Singanciphisa kanjani i-wafer ibe “encane kakhulu”?
Iyini ngempela i-wafer encane kakhulu?
Ububanzi obujwayelekile bokujiya (ama-wafer angu-8″/12″ njengezibonelo)
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I-wafer ejwayelekile:600–775 μm
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I-wafer encane:150–200 μm
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I-wafer encane kakhulu:ngaphansi kuka-100 μm
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I-wafer encane kakhulu:50 μm, 30 μm, noma ngisho 10–20 μm
Kungani ama-wafer eba mancane?
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Nciphisa ukujiya kwephakeji iyonke, nciphisa ubude be-TSV, futhi wehlise ukubambezeleka kwe-RC
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Nciphisa ukumelana nokushisa futhi uthuthukise ukushabalaliswa kokushisa
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Hlangana nezidingo zomkhiqizo wokugcina wezinto ezincane kakhulu zefomu
Izingozi ezibalulekile zama-wafers amancane kakhulu
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Amandla omshini ehla kakhulu
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I-warpage enzima
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Ukuphathwa okunzima kanye nokuthuthwa
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Izakhiwo ezingaphambili zisengozini enkulu; ama-wafer avame ukuqhekeka/ukuphuka
Singanciphisa kanjani i-wafer ibe yizinga elincane kakhulu?
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I-DBG (Ukusika Ngaphambi Kokugaya)
Sika i-wafer kancane (ngaphandle kokuyisika yonke) ukuze idayisi ngayinye ichazwe kusengaphambili ngenkathi i-wafer ihlala ixhunywe ngomshini kusukela ngemuva. Bese ugaya i-wafer kusukela ngemuva ukuze unciphise ukujiya, ususe kancane kancane i-silicon engakanqunywanga esele. Ekugcineni, ungqimba lokugcina lwe-silicon oluncane luyagaywa, kuqedwe ukuminyana. -
Inqubo ye-Taiko
Nciphisa indawo ephakathi ye-wafer kuphela ngenkathi ugcina indawo yomphetho ibanzi. Uhlangothi olubanzi luhlinzeka ngokusekelwa komshini, okusiza ukunciphisa ingozi yokugoba kanye nokusingatha. -
Ukubopha kwe-wafer yesikhashana
Ukubopha kwesikhashana kuhlanganisa i-wafer ku-inkampani yesikhashana, iguqula i-wafer ebuthakathaka kakhulu, efana nefilimu ibe yiyunithi eqinile, engacutshungulwa. Isithwali sisekela i-wafer, sivikela izakhiwo zangaphambili, futhi sinciphisa ukucindezeleka kokushisa—okuvumela ukunciphisaamashumi ama-micronngenkathi isavumela izinqubo ezinamandla njengokwakheka kwe-TSV, ukufakelwa kwe-electroplating, kanye nokubopha. Ingenye yezindlela zobuchwepheshe ezibaluleke kakhulu zokufaka izinto zesimanje ze-3D.
Isikhathi sokuthunyelwe: Jan-16-2026