Ingilazi Iba Yipulatifomu Entsha Yokupakisha

Ingilazi iba ngokusheshaizinto zesikhulumiizimakethe zokugcina eziholwa yi-izikhungo zedathafuthiukuxhumana ngocingoNgaphakathi kwezikhungo zedatha, isekela izithwali ezimbili ezibalulekile zokupakisha:ukwakheka kwama-chipfuthiokokufaka/okukhiphayo okubonakalayo (I/O).

Kuyoi-coefficient ephansi yokwanda kokushisa (i-CTE)futhiizithwali zengilazi ezihambisana ne-ultraviolet ejulile (DUV)nginike amandlaukubopha okuhlanganisiwefuthiUkucubungula ngemuva kwe-wafer encane engu-300 mmukuze kube ukugeleza kokukhiqiza okujwayelekile.

Njengoba amamojula okushintsha kanye ne-accelerator ekhula ngale kobukhulu be-wafer-stepper,abathwali bephaneliseziya ngokuya zibalulekile. Imakethe yeizisekelo zeglasi eziyinhloko (i-GCS)kulindeleke ukuthi kufinyeleleAmaRandi ayizigidi ezingu-460 ngo-2030, kanye nezibikezelo ezinhle eziphakamisa ukwamukelwa okujwayelekile cishe2027–2028Okwamanje,izixhumi zengilazikulindeleke ukuthi kudluleAmaRandi ayizigidi ezingu-400ngisho nangaphansi kwezibikezelo ezilandelanayo, kanyeingxenye yokuthwala ingilazi eqinileimele imakethe yabantu abaseduzeAmaRandi ayizigidi ezingama-500.

In ukupakishwa okuthuthukisiwe, ingilazi isishintshe ekubeni yingxenye elula yabaibhizinisi leplatifomu. Ngobaizithwali zengilazi, ukukhiqizwa kwemali engenayo kuyashintsha kusukaintengo ngephaneli ngayinye to ezomnotho ngomjikelezo ngamunye, lapho inzuzo incike khonasebenzisa kabusha imijikelezo, isivuno sokukhishwa kwe-laser/UV, isivuno senqubo, futhiukunciphisa umonakalo onqenqemeniLokhu kuzuzisa abahlinzeki abakunikezayo ngendlela enamandlaAmaphothifoliyo ahlelwe nge-CTE, abahlinzeki bephakhejiukuthengisa izinqwaba ezihlanganisiwe zeisithwali + ingcina/i-LTHC + i-debond, futhiabathengisi bezindawo zokubuyisela kabushaokukhethekile ekuqinisekiseni ikhwalithi yokukhanya.

Izinkampani ezinolwazi olunzulu lwengilazi—njengeUhlelo lwe-Optik, eyaziwa ngayoabathwali abaphezulungeamajiyometri onqenqemeni aklanywe ngobunjiniyelafuthiukudluliswa okulawulwayo—zibekwe kahle kakhulu kulolu chungechunge lwenani.

Izingxenye zeglasi eziyinhloko manje zivula amandla okukhiqiza amaphaneli okubonisa abe yinzuzo ngokusebenzisaI-TGV (Nge-Glass Via), i-RDL encane (Ungqimba Lokusabalalisa Kabusha), futhiizinqubo zokwakhekaAbaholi bemakethe yilabo abakwaziyo ukusebenzisana okubalulekile:

• Ukubhoboza/ukuqopha i-TGV okukhiqiza kakhulu

• Ukugcwaliswa kwethusi okungenamsebenzi

• I-lithography yephaneli enokulungiswa okuguquguqukayo

• 2/2 µm L/S (umugqa/isikhala)ukwenza amaphethini

• Ubuchwepheshe bokuphatha amaphaneli obulawulwa yi-warp

Abathengisi be-substrate kanye ne-OSAT abasebenzisana nabakhiqizi beglasi yokubonisa bayaguqulaumthamo wendawo enkuluku-izinzuzo zezindleko zokupakisha ngezinga lephaneli.

Kusukela ku-Carrier kuya ku-Full-Fledged Platform Material

Ingilazi ishintshile kusukela ku-inkampani yesikhashanaku-ipulatifomu yezinto eziphelelengobaukupakishwa okuthuthukisiwe, ukuhambisana nezitayela ezinkulu ezifanaukuhlanganiswa kwe-chiplet, ukwenziwa kwamaphaneli, ukunqwabelanisa okuqondile, futhiukubopha okuhlanganisiwe—ngesikhathi esifanayo kuqinisa isabelomali se-oomatshini, ukushisa, futhiigumbi lokuhlanzaukusebenza.

