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Umshini Wokusika Owenziwe Ngezintambo Eziningi Zedayimane Osheshayo Oqondile Kakhulu Oqonde Phansi

Umshini Wokusika Ojikijela Phansi Osebenzisa Izintambo Eziningi Zedayimane Oshesha Kakhulu Oqondile Isithombe Esifakiwe
  • Umshini Wokusika Owenziwe Ngezintambo Eziningi Zedayimane Osheshayo Oqondile Kakhulu Oqonde Phansi
  • Umshini Wokusika Owenziwe Ngezintambo Eziningi Zedayimane Osheshayo Oqondile Kakhulu Oqonde Phansi
  • Umshini Wokusika Owenziwe Ngezintambo Eziningi Zedayimane Osheshayo Oqondile Kakhulu Oqonde Phansi

Incazelo emfushane:

Umshini wokusika i-drone wire multi-wire high-speed high-precision downward swing cutting machine uyindlela ethuthukisiwe ye-CNC eyenzelwe ukucutshungulwa ngokunembile kwezinto eziqinile neziphuka kalula. Uhlanganisa ubuchwepheshe obuhlukahlukene obusezingeni eliphezulu, okuhlanganisa ukusebenzisa i-wire ngesivinini esikhulu, ukulawula ukunyakaza okunembile kakhulu, ukusika i-multi-wire ngasikhathi sinye, kanye nokusika i-downward swing. Lo mshini ufeza ukucutshungulwa komsebenzi okukhulu ngokusebenza kahle okumangalisayo kanye nekhwalithi ephezulu.

Ngokusebenzisa ucingo lwedayimane njengendlela yokusika, umshini unikeza ukumelana nokuguguleka okuphezulu kanye nokunemba kokusika uma kuqhathaniswa nezindlela zokusika zendabuko. Umklamo wawo wezintambo eziningi wenza kube lula ukusika izingxenye eziningi zomsebenzi ngasikhathi sinye, okuthuthukisa kakhulu umkhiqizo ngenkathi kunciphisa izindleko zokukhiqiza. Ukunyakaza kokwehla kusabalalisa amandla okusika ngokulinganayo, kunciphisa amaphutha ebusweni kanye nemifantu emincane, okuholela ezindaweni zokusika ezibushelelezi nezihlanzekile.


Izici

Umdwebo Oningiliziwe

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i-pc207127263-idayimane_ucingo_oluningi_isivinini_esiphezulu_ukunemba_okwehla_okushintshayo_umshini_wokusika_oshintshayo_umshini_wokusika_2

Ngenisa

Umshini wokusika i-drone wire multi-wire high-speed high-precision downward swing cutting machine uyindlela ethuthukisiwe ye-CNC eyenzelwe ukucutshungulwa ngokunembile kwezinto eziqinile neziphuka kalula. Uhlanganisa ubuchwepheshe obuhlukahlukene obusezingeni eliphezulu, okuhlanganisa ukusebenzisa i-wire ngesivinini esikhulu, ukulawula ukunyakaza okunembile kakhulu, ukusika i-multi-wire ngasikhathi sinye, kanye nokusika i-downward swing. Lo mshini ufeza ukucutshungulwa komsebenzi okukhulu ngokusebenza kahle okumangalisayo kanye nekhwalithi ephezulu.

Ngokusebenzisa ucingo lwedayimane njengendlela yokusika, umshini unikeza ukumelana nokuguguleka okuphezulu kanye nokunemba kokusika uma kuqhathaniswa nezindlela zokusika zendabuko. Umklamo wawo wezintambo eziningi wenza kube lula ukusika izingxenye eziningi zomsebenzi ngasikhathi sinye, okuthuthukisa kakhulu umkhiqizo ngenkathi kunciphisa izindleko zokukhiqiza. Ukunyakaza kokwehla kusabalalisa amandla okusika ngokulinganayo, kunciphisa amaphutha ebusweni kanye nemifantu emincane, okuholela ezindaweni zokusika ezibushelelezi nezihlanzekile.

Izinzuzo Zobuchwepheshe

  • Ukusika Okusheshayo: Isivinini sokusebenza kwezintambo sifinyelela ku-2000 m/min, okunciphisa kakhulu isikhathi sokucubungula.

  • Ukunemba Okuphezulu: Ukusika ukunemba kufikela ku-0.01 mm, okuqinisekisa ukuqina okuhle kakhulu kanye nesivinini sokuvunwa.

  • Amandla Okusebenzisa Izintambo Eziningi: Umthamo wokugcina izintambo ezingamakhilomitha angama-20, osekela ukusika okukhulu okuhambisanayo.

  • Ukusika Okujikijelayo: ±8° ububanzi bokujikijela ku-0.83°/s kusabalalisa ngokulinganayo ukucindezeleka, kwandise isikhathi sokuphila kwentambo futhi kuthuthukise ikhwalithi yendawo.

  • Ukulawula Ukucindezeleka Okuguquguqukayo: Ukuqina kokusika okulungisekayo kusuka ku-10N kuya ku-60N (ukwanda okungu-0.1N), okulungisekayo ezintweni ezahlukahlukene.

  • Isakhiwo Esiqinile: Isisindo somshini esingu-8000 kg siqinisekisa ukuqina okuphezulu nokusebenza okuzinzile ngesikhathi sokusebenza isikhathi eside.

