Singanciphisa kanjani i-wafer ibe “encane kakhulu”?

Singanciphisa kanjani i-wafer ibe “encane kakhulu”?
Iyini ngempela i-wafer encane kakhulu?

Ububanzi obujwayelekile bokujiya (ama-wafer angu-8″/12″ njengezibonelo)

  • I-wafer ejwayelekile:600–775 μm

  • I-wafer encane:150–200 μm

  • I-wafer encane kakhulu:ngaphansi kuka-100 μm

  • I-wafer encane kakhulu:50 μm, 30 μm, noma ngisho 10–20 μm

Kungani ama-wafer eba mancane?

  • Nciphisa ukujiya kwephakeji iyonke, nciphisa ubude be-TSV, futhi wehlise ukubambezeleka kwe-RC

  • Nciphisa ukumelana nokushisa futhi uthuthukise ukushabalaliswa kokushisa

  • Hlangana nezidingo zomkhiqizo wokugcina wezinto ezincane kakhulu zefomu

 

Izingozi ezibalulekile zama-wafers amancane kakhulu

  1. Amandla omshini ehla kakhulu

  2. I-warpage enzima

  3. Ukuphathwa okunzima kanye nokuthuthwa

  4. Izakhiwo ezingaphambili zisengozini enkulu; ama-wafer avame ukuqhekeka/ukuphuka

Singanciphisa kanjani i-wafer ibe yizinga elincane kakhulu?

  1. I-DBG (Ukusika Ngaphambi Kokugaya)
    Sika i-wafer kancane (ngaphandle kokuyisika yonke) ukuze idayisi ngayinye ichazwe kusengaphambili ngenkathi i-wafer ihlala ixhunywe ngomshini kusukela ngemuva. Bese ugaya i-wafer kusukela ngemuva ukuze unciphise ukujiya, ususe kancane kancane i-silicon engakanqunywanga esele. Ekugcineni, ungqimba lokugcina lwe-silicon oluncane luyagaywa, kuqedwe ukuminyana.

  2. Inqubo ye-Taiko
    Nciphisa indawo ephakathi ye-wafer kuphela ngenkathi ugcina indawo yomphetho ibanzi. Uhlangothi olubanzi luhlinzeka ngokusekelwa komshini, okusiza ukunciphisa ingozi yokugoba kanye nokusingatha.

  3. Ukubopha kwe-wafer yesikhashana
    Ukubopha kwesikhashana kuhlanganisa i-wafer ku-inkampani yesikhashana, iguqula i-wafer ebuthakathaka kakhulu, efana nefilimu ibe yiyunithi eqinile, engacutshungulwa. Isithwali sisekela i-wafer, sivikela izakhiwo zangaphambili, futhi sinciphisa ukucindezeleka kokushisa—okuvumela ukunciphisaamashumi ama-micronngenkathi isavumela izinqubo ezinamandla njengokwakheka kwe-TSV, ukufakelwa kwe-electroplating, kanye nokubopha. Ingenye yezindlela zobuchwepheshe ezibaluleke kakhulu zokufaka izinto zesimanje ze-3D.


Isikhathi sokuthunyelwe: Jan-16-2026