo lapho i-chip ingalawulwa ngempumelelo—ngaleyo ndlela ithuthukeisivuno sokukhiqiza, ukuthembeka kwe-chip, kanye nokusebenza kwedivayisi iyonke.