  • Uhlelo Lokulawula Oluhlakaniphile: Isixhumi esibonakalayo esisebenziseka kalula esinokusethwa kwamapharamitha, ukuqapha kwesikhathi sangempela, kanye nemisebenzi ye-alamu yamaphutha.

Izicelo Ezijwayelekile

  • Imboni ye-Photovoltaic

    • Ukusikwa kwezingotshi ze-silicon ze-monocrystalline kanye ne-polycrystalline

    • Ukukhiqizwa kwama-solar wafer asebenza kahle kakhulu

    • Kuthuthukisa ukusetshenziswa kwezinto futhi kunciphisa izindleko zokucubungula

  • Imboni Ye-semiconductor

    • Ukusikwa okunembile kwe-SiC, GaAs, Ge, kanye nezinye izingcezu ze-semiconductor wafers

    • Ukusika i-wafer enobubanzi obukhulu ukuze kwenziwe ama-chip

    • Iqinisekisa ikhwalithi ephezulu yobuso bezinqubo ze-semiconductor ezidinga kakhulu

  • Ukucutshungulwa Kwezinto Ezintsha

    • Ukusikwa kwe-sapphire substrate yezingxenye ze-LED ne-optical

    • Ukusikwa okunembile kwamakristalu okwenziwa nezinto ezisebenza ngogesi

    • Ukucutshungulwa kwe-quartz, ingilazi yobumba, nezinye izinto eziqinile

  • Ukusetshenziswa Kocwaningo Nokwelebhu

    • Ukulungiselela isampula yocwaningo lwezinto ezintsha

    • Ukuhlolwa kokusika okunembe kakhulu kweqembu elincane

    • Ukuqinisekiswa kwenqubo okuthembekile kwezinhlelo zokusebenza ze-R&D

Imininingwane Yobuchwepheshe

Ipharamitha Imininingwane
Iphrojekthi I-saw yezintambo eziningi enebhentshi lokusebenzela phezulu
Usayizi omkhulu womsebenzi ø 204*500mm
Ububanzi be-roller coating main (Buqinile kuzo zombili izinhlangothi) ø 240*510mm (amaroli amabili ayinhloko)
Isivinini sokusebenza kwezintambo 2000 (UMXUBE) m/min
Ububanzi bentambo yedayimane 0.1-0.5mm
Umthamo wokugcina umugqa wesondo lokuhambisa 20 (ububanzi bentambo yedayimane engu-0.25) km
Ububanzi bokujiya kokusika 0.1-1.0mm
Ukunemba kokusika 0.01mm
Ukuphakama okuqondile kwesiteshi sokusebenza 250mm
Indlela yokusika Izinto ziyanyakaza futhi zehle kusukela phezulu kuya phansi, kuyilapho indawo yomugqa wedayimane ingashintshi
Isivinini sokuphakelwa kokusika 0.01-10mm/min
Ithangi lamanzi 300L
Uketshezi lokusika Uketshezi lokusika olusebenza kahle kakhulu olulwa nokugqwala
Isivinini sokujika 0.83°/s
Ingcindezi yephampu yomoya 0.3-3MPa
I-engeli yokujika ±8°
Ukucindezeleka okukhulu kokusika 10N-60N (Iyunithi encane esethiwe ingu-0.1N)
Ukujula kokusika 500mm
Indawo yokusebenza 1
Ukunikezwa kwamandla kagesi I-AC380V/50Hz enezintambo ezinhlanu enezigaba ezintathu
Amandla aphelele ethuluzi lomshini ≤92kW
Injini eyinhloko (Ukupholisa ukujikeleza kwamanzi) 22*2kW
Injini yokuxhuma izintambo 1*2kW
Injini yokushintshashintsha yebhentshi lomsebenzi 1.3*1kW
Injini yokulawula ukucindezeleka (Ukupholisa ukujikeleza kwamanzi) 5.5*2kW
Injini yokukhulula nokuqoqa izintambo 15*2kW
Ubukhulu bangaphandle (ngaphandle kwebhokisi lengalo ye-rocker) 1320*2644*2840mm
Ubukhulu bangaphandle (kufaka phakathi ibhokisi lengalo ye-rocker) 1780*2879*2840mm
Isisindo somshini 8000kg

Imibuzo Evame Ukubuzwa

1. U: Iyini inzuzo yokusika ngokunyakazisa amasaha ensimbi yedayimane?

A: Ukusika okuguquguqukayo (±8°) kunciphisa ukuqhekeka kube ngaphansi kuka-15μm futhi kuthuthukisa ukuqeda kobuso (Ra<0.5μm) kwezinto ezibuthakathaka njenge-SiC ne-sapphire.

 

 

2. U: Amasaha edayimane anezintambo eziningi angasika ngokushesha kangakanani ama-wafer e-silicon?

A: Ngezintambo ezingaphezu kuka-200 ku-1-3m/s, isika ama-wafer e-silicon angu-300mm ngemizuzu engaphansi kwemi-2, okwandisa umkhiqizo ngokusaha okungu-5x uma kuqhathaniswa nokwasaha ngocingo olulodwa.

 

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  • Olandelayo:

    • Imikhiqizo Ehlobene

    Bhala umlayezo wakho lapha bese uwuthumela kithi
    Cindezela u-enter ukuze useshe noma u-ESC ukuze uvale