Njengo-inkampani yenethiwekhi(kokubili i-wafer kanye nephaneli),ingilazi esobala, ephansi ye-CTEkwenzaukulungiswa okuncishisiwe kokucindezelekafuthiukukhishwa kwe-laser/UV, ukuthuthukisa isivuno se-ama-wafer angaphansi kuka-50 µm, ukugeleza kwenqubo yangemuva, futhiamaphaneli akhiwe kabusha, ngaleyo ndlela kufezwa ukusebenza kahle kwezindleko zokusetshenziswa okuningi.

Njengo-i-substrate eyinhloko yengilazi, ithatha indawo yama-cores e-organic kanye nezisekeloukukhiqizwa kwezinga lephaneli.

• Ama-TGVhlinzeka ngamandla aqinile aqondile kanye nomzila wesignali.

• I-SAP RDLisunduza imikhawulo yezintambo ku-2/2 µm.

• Izindawo ezisicaba, ezilungiseka nge-CTEnciphisa i-warpage.

• Ukubonakala okubonakalayoilungiselela i-substratei-optics ehlanganisiwe (i-CPO).
  Okwamanje,ukushabalalisa ukushisaizinselele zixazululwa ngokusebenzisaizindiza zethusi, ama-via athungiwe, amanethiwekhi okulethwa kwamandla ngemuva (BSPDN), futhiukupholisa okunezinhlangothi ezimbili.

Njengo-i-interposer yengilazi, indaba iphumelela ngaphansi kwezindlela ezimbili ezihlukene:

• Imodi yokungasebenzi, okuvumela izakhiwo ezinkulu ze-2.5D AI/HPC kanye ne-switch ezifinyelela ubuningi bezintambo kanye nokubalwa kwamaqhubu okungenakufinyelelwa yi-silicon ngezindleko ezifanayo nendawo.

• Imodi esebenzayo, ukuhlanganisaIzihlungi ze-SIW/izi-antennafuthiimisele eyenziwe ngensimbi noma amagagasi abhalwe nge-laserngaphakathi kwe-substrate, izindlela ze-RF ezigoqekayo kanye nokuhambisa i-optical I/O iye emngceleni ngokulahlekelwa okuncane.

Umbono Wemakethe kanye Nokuguquguquka Kwemboni

Ngokusho kokuhlaziywa kwakamuva okwenziwe yi-Iqembu le-Yole, izinto zeglasi seziphendukeokubalulekile ekuguqulweni kokupakisha kwe-semiconductor, eqhutshwa yimikhuba emikhulu kuubuhlakani bokwenziwa (i-AI), ikhompyutha esebenza kahle kakhulu (i-HPC), Ukuxhumeka kwe-5G/6G, futhii-optics ehlanganisiwe (i-CPO).

Abahlaziyi bagcizelela ukuthi ingilaziizakhiwo eziyingqayizivele—kufaka phakathii-CTE ephansi, ukuzinza okuphezulu kobukhulu, futhiukubonakala okubonakalayo—yenza kube yinto ebalulekile ukuze kuhlangatshezwaneizidingo zemishini, zikagesi, nezokushisakwamaphakheji esizukulwane esilandelayo.

UYole uqhubeka aphawule ukuthiizikhungo zedathafuthiucingohlalaizinjini zokukhula eziyinhlokoukuze kusetshenziswe ingilazi emaphaketheni, kuyilaphoizimoto, ukuzivikela, futhiizinto zikagesi zabathengi ezisezingeni eliphezuluzifaka isandla esivinini esengeziwe. Le mikhakha incike kakhulu ku-ukuhlanganiswa kwe-chiplet, ukubopha okuhlanganisiwe, futhiukukhiqizwa kwezinga lephaneli, lapho ingilazi ingagcini nje ngokuthuthukisa ukusebenza kodwa futhi inciphisa izindleko eziphelele.

Ekugcineni, ukuvela kweizintambo ezintsha zokunikezela e-Asia—ikakhulukazi kuIShayina, iNingizimu Korea, kanye neJapan—ibonakala njengento ebalulekile ekhulisa umkhiqizo kanye nokuqinisauhlelo lwemvelo lomhlaba wonke lwengilazi yokupakisha ethuthukisiwe.